公开(公告)号：US09620394B2

公开(公告)日：2017-04-11

申请号：US14211625

申请日：2014-03-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Naofumi Kishita ,  Yuji Sakai

IPC: B05C11/08 ,  H01L21/67 ,  H01L21/687 ,  G03F7/16

CPC classification number: H01L21/67051 ,  B05C11/08 ,  G03F7/162 ,  H01L21/68714 ,  H01L21/68735 ,  H01L21/68785

Abstract: In one embodiment, a cleaning member has an annular part and an opening positioned radially inside the annular part, and can be moved up and down between a first position and a second position relative to a cleaning nozzle. For cleaning of the back surface of the wafer, the cleaning member is placed at its first position that allows a cleaning liquid to reach the back surface of the substrate through the opening of the cleaning member. For cleaning of the cup structure, the cleaning member placed at its second position higher than the first position is being rotated, and a cleaning liquid discharged from the cleaning nozzle collides with an annular part of the cleaning member and is guided to the inner surface of a cup structure.

公开(公告)号：US11273464B2

公开(公告)日：2022-03-15

申请号：US16986412

申请日：2020-08-06

Applicant: Tokyo Electron Limited

Inventor： Satoshi Shimmura ,  Yuji Sakai ,  Kenta Shibasaki ,  Koji Takayanagi ,  Kenji Yada ,  Hiroichi Inada ,  Shinichi Seki ,  Kento Ogata

IPC: B05C11/10 ,  B05B14/30 ,  B05C11/08 ,  B05C13/02

Abstract: A substrate processing apparatus includes a cover member placed to surround a substrate held by a rotary holder; a collecting member placed in an exhaust path formed between the cover member and the rotary holder; and a solvent supply placed above the collecting member and configured to supply a solvent to the collecting member. The solvent supply includes an inner storage space surrounding the substrate; an outer storage space surrounding the inner storage space; and a partition wall extending along a circumferential direction to partition the inner storage space and the outer storage space. Multiple communication holes are extended to penetrate the partition wall such that the solvent introduced into the outer storage space flows to the inner storage space. Multiple dripping holes are extended to penetrate a bottom wall of the inner storage space such that the solvent within the inner storage space drops toward the collecting member.

公开(公告)号：US11235350B2

公开(公告)日：2022-02-01

申请号：US16266310

申请日：2019-02-04

Applicant: Tokyo Electron Limited

Inventor： Satoshi Shimmura ,  Yuji Sakai ,  Kousuke Yoshihara

IPC: B05C21/00 ,  B08B9/08 ,  B05C5/02 ,  G03F7/16 ,  H01L21/67 ,  B05C11/10

Abstract: A solution treatment apparatus includes: a substrate holding unit holds and rotates a substrate; a coating solution supply unit applies a coating solution to the substrate held by the substrate holding unit; a cup unit arranged outside the substrate holding unit in a manner to be able to surround the substrate held by the substrate holding unit; an exhaust path provided between the substrate holding unit and an inner peripheral surface of the cup unit; a coating solution collection unit provided above the exhaust path in a manner to cover the exhaust path and including an opening part communicating in a vertical direction; a solvent supply unit supplies a solvent for the coating solution to the coating solution collection unit; and a relay unit located above the coating solution collection unit and projecting from the inner peripheral surface of the cup unit toward the coating solution collection unit.

公开(公告)号：US20210039131A1

公开(公告)日：2021-02-11

申请号：US16986412

申请日：2020-08-06

Applicant: Tokyo Electron Limited

Inventor： Satoshi Shimmura ,  Yuji Sakai ,  Kenta Shibasaki ,  Koji Takayanagi ,  Kenji Yada ,  Hiroichi Inada ,  Shinichi Seki ,  Kento Ogata

IPC: B05C11/10 ,  B05C11/08 ,  B05C13/02 ,  B05B14/30

Abstract: A substrate processing apparatus includes a cover member placed to surround a substrate held by a rotary holder; a collecting member placed in an exhaust path formed between the cover member and the rotary holder; and a solvent supply placed above the collecting member and configured to supply a solvent to the collecting member. The solvent supply includes an inner storage space surrounding the substrate; an outer storage space surrounding the inner storage space; and a partition wall extending along a circumferential direction to partition the inner storage space and the outer storage space. Multiple communication holes are extended to penetrate the partition wall such that the solvent introduced into the outer storage space flows to the inner storage space. Multiple dripping holes are extended to penetrate a bottom wall of the inner storage space such that the solvent within the inner storage space drops toward the collecting member.