摘要:
A structure in a substrate for the manufacturing of a semiconductor device, wherein a first material and at least one second material are to be etched by at least one etching medium, wherein the at least one second material has a higher etch rate for the at least one etching medium relative to the first material. The at least one second material occupies a space which is at least at one side adjacent to the first material so that an additional etching access to the first material is prepared when at least one etching medium etches the first and the second material.
摘要:
A computer implemented method, an apparatus, and a computer usable program product are provided for configuring and modeling server connection and deployment information in an enterprise tooling environment. A software model is provided that comprises a connections object, which includes a plurality of connection objects and deploy spec objects. Each of the connection objects is specific to a backend server type. A deploy controller is provided at run time to examine the connections object for a connection object. A backend resource manager is loaded for a specific application server. If a connection object is present, the backend resource manager loads a connection interpreter, which transforms development time connection information in the connection object to the run time connection information in corresponding deploy spec object and connection factory spec object. The backend resource manager then writes the deployment information to the configurations files of the application server.