公开(公告)号：US11869750B2

公开(公告)日：2024-01-09

申请号：US17272771

申请日：2019-08-23

Applicant: Tokyo Electron Limited

Inventor： Yusuke Hayasaka ,  Takehiro Tanikawa ,  Shuhei Yamabe ,  Yuki Machida ,  Jun Young Chung

IPC: H01J37/32

CPC classification number: H01J37/32522 ,  H01J37/32504

Abstract: A plasma processing apparatus according to an exemplary embodiment includes a chamber, a member, and a heater. Plasma is generated in an internal space of the chamber. The member is partially located in the internal space of the chamber. The heater is configured to heat the member. The member extends outward from the internal space of the chamber and is exposed to a space outside the chamber.