公开(公告)号：US12094737B2

公开(公告)日：2024-09-17

申请号：US16930959

申请日：2020-07-16

Applicant: Tokyo Electron Limited

Inventor： Masayuki Kajiwara ,  Katsunori Ichino ,  Daisuke Ishimaru ,  Takuya Tajiri ,  Atsushi Yamamoto ,  Masato Imamura ,  Tomohiko Muta ,  Tetsuro Iriyama ,  Takeaki Sakamoto ,  Hiroki Okaguchi ,  Kenji Adachi

IPC: H01L21/67 ,  B05B1/30 ,  B05B9/04 ,  B05B15/40

CPC classification number: H01L21/6715 ,  B05B1/30 ,  B05B9/0406 ,  B05B15/40

Abstract: A substrate processing apparatus includes a discharge part including a nozzle configured to discharge a processing liquid onto a substrate; a liquid feeder configured to feed the processing liquid to the discharge part; a replenishment part configured to replenish the liquid feeder with the processing liquid to be fed to the discharge part; a connector including a switching valve configured to open/close a flow path between the replenishment part and the liquid feeder; a filter configured to remove foreign matters contained in the processing liquid; a replenishment preparation part configured to open the switching valve after reducing a pressure difference between the inside of the replenishment part and the liquid feeder; and a replenishment controller configured to start replenishment of the processing liquid from the replenishment part to the liquid feeder in a state in which the switching valve is opened by the replenishment preparation part.