公开(公告)号：US20230268213A1

公开(公告)日：2023-08-24

申请号：US18170087

申请日：2023-02-16

Applicant: Tokyo Electron Limited

Inventor： Takafumi Tsuchiya ,  Hiromi Hara ,  Wataru Tsukinoki ,  Shuhei Goto

IPC: H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67781 ,  H01L21/67766 ,  H01L21/68707 ,  H01L21/67769

Abstract: A substrate processing system includes a carry-in/out unit in which a cassette accommodating therein multiple substrates is carried in and out; a batch processing unit configured to process a lot including the multiple substrates at once; a single-wafer processing unit configured to process the substrates one by one; a first interface unit configured to distribute the substrates to the single-wafer processing unit or the batch processing unit; and a second interface unit configured to transfer the substrates between the batch processing unit and the single-wafer processing unit. The first interface unit includes a first placement unit configured to place therein the substrates before and after being processed by the single-wafer processing unit; a second placement unit configured to place therein the substrates before being processed by the batch processing unit; and a transfer device configured to transfer the substrates to the first placement unit and the second placement unit.