公开(公告)号：US20150375170A1

公开(公告)日：2015-12-31

申请号：US14724922

申请日：2015-05-29

Applicant: Tokyo Electron Limited

Inventor： Masato HAYASHI ,  Toyohisa TSURUDA ,  Masayuki KAJIWARA

IPC: B01D57/02

CPC classification number: C02F1/463 ,  C02F1/461 ,  C02F1/46104 ,  C02F2103/02 ,  C02F2201/461 ,  C02F2201/4612 ,  C02F2201/4617 ,  G03F7/3007 ,  G03F7/3021

Abstract: A treatment solution supply method of supplying a treatment solution to a substrate, the method includes the steps of: applying a DC voltage to the treatment solution; detecting a potential difference between two points in the treatment solution in a state where the DC voltage is applied to the treatment solution; and increasing the DC voltage when the detected potential difference is less than a predetermined reference value.

Abstract translation: 一种将处理溶液供给到基板的处理溶液供给方法，所述方法包括以下步骤：向所述处理溶液施加DC电压; 在对所述处理溶液施加所述直流电压的状态下，检测所述处理溶液中的两点之间的电位差; 以及当检测到的电位差小于预定的参考值时增加DC电压。

公开(公告)号：US20190076763A1

公开(公告)日：2019-03-14

申请号：US16117664

申请日：2018-08-30

Applicant: Tokyo Electron Limited

Inventor： Katsunori ICHINO ,  Tsunenaga NAKASHIMA ,  Hideo FUNAKOSHI ,  Nobuaki MATSUOKA ,  Masayuki KAJIWARA

IPC: B01D36/00 ,  B01D35/26 ,  B05C5/00 ,  B05C11/10 ,  G03F7/20

Abstract: A treatment solution supply apparatus to supply a treatment solution to a treatment solution discharge unit via a supply path that is provided with a filter configured to remove foreign substances in the treatment solution and a tubephragm pump to send the treatment solution, the supply path has an opening/closing valve on an upstream side of the tubephragm pump and the filter, and a suck-back valve on a downstream side of the tubephragm pump and the filter, and includes a control unit to control at least the tubephragm pump, the opening/closing valve, and the suck-back valve, wherein the control unit performs: a control of stopping sending of the treatment solution from the tubephragm pump; and a control of suspending discharge of the treatment solution from the treatment solution discharge unit by operation of the suck-back valve, and then closing the opening/closing valve to stop the discharge.

公开(公告)号：US20210020464A1

公开(公告)日：2021-01-21

申请号：US16930959

申请日：2020-07-16

Applicant: Tokyo Electron Limited

Inventor： Masayuki KAJIWARA ,  Katsunori ICHINO ,  Daisuke ISHIMARU ,  Takuya TAJIRI ,  Atsushi YAMAMOTO ,  Masato IMAMURA ,  Tomohiko MUTA ,  Tetsuro IRIYAMA ,  Takeaki SAKAMOTO ,  Hiroki OKAGUCHI ,  Kenji ADACHI

IPC: H01L21/67 ,  B05B9/04 ,  B05B1/30 ,  B05B15/40

Abstract: A substrate processing apparatus includes a discharge part including a nozzle configured to discharge a processing liquid onto a substrate; a liquid feeder configured to feed the processing liquid to the discharge part; a replenishment part configured to replenish the liquid feeder with the processing liquid to be fed to the discharge part; a connector including a switching valve configured to open/close a flow path between the replenishment part and the liquid feeder; a filter configured to remove foreign matters contained in the processing liquid; a replenishment preparation part configured to open the switching valve after reducing a pressure difference between the inside of the replenishment part and the liquid feeder; and a replenishment controller configured to start replenishment of the processing liquid from the replenishment part to the liquid feeder in a state in which the switching valve is opened by the replenishment preparation part.