PARTICLE COLLECTING APPARATUS, PARTICLE COLLECTING METHOD, AND PARTICLE COLLECTING SYSTEM

    公开(公告)号:US20180095021A1

    公开(公告)日:2018-04-05

    申请号:US15719178

    申请日:2017-09-28

    Abstract: A particle collecting apparatus includes a cylindrical housing, a gap forming unit, a supply port and an intake port. The cylindrical housing has a closed top and an open bottom facing a target object. The gap forming unit is configured to form a gap having a predetermined distance between the bottom and the target object. The supply port is formed at the opening of the bottom in an annular shape along an inner wall of the housing and configured to supply a gas to the target object. The intake port is provided closer to a central axis of the supply port than the supply port and configured to suck particles on the target object.

    ETCHING PROCESSING APPARATUS, QUARTZ MEMBER AND PLASMA PROCESSING METHOD

    公开(公告)号:US20220020596A1

    公开(公告)日:2022-01-20

    申请号:US17305471

    申请日:2021-07-08

    Abstract: An etching processing apparatus includes a stage configured to receive a substrate, a chamber configured to contain the stage, and a plasma generator configured to generate plasma in the chamber. An annular quartz member is disposed in a space in which the plasma is generated. The annular quartz member includes a surface facing the space. A coating film covers the surface of the quartz member. The coating film is made of a material other than quartz, and has a thickness of 10 nm or more and less than 800 nm.

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