公开(公告)号：US20200328100A1

公开(公告)日：2020-10-15

申请号：US16838292

申请日：2020-04-02

Applicant: Tokyo Electron Limited

Inventor： Katsuhito HIROSE ,  Koichi MIYASHITA ,  Hiroshi HIROSE ,  Satoshi GOMI ,  Yasunori KUMAGAI ,  Takashi YOSHIYAMA

IPC: H01L21/67 ,  H01L21/02 ,  G05B19/418

Abstract: A processing apparatus for processing a substrate includes: a plurality of end devices; a low-level controller configured to control specific end devices among the plurality of end devices; and a module controller configured to execute a recipe for processing the substrate, to specify control steps satisfying a specific condition among a plurality of control steps of the recipe, and to transmit the specified control steps to the low-level controller, wherein the low-level controller controls the specific end devices based on the control steps received from the module controller.

公开(公告)号：US20210305029A1

公开(公告)日：2021-09-30

申请号：US17208445

申请日：2021-03-22

Applicant: Tokyo Electron Limited

Inventor： Koichi MIYASHITA ,  Makoto HORIKAWA ,  Satoshi GOMI

IPC: H01J37/32 ,  C23C16/458 ,  C23C16/52 ,  C23C16/455 ,  C23C16/50 ,  C23C16/08 ,  C23C16/34

Abstract: According to one embodiment of the present disclosure, there is provided a substrate processing system for processing a plurality of substrates including: a processor configured to perform a process on the substrate; a transport device configured to repeatedly transport the plurality of substrates with respect to the processor; and a controller configured to control the process of the substrate in the processor, wherein the controller is configured to: execute the process based on a process recipe, which is a control program for executing the process; and set an offset time, which is a function corresponding to a number of the substrates processed by the processor or a function corresponding to a parameter equivalent to the number of the processed substrates, with respect to a step time for a step of the process recipe.

公开(公告)号：US20160307784A1

公开(公告)日：2016-10-20

申请号：US15133110

申请日：2016-04-19

Applicant: Tokyo Electron Limited

Inventor： Satoshi GOMI ,  Daisuke MORISAWA ,  Keiji OSADA

IPC: H01L21/67 ,  G05B19/418 ,  H01L21/677

CPC classification number: H01L21/67276 ,  G05B2219/45031 ,  H01L21/67745

Abstract: A substrate processing system includes a processing unit having one or more processing chambers each of which includes a mounting table configured to mount thereon a substrate and is configured to perform predetermined processing on the substrate, a loading/unloading unit configured to load/unload a substrate container accommodating a plurality of substrates, one or more transfer units configured to transfer a substrate between the loading/unloading unit and the processing chambers, and a control unit configured to control the processing unit, the loading/unloading unit and the transfer units. The control unit controls a simulated operation, which does not include the predetermined processing in the processing chamber, to be performed on a plurality of dummy substrates in parallel. The simulated operation is a simulated transfer operation of the dummy substrates and includes a operation without transferring the dummy substrates from the loading/unloading unit into the processing chamber.

Abstract translation: 一种基板处理系统，包括具有一个或多个处理室的处理单元，每个处理室包括：安装台，其被配置为在其上安装基板，并且被配置为在所述基板上执行预定处理;装载/卸载单元，被配置为加载/卸载基板 容纳多个基板的容器，配置成在装载/卸载单元和处理室之间传送基板的一个或多个传送单元，以及被配置为控制处理单元，装载/卸载单元和传送单元的控制单元。 控制单元控制在并行地对多个虚拟基板执行的不包括处理室中的预定处理的模拟操作。 模拟操作是虚拟基板的模拟传送操作，并且包括不将虚设基板从装载/卸载单元传送到处理室中的操作。