公开(公告)号：US20230238217A1

公开(公告)日：2023-07-27

申请号：US18156618

申请日：2023-01-19

Applicant: Tokyo Electron Limited

Inventor： Koji KOTANI ,  Eiki KAMATA ,  Taro IKEDA

IPC: H01J37/32

CPC classification number: H01J37/32238 ,  H01J37/3222

Abstract: A plasma processing apparatus includes: a processing container; a ceiling plate that constitutes a ceiling wall of the processing container, is formed of a first dielectric, and has an opening formed in the first dielectric; at least one transmissive window disposed in the opening and formed of a second dielectric having a second permittivity greater than a first permittivity of the first dielectric; and at least one electromagnetic wave supplier configured to supply electromagnetic waves toward the at least one transmissive window.