FILM FORMING METHOD AND HEAT TREATMENT APPARATUS

    公开(公告)号:US20230009720A1

    公开(公告)日:2023-01-12

    申请号:US17857914

    申请日:2022-07-05

    Abstract: A method of forming a film is performed in a heat treatment apparatus that includes a processing container, a tubular member provided in the processing container, a heater configured to heat an inside of the processing container, and a gas supply. The method includes: providing a substrate in the tubular member; adjusting a temperature inside the tubular member by the heater; and after adjusting the temperature, supplying a gas containing a film-forming gas from the gas supply into the processing container to form a film on the substrate. In the adjusting the temperature, a gas containing a heat transfer gas is supplied from the gas supply into the processing container.

    DEPOSITION METHOD AND DEPOSITION APPARATUS

    公开(公告)号:US20220389569A1

    公开(公告)日:2022-12-08

    申请号:US17804373

    申请日:2022-05-27

    Abstract: A deposition method includes preparing a substrate having an insulating film formed thereon, forming a first molybdenum film on the insulating film by supplying a molybdenum-containing gas and a reducing gas to the substrate while the substrate is heated to a first temperature, and forming a second molybdenum film on the first molybdenum film by supplying the molybdenum-containing gas and the reducing gas to the substrate while the substrate is heated to a second temperature that is higher than the first temperature.

Patent Agency Ranking