公开(公告)号：US06958106B2

公开(公告)日：2005-10-25

申请号：US10409066

申请日：2003-04-09

申请人： Timothy E. Antesberger ,  John S. Kresge

发明人： Timothy E. Antesberger ,  John S. Kresge

IPC分类号： H05K3/34 ,  B31D1/02 ,  H01L21/48 ,  H01L21/60 ,  H01L23/36 ,  H05K3/00 ,  H05K3/36 ,  H05K3/38 ,  B32B31/08 ,  B32B31/18

CPC分类号： B31D1/026 ,  H01L21/4882 ,  H01L2224/73253 ,  H01L2924/01057 ,  H01L2924/01078 ,  H05K3/0058 ,  H05K3/386 ,  Y10T156/1064

摘要： A method of removing selected portions of material from a base material using a plurality of different depth cuts (e.g., using laser cutting) such that apertured sections (or segments) are expeditiously removed for eventual use with another component or otherwise. In one example, the segmented section so removed can be used to bond various elements of an electronic package which in turn can then be positioned and used within an information handling system such as a computer, server, mainframe, etc.