公开(公告)号：US4788524A

公开(公告)日：1988-11-29

申请号：US090192

申请日：1987-08-27

申请人： Thomas Ozaki

发明人： Thomas Ozaki

IPC分类号： H01C17/02 ,  H01C17/065 ,  H01C17/24 ,  H01C17/28 ,  H01C1/012

CPC分类号： H01C17/283 ,  H01C17/02 ,  H01C17/0654 ,  H01C17/24 ,  H01C17/281

摘要： A material system for manufacturing thick film resistors on a ceramic dielectric substrate is disclosed. The system includes the application and fixing of resistor terminations composed of a precious conductor material to a dielectric substrate. Resistor material is deposited over portions of the resistor terminations and to the dielectric substrate intermediate the resistor terminations. Terminal pads, conductor traces and resistor interconnections are printed on the dielectric substrate using a base conductor material. The resistor interconnections are deposited and fixed to the resistor terminations and to portions of the resistor material. The resistor material is trimmed to tolerance by kerfing the resistor material and a dielectric encapsulant is applied substantially over the resistor interconnections and resistor material.

摘要翻译： 公开了一种在陶瓷电介质基片上制造厚膜电阻的材料系统。 该系统包括将由贵重导体材料构成的电阻器端子的应用和固定到电介质基板。 电阻器材料沉积在电阻器端子的部分上并且沉积在电阻器端子之上的电介质基板上。 端子焊盘，导体迹线和电阻互连使用基底导体材料印刷在电介质基片上。 电阻器互连被沉积并固定到电阻器端子和电阻器材料的部分。 电阻材料通过切割电阻材料进行修整以使其公差，并且电介质密封剂基本上施加在电阻器互连和电阻材料上。

公开(公告)号：US4938924A

公开(公告)日：1990-07-03

申请号：US481095

申请日：1990-02-16

申请人： Thomas Ozaki

发明人： Thomas Ozaki

IPC分类号： B23K35/26 ,  H05K1/09 ,  H05K3/34

CPC分类号： H05K3/3463 ,  B23K35/262 ,  H05K1/092

摘要： Eutectic solder, including a combination of tin, lead and silver is doped by the addition of copper to substantially improve its effectiveness in soldering printed wiring cards which have been screen printed with conductors and mounting pads for components, with a low temperature, thick film cermet copper conductor. The addition of the copper substantially improves wetting and increases long term solder joint reliability.

摘要翻译： 包含锡，铅和银的组合的共晶焊料通过添加铜被掺杂，以显着提高其在已经用导电体印刷的印刷布线卡的焊接中的有效性以及用于部件的低温，厚膜金属陶瓷 铜导体。 铜的添加基本上改善了润湿性并增加了长期的焊点可靠性。

公开(公告)号：US4796356A

公开(公告)日：1989-01-10

申请号：US90193

申请日：1987-08-27

申请人： Thomas Ozaki

发明人： Thomas Ozaki

IPC分类号： H01C17/02 ,  H01C17/245 ,  H01C17/28 ,  H05K1/09 ,  H05K1/16 ,  H01C17/06

CPC分类号： H01C17/281 ,  H01C17/02 ,  H01C17/245 ,  H05K1/092 ,  H05K1/16 ,  Y10T29/49087 ,  Y10T29/49099

摘要： A process for manufacturing close tolerance thick film resistors on a ceramic dielectric substrate is disclosed. The process includes the steps of printing resistor terminations to the dielectric substrate using a precious conductor material and fixing the resistor terminations by drying and firing in air. A resistive material is next printed to portions of the resistor terminations and to the dielectric substrate intermediate the resistor terminations. The resistive material is fixed by drying and firing in air. Terminal pads, conductor traces and resistor interconnections are printed on the dielectric substrate using a base conductor material. The resistor interconnections are also printed to the resistor terminations and to portions of the resistive material. The terminal pads, conductor traces and resistor interconnections are then air dried and fired in nitrogen. The resistor material is trimmed to tolerance by kerfing the resistor material and a dielectric encapsulant is printed substantially over the resistor interconnections and resistive material. The encapsulant is cured using an infrared light source, or conventional oven.

摘要翻译： 公开了一种在陶瓷电介质基片上制造紧密厚膜电阻器的方法。 该方法包括以下步骤：使用贵重导体材料将电阻端子印刷到电介质基片上，并通过在空气中干燥和烧制来固定电阻器端子。 接下来，将电阻材料印刷到电阻器端子的部分和电阻器端子之间的电介质基板。 电阻材料通过在空气中干燥和烧制而固定。 端子焊盘，导体迹线和电阻互连使用基底导体材料印刷在电介质基片上。 电阻器互连也被印刷到电阻器端子和电阻材料的部分。 然后将端子焊盘，导体迹线和电阻器互连件空气干燥并在氮气中烧制。 电阻材料通过对电阻材料进行切割而修整为公差，并且电介质密封剂基本上印刷在电阻器互连和电阻材料上。 密封剂使用红外光源或常规烤箱固化。