公开(公告)号：US10811234B2

公开(公告)日：2020-10-20

申请号：US15947689

申请日：2018-04-06

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shin Matsuura ,  Jun Young Chung

IPC: H01J37/32 ,  C23C16/455

Abstract: A plasma processing apparatus includes supporting members, connecting members and a sliding member. Each of the supporting members is partially disposed in a disc-shaped cooling plate and configured to support an upper electrode in a direction of gravity. Each of the connecting members is partially disposed in the cooling plate and extends in a diametrical direction of the cooling plate to be engaged with the corresponding supporting member. The sliding member is configured to slide the connecting members inward in the diametrical direction of the cooling plate, thereby pushing upward the supporting member and lifting the upper electrode to the cooling plate.

公开(公告)号：US12062527B2

公开(公告)日：2024-08-13

申请号：US17114722

申请日：2020-12-08

Applicant: Tokyo Electron Limited

Inventor： Jun Young Chung ,  Ryo Sasaki

IPC: H01L21/00 ,  H01J37/32

CPC classification number: H01J37/32834 ,  H01J37/32633 ,  H01J37/32082 ,  H01J2237/334

Abstract: A baffle unit includes an inner ring, an outer ring disposed outside the inner ring, and a connecting portion connecting the inner ring with the outer ring. The connecting portion includes multiple openings arranged in a radial direction of the baffle unit and in a circumferential direction of the baffle unit, each of the multiple openings being arcuate and extending in the circumferential direction; multiple rigid portions each being disposed between the adjacent openings of the multiple openings that are adjacent to each other on a same concentric circle of the baffle unit; and multiple walls each being formed between the adjacent openings of the multiple openings that are adjacent to each other in the radial direction. Each of the multiple walls connects a rigid portion of the multiple rigid portions with another rigid portion of the multiple rigid portions.

公开(公告)号：US11869750B2

公开(公告)日：2024-01-09

申请号：US17272771

申请日：2019-08-23

Applicant: Tokyo Electron Limited

Inventor： Yusuke Hayasaka ,  Takehiro Tanikawa ,  Shuhei Yamabe ,  Yuki Machida ,  Jun Young Chung

IPC: H01J37/32

CPC classification number: H01J37/32522 ,  H01J37/32504

Abstract: A plasma processing apparatus according to an exemplary embodiment includes a chamber, a member, and a heater. Plasma is generated in an internal space of the chamber. The member is partially located in the internal space of the chamber. The heater is configured to heat the member. The member extends outward from the internal space of the chamber and is exposed to a space outside the chamber.

公开(公告)号：US09773647B2

公开(公告)日：2017-09-26

申请号：US14792755

申请日：2015-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shin Matsuura ,  Jun Young Chung ,  Keita Kambara

IPC: H01J37/32 ,  H01L21/67 ,  H05H1/46 ,  C23C16/455

CPC classification number: H01J37/32568 ,  C23C16/45565 ,  H01J37/32522 ,  H01J37/32532 ,  H01L21/67069 ,  H01L21/67109

Abstract: A plasma processing apparatus includes supporting members, connecting members, a rotation member and fixing members. Each of the supporting members is partially disposed in a disc-shaped cooling plate and configured to support an upper electrode provided below the cooling plate. Each of the connecting members is partially disposed in the cooling plate and extends in a diametrical direction of the cooling plate to be engaged with the corresponding supporting member. The rotation member is provided to surround an outer periphery of the cooling plate and has recesses formed to face the cooling plate and engaged with the corresponding connecting members. Each of the fixing members is configured to lift and fix the upper electrode to the cooling plate by applying a torque to the corresponding connecting member.

公开(公告)号：US11978614B2

公开(公告)日：2024-05-07

申请号：US16903571

申请日：2020-06-17

Applicant: Tokyo Electron Limited

Inventor： Yusuke Hayasaka ,  Jun Young Chung ,  Shuhei Yamabe ,  Keiichi Yamaguchi ,  Takehiro Tanikawa

IPC: H01J37/32

CPC classification number: H01J37/32522 ,  H01J37/32449 ,  H01J37/32477 ,  H01J37/32651 ,  H01J37/32743 ,  H01J2237/334

Abstract: A substrate processing apparatus includes a chamber having a plasma processing space, a sidewall of the chamber having an opening for transferring a substrate into the plasma processing space; and a shutter disposed at an inner side than the sidewall and configured to open or close the opening, the shutter having a flow path for a temperature-controlled fluid.

公开(公告)号：US11229878B2

公开(公告)日：2022-01-25

申请号：US16582082

申请日：2019-09-25

Applicant: TOKYO ELECTRON LIMITED

Inventor： Jun Young Chung

IPC: B01D53/26 ,  F24F11/84 ,  F28D7/00 ,  H01L21/67 ,  F28D21/00

Abstract: A dry air generation apparatus includes a first heat exchanger, a second heat exchanger, a switching valve, and a controller. The first heat exchanger and the second heat exchanger are provided in the air flow path, and the moisture contained in the air is removed by cooling the air which flows through the flow path to 0° C. or lower. The switching valve switches the direction of the air flowing through the first heat exchanger and the second heat exchanger. The controller controls the first heat exchanger, the second heat exchanger, and the switching valve. The first heat exchanger and the second heat exchanger are connected in series in the air flow path.

公开(公告)号：US09941101B2

公开(公告)日：2018-04-10

申请号：US14793857

申请日：2015-07-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shin Matsuura ,  Jun Young Chung

IPC: H01J37/32 ,  H01L21/3065 ,  H01L21/683 ,  H05H1/46 ,  C23C16/455

CPC classification number: H01J37/32532 ,  C23C16/45565 ,  H01J37/32091 ,  H01J37/32568

Abstract: A plasma processing apparatus includes supporting members, connecting members and a sliding member. Each of the supporting members is partially disposed in a disc-shaped cooling plate and configured to support an upper electrode in a direction of gravity. Each of the connecting members is partially disposed in the cooling plate and extends in a diametrical direction of the cooling plate to be engaged with the corresponding supporting member. The sliding member is configured to slide the connecting members inward in the diametrical direction of the cooling plate, thereby pushing upward the supporting member and lifting the upper electrode to the cooling plate.