公开(公告)号：US20230008278A1

公开(公告)日：2023-01-12

申请号：US17756853

申请日：2020-11-27

Applicant: Tokyo Electron Limited

Inventor： Shuhei Goto ,  Tomohiro Kaneko ,  Takeshi Matsumoto

IPC: H01L21/677 ,  H01L21/02 ,  B08B3/02 ,  B08B13/00 ,  F26B5/00

Abstract: A substrate processing apparatus 1 includes a controller 61 configured to perform a first recipe and a second recipe in parallel. Each of the first recipe and the second recipe includes a first transfer processing of transferring a substrate from a transit unit 14 to a liquid processing unit 17, a liquid processing, a second transfer processing of transferring the substrate from the liquid processing unit 17 to a drying unit 18 and a drying processing. The controller 61 determines, while the first recipe on a first substrate in substrates is being performed, when the second recipe on a second substrate in the substrates is started, a start timing of the first transfer processing of the second substrate such that a time period of the second transfer processing of the first substrate does not overlap with a time period of the second transfer processing of the second substrate.

公开(公告)号：US20190393028A1

公开(公告)日：2019-12-26

申请号：US16448142

申请日：2019-06-21

Applicant: Tokyo Electron Limited

Inventor： Tomohiro Kaneko ,  Shuhei Goto

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/677 ,  B08B7/00 ,  G05B19/418

Abstract: A substrate processing apparatus includes first processors, second processors, a transfer module and a controller. Each of the first processors is configured to perform a first processing on a substrate. Each of the second processors is configured to perform a second processing on the substrate on which the first processing is performed. The transfer module is configured to transfer the substrate to the first processors and the second processors. The controller is configured to control the first processors, the second processors and the transfer module. The controller controls a start timing for a first transfer processing of transferring the substrates to the first processor such that a timing of a second transfer processing of transferring the substrate having a liquid film formed thereon to the second processor from the first processor and a timing when another substrate is transferred by the transfer module are not overlapped with each other.

公开(公告)号：US20230268213A1

公开(公告)日：2023-08-24

申请号：US18170087

申请日：2023-02-16

Applicant: Tokyo Electron Limited

Inventor： Takafumi Tsuchiya ,  Hiromi Hara ,  Wataru Tsukinoki ,  Shuhei Goto

IPC: H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67781 ,  H01L21/67766 ,  H01L21/68707 ,  H01L21/67769

Abstract: A substrate processing system includes a carry-in/out unit in which a cassette accommodating therein multiple substrates is carried in and out; a batch processing unit configured to process a lot including the multiple substrates at once; a single-wafer processing unit configured to process the substrates one by one; a first interface unit configured to distribute the substrates to the single-wafer processing unit or the batch processing unit; and a second interface unit configured to transfer the substrates between the batch processing unit and the single-wafer processing unit. The first interface unit includes a first placement unit configured to place therein the substrates before and after being processed by the single-wafer processing unit; a second placement unit configured to place therein the substrates before being processed by the batch processing unit; and a transfer device configured to transfer the substrates to the first placement unit and the second placement unit.

公开(公告)号：US11189481B2

公开(公告)日：2021-11-30

申请号：US16448142

申请日：2019-06-21

Applicant: Tokyo Electron Limited

Inventor： Tomohiro Kaneko ,  Shuhei Goto

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/02 ,  B08B7/00 ,  G05B19/418

Abstract: A substrate processing apparatus includes first processors, second processors, a transfer module and a controller. Each of the first processors is configured to perform a first processing on a substrate. Each of the second processors is configured to perform a second processing on the substrate on which the first processing is performed. The transfer module is configured to transfer the substrate to the first processors and the second processors. The controller is configured to control the first processors, the second processors and the transfer module. The controller controls a start timing for a first transfer processing of transferring the substrates to the first processor such that a timing of a second transfer processing of transferring the substrate having a liquid film formed thereon to the second processor from the first processor and a timing when another substrate is transferred by the transfer module are not overlapped with each other.