SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

    公开(公告)号:US20210017646A1

    公开(公告)日:2021-01-21

    申请号:US16928740

    申请日:2020-07-14

    Inventor: Yoshitaka MIURA

    Abstract: A substrate processing apparatus including: a processing container; an injector provided inside the processing container to have a shape extending in a longitudinal direction and configured to supply a processing gas; a holder fixed to the injector; a windmill fixed to the holder; a first driving-gas supply part configured to supply a driving-gas that rotates the windmill in a first direction; a second driving-gas supply part configured to supply the driving-gas that rotates the windmill in a second direction opposite the first direction; and a driving-gas controller configured to control the supply of the driving-gas from the first driving-gas supply part and the second driving-gas supply part. The injector is rotated about the longitudinal direction corresponding to a rotational axis by rotating the windmill through the supply of the driving-gas from at least one of the first and second driving-gas supply parts under the control of the driving-gas controller.

    SUBSTRATE PROCESSING APPARATUS
    2.
    发明公开

    公开(公告)号:US20240332047A1

    公开(公告)日:2024-10-03

    申请号:US18610344

    申请日:2024-03-20

    Abstract: A substrate processing apparatus includes: a process container accommodating a substrate holder that holds a plurality of substrates and including an opening at a lower end of the process container; a lid configured to open and close the opening; and a thermal insulator installed on the lid and configured to thermally insulate a first space below the substrate holder. The thermal insulator includes a partition member that forms a second space partitioned from the first space. The lid includes a supply port for supplying a temperature regulation fluid to the second space and an exhaust port for discharging the temperature regulation fluid from the second space.

    SUBSTRATE PROCESSING APPARATUS
    3.
    发明公开

    公开(公告)号:US20240332043A1

    公开(公告)日:2024-10-03

    申请号:US18616594

    申请日:2024-03-26

    CPC classification number: H01L21/67109

    Abstract: A substrate processing apparatus includes a vacuum container configured to accommodate a substrate holder configured to hold a plurality of substrates and having an opening provided in a lower end of the vacuum container, a lid configured to open/close the opening, and a heat-insulating unit configured to insulate a first space below the substrate holder, wherein the heat-insulating unit includes a partition member that forms a second space partitioned from the first space, and the partition member is provided to be rotatable with respect to the lid.

    HEAT TREATMENT APPARATUS
    4.
    发明公开

    公开(公告)号:US20240060184A1

    公开(公告)日:2024-02-22

    申请号:US18446634

    申请日:2023-08-09

    Inventor: Yoshitaka MIURA

    CPC classification number: C23C16/46 C23C16/4583 H01L21/67109

    Abstract: A heat treatment apparatus includes: a processing container having a roof in a cylindrical shape and a lower end opening, and in which a first space is formed; a lid for closing the lower end opening; a support including a shaft portion and a placement portion; a boat installed on the placement portion to vertically hold substrates; a partitioning member provided around the shaft portion with a gap left from a lower surface of the placement portion to form a second space partitioned from the first space; and a heat insulating material provided in the second space. An exhaust port is provided in a sidewall of the processing container. In a circumferential direction of the processing container, the gap includes a first gap having at least an angular position where the exhaust port is provided, and a second gap provided at an angular position excluding the first gap.

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