公开(公告)号：US20190252223A1

公开(公告)日：2019-08-15

申请号：US16269868

申请日：2019-02-07

Applicant: Tokyo Electron Limited

Inventor： Junya Minamida ,  Tatsuya Ito ,  Yasunori Toyoda ,  Daisuke Aoki

IPC: H01L21/67 ,  B65B55/24 ,  B65B31/04

CPC classification number: H01L21/67201 ,  B65B31/04 ,  B65B55/24

Abstract: A substrate processing apparatus includes a container carrying in/out section on which a substrate conveyance container accommodating a substrate is placed; a processing unit that performs a process on the substrate; a conveyance space through which the substrate is conveyed; a substrate conveyor that conveys the substrate between the container carrying in/out section and the processing unit through the conveyance space; a first gas supply passage that supplies an atmosphere adjusting gas to the processing unit; a first gas discharge passage that discharges the atmosphere adjusting gas from the processing unit; a circulation passage that returns the atmosphere adjusting gas flowing out from the conveyance space to the conveyance space; a second gas supply passage that supplies the atmosphere adjusting gas to a circulation system constituted by the conveyance space and the circulation passage; and a second gas discharge passage that discharges the atmosphere adjusting gas from the circulation system.