公开(公告)号：US20240249964A1

公开(公告)日：2024-07-25

申请号：US18417564

申请日：2024-01-19

Applicant: Tokyo Electron Limited

Inventor： Shinsuke TAKAKI ,  Seiji NAKASHIMA ,  Akihiro TERAMOTO ,  Ryo SHOBU

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67736 ,  H01L21/67161 ,  H01L21/67225 ,  H01L21/67389 ,  H01L21/6773

Abstract: A substrate processing system that performs substrate processing includes: a first processing system having one of a wet processing apparatus and a dry processing apparatus; a second processing system having the other one of the wet processing apparatus and the dry processing apparatus, wherein the first processing system includes a common stage, which is common to the first processing system and the second processing system and is configured to place thereon a container accommodating substrates before being subjected to the substrate processing, wherein the substrate processing system further includes: a first transfer system configured to transfer the substrates between the first processing system and the second processing system; and a second transfer system connected to at least the second processing system, and configured to transfer the substrates between the first processing system and the second processing system, or between another stage and the second processing system.