公开(公告)号：US20240295024A1

公开(公告)日：2024-09-05

申请号：US18588315

申请日：2024-02-27

Applicant: Tokyo Electron Limited

Inventor： Makoto TAKAHASHI ,  Masato KADOBE ,  Tatsuya YAMAGUCHI

IPC: C23C16/455 ,  C23C16/48

CPC classification number: C23C16/45548 ,  C23C16/4557 ,  C23C16/45578 ,  C23C16/481

Abstract: A substrate processing apparatus includes: a processing container capable of accommodating a substrate holder that holds substrates; a gas supply chamber provided in a side wall of the processing container, a supply-side pipe extending horizontally from the gas supply chamber, and an injector detachably disposed spanning through the gas supply chamber and the supply-side pipe.

公开(公告)号：US20240295023A1

公开(公告)日：2024-09-05

申请号：US18588371

申请日：2024-02-27

Applicant: Tokyo Electron Limited

Inventor： Makoto TAKAHASHI

IPC: C23C16/44 ,  C23C16/455

CPC classification number: C23C16/4412 ,  C23C16/45548

Abstract: A substrate processing apparatus includes: a processing container capable of accommodating a substrate holder that holds substrates; a gas exhaust chamber provided in a side wall of the processing container, an exhaust-side pipe extending horizontally from the gas exhaust chamber, and an ejector detachably disposed spanning through the gas exhaust chamber and the exhaust-side pipe.

公开(公告)号：US20230417488A1

公开(公告)日：2023-12-28

申请号：US18210368

申请日：2023-06-15

Applicant: Tokyo Electron Limited

Inventor： Makoto TAKAHASHI ,  Kazuteru OBARA ,  Tatsuya YAMAGUCHI

IPC: F27D19/00 ,  F27D7/02

CPC classification number: F27D19/00 ,  F27D7/02 ,  F27D2019/0053 ,  F27D2019/0068 ,  F27D2019/0018

Abstract: A heat treatment apparatus includes: a processing container having an interior space in which substrates are processed; a temperature adjustment furnace that is disposed around the processing container and heats the substrates from the outer side of the processing container; and an internal temperature adjustment unit that is movable relative to the processing container and supplies a temperature adjustment gas for regulating a temperature of the processing container into the interior space in a state of being disposed facing an opening that opens the interior space.

公开(公告)号：US20230416920A1

公开(公告)日：2023-12-28

申请号：US18210409

申请日：2023-06-15

Applicant: Tokyo Electron Limited

Inventor： Tatsuya YAMAGUCHI ,  Yutaka SASAKI ,  Makoto TAKAHASHI ,  Toru ISHII ,  Naoshige FUSHIMI ,  Koji YOSHII

IPC: C23C16/46 ,  C23C16/458 ,  C23C16/52 ,  C23C16/56 ,  C23C16/34 ,  C23C16/455

CPC classification number: C23C16/466 ,  C23C16/4584 ,  C23C16/52 ,  C23C16/56 ,  C23C16/345 ,  C23C16/45544 ,  H01L21/0217

Abstract: A substrate processing apparatus includes: a processing container that accommodates a substrate; a processing gas supply that supplies a processing gas into the processing container; an exhaust that exhausts an inside of the processing container; a heater that heats the processing container; and a cooling gas injector that injects a cooling gas for cooling the substrate.