公开(公告)号：US20210078035A1

公开(公告)日：2021-03-18

申请号：US17017799

申请日：2020-09-11

Applicant: Tokyo Electron Limited

Inventor： Yusaku HASHIMOTO ,  Masatoshi KAWAKITA ,  Daiki SHIBATA

IPC: B05D1/00 ,  B05C9/14 ,  B05C5/00 ,  G03F7/16 ,  H01L21/027

Abstract: A coating method, includes: rotating a substrate at a first rotation speed while supplying a film-forming liquid to a center of a front surface of the substrate; stopping the supply of the film-forming liquid before the film-forming liquid supplied to the front surface of the substrate reaches an outer periphery of the substrate; continuing to rotate the substrate at a second rotation speed after the supply of the film-forming liquid is stopped; and supplying a cooling fluid, which is a gas-liquid mixture, to an outer peripheral portion of a rear surface of the substrate during a supply period for the substrate including at least a part of a period from a time when the supply of the film-forming liquid is stopped to a time when the rotation of the substrate at the second rotation speed is completed.

公开(公告)号：US20230407482A1

公开(公告)日：2023-12-21

申请号：US18239825

申请日：2023-08-30

Applicant: Tokyo Electron Limited

Inventor： Shogo INABA ,  Masatoshi KAWAKITA

IPC: C23C18/20 ,  C23C18/16 ,  B05C5/02

CPC classification number: C23C18/2033 ,  C23C18/2046 ,  C23C18/1692 ,  B05C5/0204 ,  B05C5/0216

Abstract: A substrate processing apparatus for forming a coating film on a peripheral edge portion including a peripheral edge of a front surface and a side surface of a substrate, includes: a substrate holder for rotatably holding the substrate; a first chemical liquid supplier for supplying a first chemical liquid onto the peripheral edge including a rear surface of the substrate; a partial removing part for removing the first chemical liquid adhering to at least a portion of the front and side surfaces; a second chemical liquid supplier for supplying a second chemical liquid for forming the coating film onto the front and side surfaces; a first chemical liquid removing part for removing the first chemical liquid remaining on the substrate to which the second chemical liquid adheres; and a controller for controlling the parts described above.

公开(公告)号：US20220371047A1

公开(公告)日：2022-11-24

申请号：US17623392

申请日：2020-06-25

Applicant: Tokyo Electron Limited

Inventor： Yusaku HASHIMOTO ,  Masatoshi KAWAKITA ,  Kosuke YOSHIHARA

IPC: B05D1/00 ,  B05B13/02 ,  B05B12/04 ,  B05D1/40

Abstract: A coating method of supplying a treatment solution to a substrate and coating the substrate with the treatment solution by a spin coating method, includes mixing a solvent for the treatment solution lower in surface tension than the treatment solution into the treatment solution concurrently with a start of supply of the treatment solution or later than the start of the supply of the treatment solution, and then supplying the treatment solution to the substrate.

公开(公告)号：US20220074053A1

公开(公告)日：2022-03-10

申请号：US17464926

申请日：2021-09-02

Applicant: Tokyo Electron Limited

Inventor： Shogo INABA ,  Masatoshi KAWAKITA

IPC: C23C18/20 ,  C23C18/16

Abstract: A substrate processing apparatus for forming a coating film on a peripheral edge portion including a peripheral edge of a front surface and a side surface of a substrate, includes: a substrate holder for rotatably holding the substrate; a first chemical liquid supplier for supplying a first chemical liquid onto the peripheral edge including a rear surface of the substrate; a partial removing part for removing the first chemical liquid adhering to at least a portion of the front and side surfaces; a second chemical liquid supplier for supplying a second chemical liquid for forming the coating film onto the front and side surfaces; a first chemical liquid removing part for removing the first chemical liquid remaining on the substrate to which the second chemical liquid adheres; and a controller for controlling the parts described above.