公开(公告)号：US20210020464A1

公开(公告)日：2021-01-21

申请号：US16930959

申请日：2020-07-16

Applicant: Tokyo Electron Limited

Inventor： Masayuki KAJIWARA ,  Katsunori ICHINO ,  Daisuke ISHIMARU ,  Takuya TAJIRI ,  Atsushi YAMAMOTO ,  Masato IMAMURA ,  Tomohiko MUTA ,  Tetsuro IRIYAMA ,  Takeaki SAKAMOTO ,  Hiroki OKAGUCHI ,  Kenji ADACHI

IPC: H01L21/67 ,  B05B9/04 ,  B05B1/30 ,  B05B15/40

Abstract: A substrate processing apparatus includes a discharge part including a nozzle configured to discharge a processing liquid onto a substrate; a liquid feeder configured to feed the processing liquid to the discharge part; a replenishment part configured to replenish the liquid feeder with the processing liquid to be fed to the discharge part; a connector including a switching valve configured to open/close a flow path between the replenishment part and the liquid feeder; a filter configured to remove foreign matters contained in the processing liquid; a replenishment preparation part configured to open the switching valve after reducing a pressure difference between the inside of the replenishment part and the liquid feeder; and a replenishment controller configured to start replenishment of the processing liquid from the replenishment part to the liquid feeder in a state in which the switching valve is opened by the replenishment preparation part.