公开(公告)号：US20230416920A1

公开(公告)日：2023-12-28

申请号：US18210409

申请日：2023-06-15

Applicant: Tokyo Electron Limited

Inventor： Tatsuya YAMAGUCHI ,  Yutaka SASAKI ,  Makoto TAKAHASHI ,  Toru ISHII ,  Naoshige FUSHIMI ,  Koji YOSHII

IPC: C23C16/46 ,  C23C16/458 ,  C23C16/52 ,  C23C16/56 ,  C23C16/34 ,  C23C16/455

CPC classification number: C23C16/466 ,  C23C16/4584 ,  C23C16/52 ,  C23C16/56 ,  C23C16/345 ,  C23C16/45544 ,  H01L21/0217

Abstract: A substrate processing apparatus includes: a processing container that accommodates a substrate; a processing gas supply that supplies a processing gas into the processing container; an exhaust that exhausts an inside of the processing container; a heater that heats the processing container; and a cooling gas injector that injects a cooling gas for cooling the substrate.