公开(公告)号：US20200328100A1

公开(公告)日：2020-10-15

申请号：US16838292

申请日：2020-04-02

Applicant: Tokyo Electron Limited

Inventor： Katsuhito HIROSE ,  Koichi MIYASHITA ,  Hiroshi HIROSE ,  Satoshi GOMI ,  Yasunori KUMAGAI ,  Takashi YOSHIYAMA

IPC: H01L21/67 ,  H01L21/02 ,  G05B19/418

Abstract: A processing apparatus for processing a substrate includes: a plurality of end devices; a low-level controller configured to control specific end devices among the plurality of end devices; and a module controller configured to execute a recipe for processing the substrate, to specify control steps satisfying a specific condition among a plurality of control steps of the recipe, and to transmit the specified control steps to the low-level controller, wherein the low-level controller controls the specific end devices based on the control steps received from the module controller.