INFORMATION PROCESSING APPARATUS, STORAGE MEDIUM, AND CONTROL METHOD

    公开(公告)号:US20240012373A1

    公开(公告)日:2024-01-11

    申请号:US18218408

    申请日:2023-07-05

    CPC classification number: G05B13/044

    Abstract: An information processing apparatus includes an acquisition unit that acquires a physical sensor output value output from a plurality of physical sensors installed in a substrate processing apparatus; a prediction unit that predicts a virtual sensor output value of a virtual sensor corresponding to a prediction target physical sensor by using a statistical model or a physical model, based on a degree of similarity between the physical sensor output value and data learned by the statistical model; an abnormality determination unit that compares the physical sensor output value of the prediction target physical sensor with the virtual sensor output value of the virtual sensor, thereby determining whether an abnormality occurs in the physical sensor; and an instruction unit that switches from a control based on the physical sensor output value to a control based on the virtual sensor output value when determined that the abnormality occurs in the physical sensor.

    INFORMATION PROCESSING APPARATUS AND MONITORING METHOD

    公开(公告)号:US20210397169A1

    公开(公告)日:2021-12-23

    申请号:US17350444

    申请日:2021-06-17

    Abstract: An information processing apparatus detects an abnormality sign in a semiconductor manufacturing apparatus. The apparatus includes: a sensor data collector configured to acquire sensor waveform data with respect to a sensor value axis and a time axis measured by a semiconductor manufacturing apparatus that is executing a process according to a same recipe; a monitoring band calculator configured to calculate each monitoring band for the sensor value axis and the time axis used in a waveform monitoring method from a predetermined number or more of the sensor waveform data; and an abnormality sign detector configured to monitor a waveform of the sensor waveform data using each monitoring band for the sensor value axis and the time axis and detect an abnormality sign of the semiconductor manufacturing apparatus.

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