公开(公告)号：US09294065B2

公开(公告)日：2016-03-22

申请号：US13995941

申请日：2011-12-16

申请人： Tobias Krems ,  Wolfgang Till ,  Ravi Challa

发明人： Tobias Krems ,  Wolfgang Till ,  Ravi Challa

IPC分类号： H03H7/01 ,  H03H9/64 ,  H03H9/72 ,  H03H9/60 ,  H03H9/70

CPC分类号： H03H7/0115 ,  H03H9/605 ,  H03H9/6483 ,  H03H9/706 ,  H03H9/725

摘要： A reactance filter comprising suppression in the stop band comprises an input connection for applying an input signal, an output connection for outputting an output signal, at least series resonator, which is connected in a signal path between the input connection and the output connection, a parallel resonator, which is connected between the signal path and a connection in order to apply a reference potential, and an inductor, which is connected in series to the parallel resonator. A capacitor is connected by means of one connection between the at least one parallel resonator and the inductor and by means of the additional connection to the output connection. By connecting the reactance filter as a transmission filter in a duplexer component, the isolation in the receiving band of the duplexer component can be improved.

摘要翻译： 包括在阻带中的抑制的电抗滤波器包括用于施加输入信号的输入连接，用于输出输出信号的输出连接，连接在输入连接和输出连接之间的信号路径中的至少串联谐振器， 并联谐振器，其连接在信号路径和连接之间以施加参考电位;以及电感器，其与并联谐振器串联连接。 电容器通过至少一个并联谐振器和电感器之间的一个连接并通过与输出连接的附加连接来连接。 通过将作为发送滤波器的电抗滤波器连接在双工器部件中，可以提高双工器部件的接收频带中的隔离。

公开(公告)号：US20140010122A1

公开(公告)日：2014-01-09

申请号：US13995941

申请日：2011-12-16

申请人： Tobias Krems ,  Wolfgang Till ,  Ravi Challa

发明人： Tobias Krems ,  Wolfgang Till ,  Ravi Challa

IPC分类号： H03H7/01

CPC分类号： H03H7/0115 ,  H03H9/605 ,  H03H9/6483 ,  H03H9/706 ,  H03H9/725

摘要： A reactance filter comprising suppression in the stop band comprises an input connection (1) for applying an input signal (ES), an output connection (A100) for outputting an output signal (TS), at least series resonator (11, 12, 13, 14), which is connected in a signal path (SP) between the input connection (1) and the output connection (A100), a parallel resonator (21), which is connected between the signal path (SP) and a connection (M) in order to apply a reference potential, and an inductor (31), which is connected in series to the parallel resonator (21). A capacitor (50) is connected by means of one connection (A50a) between the at least one parallel resonator (21) and the inductor (31) and by means of the additional connection (A50b) to the output connection (A100). By connecting the reactance filter as a transmission filter in a duplexer component, the isolation in the receiving band of the duplexer component can be improved.

摘要翻译： 包括阻带中的抑制的电抗滤波器包括用于施加输入信号（ES）的输入连接（1），用于输出输出信号（TS）的输出连接（A100），至少串联谐振器（11,12,13 ，14），其连接在输入连接（1）和输出连接（A100）之间的信号路径（SP）中，并联谐振器（21），其连接在信号路径（SP）和连接 M），以及施加参考电位的电感器（31）和与并联谐振器（21）串联连接的电感器（31）。 电容器（50）通过至少一个并联谐振器（21）和电感器（31）之间的一个连接（A50a）连接，并通过附加连接（A50b）连接到输出连接（A100）。 通过将作为发送滤波器的电抗滤波器连接在双工器部件中，可以提高双工器部件的接收频带中的隔离。

公开(公告)号：US20120235766A1

公开(公告)日：2012-09-20

申请号：US13331937

申请日：2011-12-20

申请人： Tobias Krems ,  Ravi Challa

发明人： Tobias Krems ,  Ravi Challa

IPC分类号： H03H9/72 ,  H03H9/64

CPC分类号： H03H9/725 ,  H03H9/0042

摘要： A surface acoustic wave filter includes an arrangement of transducers having at least one first transducer one second transducer and one third transducer. The at least one first transducer is connected to the input terminal and a terminal for applying a reference potential. The second transducer is connected to the first output terminal and the terminal for applying the reference potential. The third transducer is connected to the second output terminal and the terminal for applying the reference potential. A capacitor is connected to at least one of a first and second output terminal in such a way that the capacitor is connected between the first and second output terminals or between one of the first and second output terminals and the terminal for applying the reference potential.

摘要翻译： 表面声波滤波器包括具有至少一个第一换能器，一个第二换能器和一个第三换能器的换能器装置。 至少一个第一换能器连接到输入端子和用于施加参考电位的端子。 第二传感器连接到第一输出端子和用于施加参考电位的端子。 第三传感器连接到第二输出端子和用于施加参考电位的端子。 电容器以这样的方式连接到第一和第二输出端子中的至少一个，使得电容器连接在第一和第二输出端子之间，或者连接在第一和第二输出端子之一和用于施加参考电位的端子之间。

公开(公告)号：US09106206B2

公开(公告)日：2015-08-11

申请号：US13331937

申请日：2011-12-20

申请人： Tobias Krems ,  Ravi Challa

发明人： Tobias Krems ,  Ravi Challa

IPC分类号： H03H9/72 ,  H03H9/00

CPC分类号： H03H9/725 ,  H03H9/0042

摘要： A surface acoustic wave filter includes an arrangement of transducers having at least one first transducer one second transducer and one third transducer. The at least one first transducer is connected to the input terminal and a terminal for applying a reference potential. The second transducer is connected to the first output terminal and the terminal for applying the reference potential. The third transducer is connected to the second output terminal and the terminal for applying the reference potential. A capacitor is connected to at least one of a first and second output terminal in such a way that the capacitor is connected between the first and second output terminals or between one of the first and second output terminals and the terminal for applying the reference potential.

摘要翻译： 表面声波滤波器包括具有至少一个第一换能器，一个第二换能器和一个第三换能器的换能器装置。 至少一个第一换能器连接到输入端子和用于施加参考电位的端子。 第二传感器连接到第一输出端子和用于施加参考电位的端子。 第三传感器连接到第二输出端子和用于施加参考电位的端子。 电容器以这样的方式连接到第一和第二输出端子中的至少一个，使得电容器连接在第一和第二输出端子之间，或者连接在第一和第二输出端子之一和用于施加参考电位的端子之间。

公开(公告)号：US08022556B2

公开(公告)日：2011-09-20

申请号：US10542841

申请日：2003-12-16

申请人： Peter Selmeier ,  Tobias Krems

发明人： Peter Selmeier ,  Tobias Krems

IPC分类号： H01L23/48

CPC分类号： H03H9/6469 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H03H9/02637 ,  H03H9/02992 ,  H03H9/14594 ,  H03H9/643 ,  H03H9/6483 ,  H01L2924/00014

摘要： An electrical component includes a substrate, component structures on the substrate, and solder metal platings electrically connected to the component structures. The substrate is electrically and mechanically connected in a flip chip arrangement to a carrier via connections formed by solder bumps. The solder bumps mate to the solder metal platings. At least one of the solder bumps is on a first solder metal plating. The first solder metal plating has first and second dimensions, where the first dimension is larger than the second dimension.

摘要翻译： 电气部件包括基板，基板上的部件结构以及电连接到部件结构的焊接金属电镀。 基板通过由焊料凸块形成的连接以倒装芯片布置电连接和机械连接到载体。 焊锡凸块与焊料金属镀层配合。 至少一个焊料凸块位于第一焊料金属镀层上。 第一焊料金属镀层具有第一和第二尺寸，其中第一尺寸大于第二尺寸。

公开(公告)号：US20070029679A1

公开(公告)日：2007-02-08

申请号：US10542841

申请日：2003-12-16

申请人： Peter Selmeier ,  Tobias Krems

发明人： Peter Selmeier ,  Tobias Krems

IPC分类号： H01L23/48

CPC分类号： H03H9/6469 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H03H9/02637 ,  H03H9/02992 ,  H03H9/14594 ,  H03H9/643 ,  H03H9/6483 ,  H01L2924/00014

摘要： An electrical component having reduced substrate area is suggested, in which a substrate (S) having component structures (BS), on one surface of which solder metal platings (LA), which are electrically connected to the component structures, are positioned, is electrically and mechanically connected in a flip chip arrangement to a carrier (T) via bump connections formed by solder bumps (B). The solder bumps are seated on the solder metal platings of the substrate. At least one of the bump connections is seated on a non-round solder metal plating, which has a relatively small dimension along a first axis and a larger dimension along a second axis positioned transversely thereto.

摘要翻译： 提出了具有减小的衬底面积的电气部件，其中在其一个表面上具有组件结构（BS）的衬底（S）在其一个表面上与组件结构电连接的焊料金属电镀（LA）被定位， 并且通过由焊料凸块（B）形成的凸点连接以倒装芯片装置机械地连接到载体（T）。 焊料凸点位于衬底的焊料金属镀层上。 凸块连接中的至少一个位于非圆形焊料金属电镀上，该非金属焊料金属镀层沿着第一轴具有相对较小的尺寸，沿着横向于其的第二轴具有较大的尺寸。