公开(公告)号：US11114322B2

公开(公告)日：2021-09-07

申请号：US15455475

申请日：2017-03-10

申请人： Toshiba Memory Corporation

发明人： Takeori Maeda ,  Ryoji Matsushima ,  Makoto Kawaguchi ,  Masaaki Wakui

IPC分类号： H01L21/67 ,  B29C45/03 ,  B29C45/02 ,  B29C45/14 ,  B29C45/77 ,  B29C45/78 ,  B29C45/80 ,  B29C45/34 ,  H01L21/687 ,  B29L31/34

摘要： According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.