公开(公告)号：US06555417B2

公开(公告)日：2003-04-29

申请号：US10007579

申请日：2001-12-05

申请人： Timothy R. Spooner ,  Kieran P. Harney

发明人： Timothy R. Spooner ,  Kieran P. Harney

IPC分类号： H01L2144

CPC分类号： H01L21/6836 ,  B81C1/00888 ,  B81C1/00896 ,  H01L2221/68327

摘要： A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.

摘要翻译： 在MEMS晶片的切割期间，晶片盖保护微机电系统（“MEMS”）结构以产生单独的MEMS管芯。 制备具有多个MEMS结构位置的MEMS晶片。 在MEMS晶片上，安装晶片盖以产生层压的MEMS晶片。 晶片盖凹入与MEMS晶片上的MEMS结构位置的位置对应的区域中。 封装的MEMS晶片可以切割成多个MEMS管芯，而不会损坏或污染MEMS管芯。

公开(公告)号：US06946326B2

公开(公告)日：2005-09-20

申请号：US10006964

申请日：2001-12-05

申请人： Timothy R. Spooner ,  Kieran P. Harney ,  David S. Courage ,  John R. Martin

发明人： Timothy R. Spooner ,  Kieran P. Harney ,  David S. Courage ,  John R. Martin

IPC分类号： B81B7/00 ,  B81C1/00 ,  H01L21/68 ,  H01L21/44

CPC分类号： H01L21/6836 ,  B81C1/00888 ,  B81C1/00896 ,  H01L2221/68327

摘要： A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.

公开(公告)号：US07968807B2

公开(公告)日：2011-06-28

申请号：US11780894

申请日：2007-07-20

申请人： Timothy R. Spooner ,  Nelson Kuan

发明人： Timothy R. Spooner ,  Nelson Kuan

IPC分类号： H01L23/495

CPC分类号： H01L23/49861 ,  H01L23/04 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/19041 ,  Y10T29/49128 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.

摘要翻译： 包装装置具有与盖连接以形成引线框封装的底座。 包装具有第一和第二外表面，其具有相应的第一和第二接触图案。 第一和第二接触图案基本上是电气相同的，以允许包装件垂直或水平地安装到下面的设备。

公开(公告)号：US20080205025A1

公开(公告)日：2008-08-28

申请号：US11780894

申请日：2007-07-20

申请人： Timothy R. Spooner ,  Nelson Kuan

发明人： Timothy R. Spooner ,  Nelson Kuan

IPC分类号： H05K7/18 ,  H05K3/20

CPC分类号： H01L23/49861 ,  H01L23/04 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/19041 ,  Y10T29/49128 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.

摘要翻译： 包装装置具有与盖连接以形成引线框封装的底座。 包装具有第一和第二外表面，其具有相应的第一和第二接触图案。 第一和第二接触图案基本上是电气相同的，以允许包装件垂直或水平地安装到下面的设备。

公开(公告)号：US07022546B2

公开(公告)日：2006-04-04

申请号：US10007585

申请日：2001-12-05

申请人： Timothy R. Spooner ,  David S. Courage ,  Brad Workman

发明人： Timothy R. Spooner ,  David S. Courage ,  Brad Workman

IPC分类号： H01L21/44

CPC分类号： H01L21/6836 ,  B81C1/00888 ,  B81C1/00896 ,  H01L2221/68327

摘要： A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.

公开(公告)号：US06946366B2

公开(公告)日：2005-09-20

申请号：US10006966

申请日：2001-12-05

申请人： Timothy R. Spooner ,  David S. Courage ,  Brad Workman

发明人： Timothy R. Spooner ,  David S. Courage ,  Brad Workman

IPC分类号： B81B7/00 ,  B81C1/00 ,  H01L21/68 ,  H01L21/46 ,  H01L21/50

CPC分类号： H01L21/6836 ,  B81C1/00888 ,  B81C1/00896 ,  H01L2221/68327

摘要： A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.

摘要翻译： 在MEMS晶片的切割期间，晶片盖保护微机电系统（“MEMS”）结构以产生单独的MEMS管芯。 制备具有多个MEMS结构位置的MEMS晶片。 在MEMS晶片上，安装晶片盖以产生层压的MEMS晶片。 晶片盖凹入与MEMS晶片上的MEMS结构位置的位置对应的区域中。 封装的MEMS晶片可以切割成多个MEMS管芯，而不会损坏或污染MEMS管芯。