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公开(公告)号:US20230138006A1
公开(公告)日:2023-05-04
申请号:US17978601
申请日:2022-11-01
Applicant: Tokyo Electron Limited
Inventor: Yusuke AOKI , Shun ITOH , Yoshiki FUSE
IPC: H01J37/32
Abstract: Provided is a cleaning method in a plasma processing apparatus for substrates. This cleaning method comprises: (a) forming a plasma in a chamber of the plasma processing apparatus while a substrate is not being held in place by an electrostatic chuck in the chamber; and (b) supplying voltage to the electrostatic chuck to reduce the charge on the surface of the electrostatic chuck while plasma is being formed in (a).
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公开(公告)号:US20250096006A1
公开(公告)日:2025-03-20
申请号:US18964049
申请日:2024-11-29
Applicant: Tokyo Electron Limited
Inventor: Rin SASAKI , Masanori HOSOYA , Yuki CHIBA , Shun ITOH , Daisuke NISHIDE , Takatoshi ORUI , Yuto SAITO
IPC: H01L21/311 , H01J37/305 , H01J37/32
Abstract: A disclosed etching method includes (a) preparing a substrate in a chamber, (b) forming a deposit on the substrate, (c) supplying ions from a plasma generated from the process gas to the deposit to modify the deposit, and (d) etching the dielectric film by using a plasma after (c). The substrate includes a dielectric film and a mask. The deposit is supplied from a plasma generated from a process gas containing a gas component containing fluorine and carbon. A power level of a source radio frequency power in (c) is not higher than a power level of the source radio frequency power in (b). An electric bias has a level in (c) higher than a level of the electric bias in (b), or is not supplied in (b). A level of the electric bias in (d) is higher than the level of the electric bias in (c).
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公开(公告)号:US20210111008A1
公开(公告)日:2021-04-15
申请号:US17060139
申请日:2020-10-01
Applicant: TOKYO ELECTRON LIMITED
Inventor: Shun ITOH
Abstract: A method of determining cleaning conditions includes: processing a substrate under a substrate processing condition in a chamber, acquiring light emission intensity data by performing cleaning of an interior of the chamber based on cleaning conditions which are different from each other; and performing a step of evaluating the cleaning conditions based on the light emission intensity data, and a step of selecting the cleaning conditions based on the evaluation of the cleaning conditions.
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