公开(公告)号：US20230290659A1

公开(公告)日：2023-09-14

申请号：US18180995

申请日：2023-03-09

Applicant: Tokyo Electron Limited

Inventor： Keiichi Saiki

IPC: H01L21/67

CPC classification number: H01L21/67288 ,  H01L21/67092 ,  H01L21/67259 ,  H01L21/6838

Abstract: A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution on a computer, cause a processing to be performed is provided. The processing includes acquiring displacement data of multiple points on a surface of a substrate held by a chuck; specifying a distribution of displacements of the surface based on the acquired displacement data; and determining a type of a foreign matter based on the specified distribution.

公开(公告)号：US20240006207A1

公开(公告)日：2024-01-04

申请号：US18341903

申请日：2023-06-27

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Tetsuya Maki ,  Yosuke Omori ,  Keiichi Saiki

IPC: H01L21/67 ,  H01L21/18 ,  H01L21/68 ,  H01L21/683

CPC classification number: H01L21/67259 ,  H01L21/67017 ,  H01L21/187 ,  H01L21/681 ,  H01L21/6838

Abstract: A bonding apparatus includes a first holder; a second holder; a horizontally moving unit; an elevating unit; an inclination measuring unit; and a controller. The first holder is configured to attract and hold a first substrate on a bottom surface thereof. The second holder is disposed under the first holder and configured to attract and hold a second substrate on a top surface thereof. The horizontally moving unit is configured to move the first substrate and the second substrate relative to each other in a horizontal direction. The elevating unit is configured to move the second substrate up and down between a proximate position and a spaced position. The inclination measuring unit is configured to measure an inclination of the second holder. The controller calculates a position of the second substrate in the horizontal direction based on a measurement result of the inclination measuring unit.