利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

11 条记录 (耗时 0.048 秒)

    Mechanically-reattachable liquid-cooled cooling apparatus
    2.
    发明授权
    Mechanically-reattachable liquid-cooled cooling apparatus 有权
    机械可重新连接的液冷式冷却装置

    公开(公告)号：US08542489B2

    公开(公告)日：2013-09-24

    申请号：US13101509

    申请日：2011-05-05

    申请人： Susanne Arney ,  Jen-Hau Cheng ,  Paul R. Kolodner ,  Krishna-Murty Kota-Venkata ,  William Scofield ,  Todd R. Salamon ,  Maria E. Simon

    发明人： Susanne Arney ,  Jen-Hau Cheng ,  Paul R. Kolodner ,  Krishna-Murty Kota-Venkata ,  William Scofield ,  Todd R. Salamon ,  Maria E. Simon

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20672 ,  H05K7/20645

    摘要： An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler.

    摘要翻译： 一种装置，包括具有一排搁架的搁架，每个搁架支撑电子电路板，每个电路板可从支撑一个电路板的搁板上手动移除，并在其上具有局部热源。 该装置还包括连接到机架的冷却器，并能够使形成闭环的通道周围循环冷却流体。 该设备还包括多个热导管，每个热导管位于相应的一个电路板之上，并且形成将热量从相应的一个电路板的局部热源传送到冷却器的路径。 每个热导管构造成可手动地从冷却器或电路板上拆卸，而不破坏通过冷却器的流体的循环路径。

    MECHANICALLY-REATTACHABLE LIQUID-COOLED COOLING APPARATUS
    3.
    发明申请
    MECHANICALLY-REATTACHABLE LIQUID-COOLED COOLING APPARATUS 有权
    机械式可重新冷却冷却冷却装置

    公开(公告)号：US20120281359A1

    公开(公告)日：2012-11-08

    申请号：US13101509

    申请日：2011-05-05

    申请人： Susanne Arney ,  Jen-Hau Cheng ,  Paul R. Kolodner ,  Krishna-Murty Kota-Venkata ,  William Scofield ,  Todd R. Salamon ,  Maria E. Simon

    发明人： Susanne Arney ,  Jen-Hau Cheng ,  Paul R. Kolodner ,  Krishna-Murty Kota-Venkata ,  William Scofield ,  Todd R. Salamon ,  Maria E. Simon

    IPC分类号： H05K7/20 ,  B23P6/00 ,  B23P17/00

    CPC分类号： H05K7/20672 ,  H05K7/20645

    摘要： An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler.

    摘要翻译： 一种装置，包括具有一排搁架的搁架，每个搁架支撑电子电路板，每个电路板可从支撑一个电路板的搁板上手动移除，并在其上具有局部热源。 该装置还包括连接到机架的冷却器，并能够使形成闭环的通道周围循环冷却流体。 该设备还包括多个热导管，每个热导管位于相应的一个电路板之上，并且形成将热量从相应的一个电路板的局部热源传送到冷却器的路径。 每个热导管构造成可手动地从冷却器或电路板上拆卸，而不破坏通过冷却器的流体的循环路径。

    Oxidation resistane strcuture for metal insulatormetal capacitor
    4.
    发明申请
    Oxidation resistane strcuture for metal insulatormetal capacitor 失效
    用于金属绝缘电容器的氧化电阻层

    公开(公告)号：US20060216815A1

    公开(公告)日：2006-09-28

    申请号：US11215565

    申请日：2005-08-29

    申请人： Jen-Hau Cheng ,  Chun-Kai Liu

    发明人： Jen-Hau Cheng ,  Chun-Kai Liu

    IPC分类号： C12Q1/68

    CPC分类号： B01L7/525 ,  B01L3/5027 ,  B01L7/52 ,  B01L7/54 ,  B01L2200/147 ,  B01L2300/0819 ,  F25B21/02

    摘要： A method of fabricating an integral device of a biochip integrated with micro thermoelectric elements and the apparatus thereof is disclosed. The micro thermo-electric biochip includes a micro thermoelectric temperature control unit and a biochip unit, and both of the two units can be manufactured by using the fabricating method. In addition, the biochip unit can be attached to the bottom side of the micro thermo-electric temperature control unit, and it can also be integrated into the micro thermoelectric temperature control unit. Besides, the integral device includes disposable type and non-disposable type.

    摘要翻译： 公开了一种制造与微型热电元件集成的生物芯片的集成器件的方法及其装置。 微型热电生物芯片包括微电子温度控制单元和生物芯片单元，并且可以通过使用制造方法来制造两个单元。 此外，生物芯片单元可以附着在微热电温度控制单元的底侧，也可以集成到微电子温度控制单元中。 此外，整体装置包括一次性型和非一次性型。

    Method of fabricating an entegral device of a biochip intergrated with micro thermo-electric elements and the apparatus thereof
    5.
    发明授权
    Method of fabricating an entegral device of a biochip intergrated with micro thermo-electric elements and the apparatus thereof 失效
    制造与微热电元件集成的生物芯片的整体装置的方法及其装置

    公开(公告)号：US07550289B2

    公开(公告)日：2009-06-23

    申请号：US11215565

    申请日：2005-08-29

    申请人： Jen-Hau Cheng ,  Chun-Kai Liu

    发明人： Jen-Hau Cheng ,  Chun-Kai Liu

    IPC分类号： G01N15/00

    CPC分类号： B01L7/525 ,  B01L3/5027 ,  B01L7/52 ,  B01L7/54 ,  B01L2200/147 ,  B01L2300/0819 ,  F25B21/02

    摘要： A method of fabricating an integral device of a biochip integrated with micro thermo-electric elements and the apparatus thereof is disclosed. The micro thermo-electric biochip includes a micro thermo-electric temperature control unit and a biochip unit, and both of the two units can be manufactured by using the fabricating method. In addition, the biochip unit can be attached to the bottom side of the micro thermo-electric temperature control unit, and it can also be integrated into the micro thermo-electric temperature control unit. Besides, the integral device includes disposable type and non-disposable type.

    摘要翻译： 公开了一种制造与微型热电元件集成的生物芯片的整体装置的方法及其装置。 微型热电生物芯片包括微电热温度控制单元和生物芯片单元，并且可以通过使用制造方法来制造两个单元。 此外，生物芯片单元可以附着在微热电温度控制单元的底侧，也可以集成到微电热温度控制单元中。 此外，整体装置包括一次性型和非一次性型。

    Micro thermoelectric device and manufacturing method thereof
    6.
    发明授权
    Micro thermoelectric device and manufacturing method thereof 有权
    微型热电元件及其制造方法

    公开(公告)号：US08426720B2

    公开(公告)日：2013-04-23

    申请号：US10902004

    申请日：2004-07-30

    申请人： Chun-Kai Liu ,  Jen-Hau Cheng

    发明人： Chun-Kai Liu ,  Jen-Hau Cheng

    IPC分类号： H01L35/30

    CPC分类号： H01L35/34 ,  H01L35/32 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention discloses a micro thermoelectric device and manufacturing method thereof, and the manufacturing method comprises the steps of providing a substrate and depositing a barrier layer on the substrate, using the barrier layer as a mask to etch a pattern on the barrier layer to form a plurality of openings, adopting a reactive ion etching (RIE) method to remove the barrier layer and smoothing the curvature of the corner of each groove, depositing a metal conductive wire layer, coating an adhesive layer in said each groove by a surface mount technology (SMT), placing a plurality of thermoelectric materials individually into each groove, repeating steps (a) to (f) to produce another substrate, and connecting the two substrates into an aligned position.

    摘要翻译： 本发明公开了一种微电子器件及其制造方法，其制造方法包括以下步骤：使用阻挡层作为掩模，在衬底上设置衬底并沉积阻挡层，以蚀刻阻挡层上的图案，形成 多个开口，采用反应离子蚀刻（RIE）方法去除阻挡层并平滑每个凹槽的角部的曲率，沉积金属导线层，通过表面贴装技术在所述每个凹槽中涂覆粘合剂层 （SMT），将多个热电材料分别放置到每个凹槽中，重复步骤（a）至（f）以产生另一基板，并将两个基板连接到对准位置。

    FLEXIBLE THERMAL GROUND PLANE AND MANUFACTURING THE SAME
    7.
    发明申请
    FLEXIBLE THERMAL GROUND PLANE AND MANUFACTURING THE SAME 有权
    柔性热地板和制造它们

    公开(公告)号：US20110017431A1

    公开(公告)日：2011-01-27

    申请号：US12719775

    申请日：2010-03-08

    申请人： Ronggui Yang ,  Y.C. Lee ,  Victor M. Bright ,  Chen Li ,  G.P. Bud Peterson ,  Christopher Oshman ,  Bo Shi ,  Jen-Hau Cheng

    发明人： Ronggui Yang ,  Y.C. Lee ,  Victor M. Bright ,  Chen Li ,  G.P. Bud Peterson ,  Christopher Oshman ,  Bo Shi ,  Jen-Hau Cheng

    IPC分类号： F28D15/04 ,  B21D53/02

    CPC分类号： F28D15/0241 ,  B23P15/26 ,  B23P2700/09 ,  F28D15/0233 ,  F28D15/04 ,  F28D15/046 ,  H01L23/3677 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

    摘要： Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

    摘要翻译： 公开了用于柔性热接地平面的方法，装置和系统。 柔性热接地平面可以包括支撑构件。 柔性热接地平面可以包括被配置为与支撑构件联接的蒸发器区域或多个蒸发器区域。 柔性热接地平面可以包括被配置为与支撑构件联接的聚光区域或多个冷凝器区域。 蒸发器和冷凝器区域可以包括微芯片结构。 蒸发器和冷凝器区域可以包括与微芯吸附结构耦合的纳米结构结构，其中纳米结构包括纳米棒。 蒸发器和冷凝器区域可以包括与纳米棒和/或微芯片结构耦合的纳米薄膜。 一些实施方案可以包括与纳米棒和/或微芯片结构偶联的微镜。

    Micro thermoelectric device and manufacturing method thereof
    8.
    发明申请
    Micro thermoelectric device and manufacturing method thereof 有权
    微型热电元件及其制造方法

    公开(公告)号：US20050150538A1

    公开(公告)日：2005-07-14

    申请号：US10902004

    申请日：2004-07-30

    申请人： Chun-Kai Liu ,  Jen-Hau Cheng

    发明人： Chun-Kai Liu ,  Jen-Hau Cheng

    IPC分类号： H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L35/32 ,  H01L35/34 ,  H01L37/00

    CPC分类号： H01L35/34 ,  H01L35/32 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention discloses a micro thermoelectric device and manufacturing method thereof, and the manufacturing method comprises the steps of providing a substrate and depositing a barrier layer on the substrate, using the barrier layer as a mask to etch a pattern on the barrier layer to form a plurality of openings, adopting a reactive ion etching (RIE) method to remove the barrier layer and smoothing the curvature of the corner of each groove, depositing a metal conductive wire layer, coating an adhesive layer in said each groove by a surface mount technology (SMT), placing a plurality of thermoelectric materials individually into each groove, repeating steps (a) to (f) to produce another substrate, and connecting the two substrates into an aligned position.

    摘要翻译： 本发明公开了一种微电子器件及其制造方法，其制造方法包括以下步骤：使用阻挡层作为掩模，在衬底上设置衬底并沉积阻挡层，以蚀刻阻挡层上的图案，形成 多个开口，采用反应离子蚀刻（RIE）方法去除阻挡层并平滑每个凹槽的角部的曲率，沉积金属导线层，通过表面贴装技术在所述每个凹槽中涂覆粘合剂层 （SMT），将多个热电材料分别放置到每个凹槽中，重复步骤（a）至（f）以产生另一基板，并将两个基板连接到对准位置。