公开(公告)号：US20230138006A1

公开(公告)日：2023-05-04

申请号：US17978601

申请日：2022-11-01

Applicant: Tokyo Electron Limited

Inventor： Yusuke AOKI ,  Shun ITOH ,  Yoshiki FUSE

IPC: H01J37/32

Abstract: Provided is a cleaning method in a plasma processing apparatus for substrates. This cleaning method comprises: (a) forming a plasma in a chamber of the plasma processing apparatus while a substrate is not being held in place by an electrostatic chuck in the chamber; and (b) supplying voltage to the electrostatic chuck to reduce the charge on the surface of the electrostatic chuck while plasma is being formed in (a).

公开(公告)号：US20250096006A1

公开(公告)日：2025-03-20

申请号：US18964049

申请日：2024-11-29

Applicant: Tokyo Electron Limited

Inventor： Rin SASAKI ,  Masanori HOSOYA ,  Yuki CHIBA ,  Shun ITOH ,  Daisuke NISHIDE ,  Takatoshi ORUI ,  Yuto SAITO

IPC: H01L21/311 ,  H01J37/305 ,  H01J37/32

Abstract: A disclosed etching method includes (a) preparing a substrate in a chamber, (b) forming a deposit on the substrate, (c) supplying ions from a plasma generated from the process gas to the deposit to modify the deposit, and (d) etching the dielectric film by using a plasma after (c). The substrate includes a dielectric film and a mask. The deposit is supplied from a plasma generated from a process gas containing a gas component containing fluorine and carbon. A power level of a source radio frequency power in (c) is not higher than a power level of the source radio frequency power in (b). An electric bias has a level in (c) higher than a level of the electric bias in (b), or is not supplied in (b). A level of the electric bias in (d) is higher than the level of the electric bias in (c).

公开(公告)号：US20210111008A1

公开(公告)日：2021-04-15

申请号：US17060139

申请日：2020-10-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shun ITOH

IPC: H01J37/32 ,  G01N21/68 ,  B08B9/08 ,  B08B7/00

Abstract: A method of determining cleaning conditions includes: processing a substrate under a substrate processing condition in a chamber, acquiring light emission intensity data by performing cleaning of an interior of the chamber based on cleaning conditions which are different from each other; and performing a step of evaluating the cleaning conditions based on the light emission intensity data, and a step of selecting the cleaning conditions based on the evaluation of the cleaning conditions.