公开(公告)号：US20110149518A1

公开(公告)日：2011-06-23

申请号：US12641821

申请日：2009-12-18

申请人： Todd R. Salamon ,  Paul R. Kolodner

发明人： Todd R. Salamon ,  Paul R. Kolodner

IPC分类号： H05K7/20

CPC分类号： H05K7/20545 ,  H05K7/20454 ,  H05K7/20672

摘要： An electronics module designed to efficiently remove heat from enclosed circuit boards via one or more configurable heat conduits. Each heat conduit is custom-configured to provide good thermal contact between the corresponding heat-generating electronic device of an enclosed circuit board and the clamshell housing that encloses the circuit board. Good thermal contact between the clamshell housing and the outer case of the electronic module facilitates efficient heat transfer to the finned exterior surface of the outer case, where the heat is dissipated into the ambient environment via thermal conduction, natural convection, forced convection, and/or thermal radiation. Depending on the topology of the circuit board and the individual characteristics of the electronic device to be cooled, the corresponding configurable heat conduit might be based on a nested heat-sink coupler, a fitted movable plug, or a flexible ribbon-shaped heat pipe.

摘要翻译： 电子模块设计用于通过一个或多个可配置的热导管有效地从封闭的电路板去除热量。 每个热导管被定制构造成在封闭的电路板的相应的发热电子器件与包围电路板的蛤壳式壳体之间提供良好的热接触。 蛤壳式壳体与电子模块的外壳之间的良好的热接触有助于有效地传热到外壳的翅片外表面，其中热量通过热传导，自然对流，强制对流和/ 或热辐射。 根据电路板的拓扑结构和要冷却的电子设备的各个特性，相应的可配置热导管可以基于嵌套的散热器耦合器，配合的可移动插头或柔性带状热管。

公开(公告)号：US20120279683A1

公开(公告)日：2012-11-08

申请号：US13101562

申请日：2011-05-05

申请人： Susanne Arney ,  Jen-Hau Cheng ,  John Daly ,  Domhnaill Hernon ,  Marc S. Hodes ,  Christian Joncourt ,  Paul R. Kolodner ,  Krishna-Murty Kota-Venkata ,  Alan Lyons ,  Todd R. Salamon ,  William Scofield ,  Maria E. Simon ,  Oliver Taheny

发明人： Susanne Arney ,  Jen-Hau Cheng ,  John Daly ,  Domhnaill Hernon ,  Marc S. Hodes ,  Christian Joncourt ,  Paul R. Kolodner ,  Krishna-Murty Kota-Venkata ,  Alan Lyons ,  Todd R. Salamon ,  William Scofield ,  Maria E. Simon ,  Oliver Taheny

IPC分类号： F28F13/00 ,  B23P19/00

CPC分类号： H05K7/20681 ,  Y10T29/49826

摘要： An apparatus comprising a rack having one or more shelves, a plurality of electronics circuit boards and heat conduits and a cooler. Each board is held by one of the one or more shelves, some of the boards having a localized heat source thereon. Each heat conduit forms a heat conducting path over and adjacent to a particular one of the boards from a region adjacent to the heat source thereon to a connection zone, the zone being remote from the heat source. The cooler is located on a side of the rack and coupled to the zones such that heat is transferable from the paths to the cooler. The cooler is configured to flow a cooling fluid therein to cool localized thermal interfaces at the cooler, each interface being adjacent to and at a corresponding one of the zones.

摘要翻译： 一种装置，包括具有一个或多个架子的架子，多个电子电路板和热导管以及冷却器。 每个板由一个或多个搁板中的一个搁置，一些板上具有局部热源。 每个热导管在与其上的热源相邻的区域上的特定一个板上并邻近其形成热传导路径到连接区域，该区域远离热源。 冷却器位于机架的一侧并且连接到区域，使得热量可以从路径传递到冷却器。 冷却器构造成使其中的冷却流体流动以冷却冷却器处的局部热界面，每个界面相邻并在相应的一个区域。

公开(公告)号：US08542489B2

公开(公告)日：2013-09-24

申请号：US13101509

申请日：2011-05-05

申请人： Susanne Arney ,  Jen-Hau Cheng ,  Paul R. Kolodner ,  Krishna-Murty Kota-Venkata ,  William Scofield ,  Todd R. Salamon ,  Maria E. Simon

发明人： Susanne Arney ,  Jen-Hau Cheng ,  Paul R. Kolodner ,  Krishna-Murty Kota-Venkata ,  William Scofield ,  Todd R. Salamon ,  Maria E. Simon

IPC分类号： H05K7/20

CPC分类号： H05K7/20672 ,  H05K7/20645

摘要： An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler.

摘要翻译： 一种装置，包括具有一排搁架的搁架，每个搁架支撑电子电路板，每个电路板可从支撑一个电路板的搁板上手动移除，并在其上具有局部热源。 该装置还包括连接到机架的冷却器，并能够使形成闭环的通道周围循环冷却流体。 该设备还包括多个热导管，每个热导管位于相应的一个电路板之上，并且形成将热量从相应的一个电路板的局部热源传送到冷却器的路径。 每个热导管构造成可手动地从冷却器或电路板上拆卸，而不破坏通过冷却器的流体的循环路径。

公开(公告)号：US20120281359A1

公开(公告)日：2012-11-08

申请号：US13101509

申请日：2011-05-05

申请人： Susanne Arney ,  Jen-Hau Cheng ,  Paul R. Kolodner ,  Krishna-Murty Kota-Venkata ,  William Scofield ,  Todd R. Salamon ,  Maria E. Simon

发明人： Susanne Arney ,  Jen-Hau Cheng ,  Paul R. Kolodner ,  Krishna-Murty Kota-Venkata ,  William Scofield ,  Todd R. Salamon ,  Maria E. Simon

IPC分类号： H05K7/20 ,  B23P6/00 ,  B23P17/00

CPC分类号： H05K7/20672 ,  H05K7/20645

摘要： An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler.

摘要翻译： 一种装置，包括具有一排搁架的搁架，每个搁架支撑电子电路板，每个电路板可从支撑一个电路板的搁板上手动移除，并在其上具有局部热源。 该装置还包括连接到机架的冷却器，并能够使形成闭环的通道周围循环冷却流体。 该设备还包括多个热导管，每个热导管位于相应的一个电路板之上，并且形成将热量从相应的一个电路板的局部热源传送到冷却器的路径。 每个热导管构造成可手动地从冷却器或电路板上拆卸，而不破坏通过冷却器的流体的循环路径。

公开(公告)号：US4482424A

公开(公告)日：1984-11-13

申请号：US492433

申请日：1983-05-06

申请人： Abraham Katzir ,  Paul R. Kolodner

发明人： Abraham Katzir ,  Paul R. Kolodner

IPC分类号： H01L21/027 ,  G01N21/31 ,  G01N21/64 ,  G03F7/30 ,  H01L21/30 ,  H01L21/306

CPC分类号： G01N21/64 ,  G03F7/30 ,  G01N2021/3166 ,  G01N2201/1222

摘要： A method for lithographically fabricating devices is disclosed. In accordance with the method, a sacrificial coating material (SCM), e.g., a resist, mixed with a fluorescent material is deposited onto a substrate and then etched. SCM etching is monitored by subjecting the fluorescent material within the SCM to fluorescence-inducing energy, and detecting the resulting fluorescence. Because the fluorescent material is etched away as the SCM is etched, fluorescence intensity decreases as SCM thickness is reduced. Thus, SCM etch end point is accurately determined because etch end point corresponds to the point in time when the detected fluorescence ceases.

摘要翻译： 公开了一种用于光刻制造器件的方法。 根据该方法，将与荧光材料混合的牺牲涂层材料（SCM），例如抗蚀剂沉积在基底上，然后蚀刻。 通过对SCM内的荧光材料进行荧光诱导能量并检测所得荧光来监测SCM蚀刻。 因为当SCM被蚀刻时荧光材料被蚀刻掉，所以当SCM厚度减小时，荧光强度降低。 因此，SCM蚀刻终点被精确地确定，因为蚀刻终点对应于检测到的荧光停止的时间点。

公开(公告)号：US4819658A

公开(公告)日：1989-04-11

申请号：US65619

申请日：1987-06-30

申请人： Paul R. Kolodner

发明人： Paul R. Kolodner

IPC分类号： A61B5/01 ,  G01K11/20 ,  G01N25/72 ,  A61B5/02

CPC分类号： G01N25/72 ,  G01K11/20

摘要： A method and apparatus for measuring the temperature profile of a surface exhibiting spatial and/or temporal variations in temperature, e.g., the surface of a machine or of a biological system, is disclosed. The inventive method involves forming a layer of fluorescent material, less than about 10 .mu.m in thickness, in thermal contact with the surface. The fluorescent material is subjected to fluorescence-inducing energy, and the resulting fluorescence, which varies as the temperature of the surface varies, is detected.

摘要翻译： 公开了一种用于测量表现出空间和/或时间温度变化的表面的温度分布的方法和装置，例如机器或生物系统的表面。 本发明的方法包括在与表面热接触的情况下形成厚度小于约10μm的荧光材料层。 荧光材料经受荧光诱导能量，并且检测到随着表面温度变化而变化的所得荧光。

公开(公告)号：US4455741A

公开(公告)日：1984-06-26

申请号：US434635

申请日：1982-10-15

申请人： Paul R. Kolodner

发明人： Paul R. Kolodner

IPC分类号： G01K11/20 ,  G01N25/72 ,  H01L21/66

CPC分类号： G01K11/20 ,  G01N25/72

摘要： Solid state electronic devices are optically monitored during fabrication to detect hot spots which are indicative of faulty operation. The surface temperatures of such a device are measured by applying a fluorescent material to the device, and subsequently monitoring the temperature dependent fluorescence of the material, which is reflective of the temperature of the underlying device. Devices are accepted, rejected, or further processed in response to the monitored fluorescence.

摘要翻译： 固态电子器件在制造期间被光学监测，以检测指示故障操作的热点。 这种器件的表面温度通过将荧光材料施加到器件来测量，随后监测材料的温度依赖性荧光，其反映了下面的器件的温度。 器件被接受，拒绝或进一步处理以响应被监视的荧光。