公开(公告)号：US20240238848A1

公开(公告)日：2024-07-18

申请号：US18410113

申请日：2024-01-11

Applicant: Tokyo Electron Limited

Inventor： Takafumi KINOSHITA ,  Yuki ITO ,  Daisuke SAIKI ,  Tomoyuki HASHIMOTO ,  Yoshifumi AMANO ,  Kazuhiro AIURA ,  Akira FUJITA ,  Shuhei TAKAHASHI

IPC: B08B3/02 ,  H01L21/67

CPC classification number: B08B3/022 ,  H01L21/67051 ,  B08B2203/02

Abstract: A substrate processing apparatus includes a support unit, a supply unit, an annular member, a rotation unit, a cover member, and an annular flow regulation member disposed above the cover member. The annular member includes an inclined surface inclined downward toward a center of the annular member in a radial direction. The flow regulation member includes a base portion and a protrusion which faces a circumferential portion of the substrate supported on the support unit and protrudes from the base portion toward the circumferential portion of the substrate. The protrusion overlaps the support unit when viewed in a vertical direction. A lower surface of the protrusion is positioned above an upper surface of the substrate supported on the support unit and positioned below an upper surface of the annular member. An inner circumferential surface of the protrusion is inclined radially outward from an upper side to a lower side.