公开(公告)号：US11869780B2

公开(公告)日：2024-01-09

申请号：US16126106

申请日：2018-09-10

Applicant: Tokyo Electron Limited

Inventor： Takahiro Kawazu ,  Takafumi Tsuchiya ,  Hideaki Sato ,  Hidemasa Aratake ,  Osamu Kuroda ,  Takashi Nagai ,  Jiro Harada

IPC: H01L21/06 ,  H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67086 ,  H01L21/6719 ,  H01L21/67253 ,  H01L21/67057 ,  H01L21/67173 ,  H01L21/67754

Abstract: A substrate liquid processing apparatus includes a processing liquid storage unit configured to store a processing liquid therein; a processing liquid drain unit configured to drain the processing liquid from the processing liquid storage unit; and a control unit. The control unit performs a first control in a constant concentration mode in which a concentration of the processing liquid in the processing liquid storage unit is regulated to a predetermined set concentration and a second control in a concentration changing mode in which the concentration of the processing liquid is changed. In the second control, a set concentration after concentration change is compared with a set concentration before the concentration change, and when the set concentration after the concentration change is lower, the control unit controls the processing liquid drain unit to start draining of the processing liquid.

公开(公告)号：US20170025268A1

公开(公告)日：2017-01-26

申请号：US15209136

申请日：2016-07-13

Applicant: Tokyo Electron Limited

Inventor： Hironobu Hyakutake ,  Takafumi Tsuchiya ,  Koichiro Kanzaki

IPC: H01L21/02

CPC classification number: G03F7/423 ,  H01L21/67028 ,  H01L21/67086 ,  H01L21/67253

Abstract: Disclosed is a substrate liquid processing apparatus including: a processing bath in which a processing liquid is stored; a chemical liquid component supply unit that supplies chemical liquid components; a concentration detecting unit that detects a concentration of the chemical liquid components; and a controller configured to perform a first control as a feedback control that replenishes the processing liquid with the chemical liquid components such that the concentration of the chemical liquid components contained in the processing liquid within the processing bath does not become less than a predetermined allowable lower limit, based on the concentration of the chemical liquid components detected by the concentration detecting unit. In addition, the controller performs a second control that replenishes the processing liquid with the chemical liquid components in a predetermined amount required to offset a reduction in concentration of the chemical liquid components caused by the introduction of the substrate.

Abstract translation: 公开了一种基板液体处理设备，包括：处理液，其中存储有处理液体; 提供化学液体组分的化学液体组分供应单元; 浓度检测单元，其检测所述药液成分的浓度; 以及控制器，被配置为执行作为反馈控制的第一控制，所述反馈控制用所述化学液体成分补充所述处理液体，使得包含在所述处理液中的所述处理液体中的所述化学液体成分的浓度不会变得小于预定的允许下限 基于由浓度检测单元检测到的化学液体成分的浓度。 此外，控制器进行第二控制，其中补充处理液的化学液体成分以预定量来补偿由引入基材引起的化学液体成分的浓度的降低。

公开(公告)号：US20230268213A1

公开(公告)日：2023-08-24

申请号：US18170087

申请日：2023-02-16

Applicant: Tokyo Electron Limited

Inventor： Takafumi Tsuchiya ,  Hiromi Hara ,  Wataru Tsukinoki ,  Shuhei Goto

IPC: H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67781 ,  H01L21/67766 ,  H01L21/68707 ,  H01L21/67769

Abstract: A substrate processing system includes a carry-in/out unit in which a cassette accommodating therein multiple substrates is carried in and out; a batch processing unit configured to process a lot including the multiple substrates at once; a single-wafer processing unit configured to process the substrates one by one; a first interface unit configured to distribute the substrates to the single-wafer processing unit or the batch processing unit; and a second interface unit configured to transfer the substrates between the batch processing unit and the single-wafer processing unit. The first interface unit includes a first placement unit configured to place therein the substrates before and after being processed by the single-wafer processing unit; a second placement unit configured to place therein the substrates before being processed by the batch processing unit; and a transfer device configured to transfer the substrates to the first placement unit and the second placement unit.

公开(公告)号：US11594430B2

公开(公告)日：2023-02-28

申请号：US16124529

申请日：2018-09-07

Applicant: Tokyo Electron Limited

Inventor： Takafumi Tsuchiya ,  Yuki Ishii ,  Hiroyuki Masutomi ,  Seigo Fujitsu

IPC: H01L21/67

Abstract: A substrate liquid processing apparatus A1 includes a processing tub 41 accommodating a processing liquid 43 and a substrate 8; a gas nozzle 70 discharging a gas into a lower portion within the processing tub 41; a gas supply unit 90 supplying the gas; a gas supply line 93 connecting the gas nozzle 70 with the gas supply unit 90; a decompression unit 95 introducing the processing liquid 43 within the processing tub 41 into the gas supply line 93 by decompressing the gas supply line 93; and a control unit 7 performing a first control of controlling the gas supply unit 90 to stop supply of the gas and controlling the decompression unit 95 to introduce the processing liquid 43 into the gas supply line 93 in a part of an idle period during which the substrate 8 is not accommodated in the processing tub 41.

公开(公告)号：US20190080937A1

公开(公告)日：2019-03-14

申请号：US16124529

申请日：2018-09-07

Applicant: Tokyo Electron Limited

Inventor： Takafumi Tsuchiya ,  Yuki Ishii ,  Hiroyuki Masutomi ,  Seigo Fujitsu

IPC: H01L21/67

Abstract: A substrate liquid processing apparatus A1 includes a processing tub 41 accommodating a processing liquid 43 and a substrate 8; a gas nozzle 70 discharging a gas into a lower portion within the processing tub 41; a gas supply unit 90 supplying the gas; a gas supply line 93 connecting the gas nozzle 70 with the gas supply unit 90; a decompression unit 95 introducing the processing liquid 43 within the processing tub 41 into the gas supply line 93 by decompressing the gas supply line 93; and a control unit 7 performing a first control of controlling the gas supply unit 90 to stop supply of the gas and controlling the decompression unit 95 to introduce the processing liquid 43 into the gas supply line 93 in a part of an idle period during which the substrate 8 is not accommodated in the processing tub 41.

公开(公告)号：US10928732B2

公开(公告)日：2021-02-23

申请号：US15209136

申请日：2016-07-13

Applicant: Tokyo Electron Limited

Inventor： Hironobu Hyakutake ,  Takafumi Tsuchiya ,  Koichiro Kanzaki

IPC: G03F7/42 ,  H01L21/67

Abstract: Disclosed is a substrate liquid processing apparatus including: a processing bath in which a processing liquid is stored; a chemical liquid component supply unit that supplies chemical liquid components; a concentration detecting unit that detects a concentration of the chemical liquid components; and a controller configured to perform a first control as a feedback control that replenishes the processing liquid with the chemical liquid components such that the concentration of the chemical liquid components contained in the processing liquid within the processing bath does not become less than a predetermined allowable lower limit, based on the concentration of the chemical liquid components detected by the concentration detecting unit. In addition, the controller performs a second control that replenishes the processing liquid with the chemical liquid components in a predetermined amount required to offset a reduction in concentration of the chemical liquid components caused by the introduction of the substrate.

公开(公告)号：US20170037499A1

公开(公告)日：2017-02-09

申请号：US15216868

申请日：2016-07-22

Applicant: Tokyo Electron Limited

Inventor： Hironobu Hyakutake ,  Takafumi Tsuchiya ,  Koichiro Kanzaki

IPC: C23C2/04

CPC classification number: C23C2/04 ,  G03F7/423 ,  H01L21/67086

Abstract: Disclosed is a substrate liquid processing apparatus including: a processing bath in which a mixture of sulfuric acid and hydrogen peroxide is stored, and a substrate is immersed in the stored mixture such that a processing is performed on the substrate; an outer bath configured to receive the mixture flowing out from the processing bath; a circulation line configured to return the mixture in the outer bath to the processing bath; a sulfuric acid supply unit configured to supply sulfuric acid to the mixture; a first hydrogen peroxide supply unit configured to supply hydrogen peroxide to the mixture in the outer bath; and a second hydrogen peroxide supply unit configured to supply hydrogen peroxide to the mixture flowing through a downstream portion of the circulation line.

Abstract translation: 公开了一种基板液体处理装置，包括：储存硫酸和过氧化氢的混合物的处理槽，将基板浸渍在所存储的混合物中，使得对基板进行加工; 外浴，其构造成接收从处理槽流出的混合物; 循环管线，其构造成将外浴中的混合物返回到处理槽; 构造成向混合物供给硫酸的硫酸供给单元; 第一过氧化氢供给单元，其构造成向所述外浴中的混合物供给过氧化氢; 以及第二过氧化氢供给单元，其构造成向流经所述循环管路的下游部分的混合物供给过氧化氢。

公开(公告)号：US09305818B2

公开(公告)日：2016-04-05

申请号：US14460428

申请日：2014-08-15

Applicant: Tokyo Electron Limited

Inventor： Yuji Kamikawa ,  Takafumi Tsuchiya ,  Koji Egashira

IPC: H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67775 ,  H01L21/67727 ,  H01L21/67733 ,  H01L21/67736 ,  H01L21/67769 ,  H01L21/67778 ,  H01L21/687 ,  H01L2221/68368 ,  Y10S414/14

Abstract: A substrate processing apparatus, which utilizes a first transfer apparatus and a second transfer apparatus which are configured to transfer a transfer container containing a plurality of substrates, along a first transfer path and a second transfer path whose lateral positions differ from each other, respectively, including a first load port where the transfer container is loaded and unloaded by the first transfer apparatus, and a second load port that is arranged stepwise with respect to the first load port, with the transfer container being loaded to and unloaded from the second load port by the second transfer apparatus.

Abstract translation: 一种基板处理装置，其利用第一传送装置和第二传送装置，所述第一传送装置和第二传送装置分别沿着第一传送路径和横向位置彼此不同的第二传送路径传送包含多个基板的传送容器， 包括第一装载口，其中所述转运容器由所述第一转运装置装载和卸载;以及第二装载端口，其相对于所述第一装载端口逐步布置，所述转运容器被装载到所述第二装载端口并从所述第二装载端口卸载 通过第二传送装置。

公开(公告)号：US10458010B2

公开(公告)日：2019-10-29

申请号：US15216868

申请日：2016-07-22

Applicant: Tokyo Electron Limited

Inventor： Hironobu Hyakutake ,  Takafumi Tsuchiya ,  Koichiro Kanzaki

IPC: C23C2/04 ,  H01L21/67 ,  G03F7/42

Abstract: Disclosed is a substrate liquid processing apparatus including: a processing bath in which a mixture of sulfuric acid and hydrogen peroxide is stored, and a substrate is immersed in the stored mixture such that a processing is performed on the substrate; an outer bath configured to receive the mixture flowing out from the processing bath; a circulation line configured to return the mixture in the outer bath to the processing bath; a sulfuric acid supply unit configured to supply sulfuric acid to the mixture; a first hydrogen peroxide supply unit configured to supply hydrogen peroxide to the mixture in the outer bath; and a second hydrogen peroxide supply unit configured to supply hydrogen peroxide to the mixture flowing through a downstream portion of the circulation line.

公开(公告)号：US20190080938A1

公开(公告)日：2019-03-14

申请号：US16126106

申请日：2018-09-10

Applicant: Tokyo Electron Limited

Inventor： Takahiro Kawazu ,  Takafumi Tsuchiya ,  Hideaki Sato ,  Hidemasa Aratake ,  Osamu Kuroda ,  Takashi Nagai ,  Jiro Harada

IPC: H01L21/67 ,  G05B19/418

Abstract: A substrate liquid processing apparatus A1 includes a processing liquid storage unit 38 configured to store a processing liquid therein; a processing liquid drain unit 41 configured to drain the processing liquid from the processing liquid storage unit 38; and a control unit 7. The control unit 7 performs a first control in a constant concentration mode in which a concentration of the processing liquid in the processing liquid storage unit 38 is regulated to a predetermined set concentration and a second control in a concentration changing mode in which the concentration of the processing liquid is changed. In the second control, a set concentration after concentration change is compared with a set concentration before the concentration change, and when the set concentration after the concentration change is lower, the control unit controls the processing liquid drain unit 41 to start draining of the processing liquid.