公开(公告)号：US20170040177A1

公开(公告)日：2017-02-09

申请号：US15304570

申请日：2015-05-18

Applicant: Tokyo Electron Limited

Inventor： Mitsuru SASAKI ,  Tatsuya MIURA ,  Toshihiro OHNO ,  Kazumune ONO ,  Shoko ENDO ,  Ryu KITAHARA

IPC: H01L21/3065 ,  H01L21/67

CPC classification number: H01L21/3065 ,  H01J37/32926 ,  H01J37/32935 ,  H01L21/67011

Abstract: A substrate processing apparatus is provided that includes a control part configured to control a substrate process in accordance with a processing procedure set in a process recipe. The process recipe is linked to a plurality of partial recipes obtained by dividing the processing procedure into functions. The control part controls the substrate process in accordance with processing procedures set in the linked plurality of partial recipes.

Abstract translation: 提供了一种基板处理装置，其包括被配置为根据在处理配方中设置的处理过程来控制基板处理的控制部。 过程配方与通过将处理过程分成功能而获得的多个部分配方相关联。 控制部件根据在多个部分配方中设定的处理程序来控制基板处理。