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公开(公告)号：US07292448B2
公开(公告)日：2007-11-06
申请号：US11508939
申请日：2006-08-24
申请人： Toshichika Urushibara , Koji Shiozawa , Masakazu Okabe , Yukiko Hyodo , Yusuke Masuda , Tadayuki Miyamoto
发明人： Toshichika Urushibara , Koji Shiozawa , Masakazu Okabe , Yukiko Hyodo , Yusuke Masuda , Tadayuki Miyamoto
IPC分类号： H05K7/00
CPC分类号： H05K1/147 , H05K1/141 , H05K1/189 , H05K3/363 , H05K3/4691 , H05K2201/09063 , H05K2201/2009 , H05K2203/1572 , H05K2203/167 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49155 , Y10T156/1056 , Y10T156/1075 , Y10T156/137
摘要： A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second land portions located at a predetermined interval on one surface and a flexible wiring board sandwiched by the first and second rigid substrates and which has a plurality of third land portions corresponding to the first land portions on one surface and a plurality of fourth land portions corresponding to the second land portions on the other surface. In this circuit substrate, the second and fourth land portions are displaced from each other relative to the first and third land portions and at least part of the first and third land portions and at least part of the second and fourth land portions are electrically connected to each other, respectively.
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公开(公告)号：US20070081309A1
公开(公告)日：2007-04-12
申请号：US11508939
申请日：2006-08-24
申请人： Toshichika Urushibara , Koji Shiozawa , Masakazu Okabe , Yukiko Hyodo , Yusuke Masuda , Tadayuki Miyamoto
发明人： Toshichika Urushibara , Koji Shiozawa , Masakazu Okabe , Yukiko Hyodo , Yusuke Masuda , Tadayuki Miyamoto
CPC分类号： H05K1/147 , H05K1/141 , H05K1/189 , H05K3/363 , H05K3/4691 , H05K2201/09063 , H05K2201/2009 , H05K2203/1572 , H05K2203/167 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49155 , Y10T156/1056 , Y10T156/1075 , Y10T156/137
摘要： A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second land portions located at a predetermined interval on one surface and a flexible wiring board sandwiched by the first and second rigid substrates and which has a plurality of third land portions corresponding to the first land portions on one surface and a plurality of fourth land portions corresponding to the second land portions on the other surface. In this circuit substrate, the second and fourth land portions are displaced from each other relative to the first and third land portions and at least part of the first and third land portions and at least part of the second and fourth land portions are electrically connected to each other, respectively.
摘要翻译： 电路基板包括：第一刚性基板，具有在一个表面上以预定间隔设置的多个焊盘部分;第二刚性基板，具有在一个表面上以预定间隔设置的多个第二焊盘部分和由 第一刚性基板和第二刚性基板，并且在一个表面上具有对应于第一焊盘部分的多个第三焊盘部分和与另一个表面上的第二焊盘部分对应的多个第四焊盘部分。 在该电路基板中，第二和第四接地部分相对于第一和第三接地部分以及第一和第三接地部分的至少一部分彼此位移，并且第二和第四接地部分的至少一部分电连接到 彼此分别。
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公开(公告)号：US07805068B2
公开(公告)日：2010-09-28
申请号：US12044320
申请日：2008-03-07
CPC分类号： G03B17/20 , G03B13/06 , G03B2205/0007 , H04N5/23212 , H04N5/23293
摘要： An imaging apparatus includes a viewfinder optical system that observes a subject image input from a photography optical system. The imaging apparatus also includes a transmissive member upon which is provided a line image indicating detection positions of photography supporting information relating to photography conditions, within a photography region. The photography conditions are at least one of setting information relating to a focus and setting information relating to an exposure. The imaging apparatus further includes an imaging device that acquires a photographed image relating to the subject image, the line image having been superimposed on the photographed image. In addition, the imaging apparatus includes a processing unit that corrects a part of the line image extracted from the line image shown in the photographed image, the part of the line image having been extracted corresponding to the photography conditions that have been set.
摘要翻译： 成像装置包括观察从摄影光学系统输入的被摄体图像的取景器光学系统。 成像装置还包括透射构件，在该透射构件上设置有指示在摄影区域内的与摄影条件相关的摄影支持信息的检测位置的行图像。 拍摄条件是关于与曝光相关的焦点和设置信息的设置信息中的至少一个。 成像装置还包括：摄像装置，其获取与被摄体图像有关的拍摄图像，该线图像已经叠加在拍摄图像上。 此外，成像装置包括：处理单元，其校正从拍摄图像中所示的行图像提取的一部分行图像，对应于已经设置的拍摄条件已经提取的行图像的部分。
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公开(公告)号：US20080298797A1
公开(公告)日：2008-12-04
申请号：US12044320
申请日：2008-03-07
IPC分类号： G03B13/02
CPC分类号： G03B17/20 , G03B13/06 , G03B2205/0007 , H04N5/23212 , H04N5/23293
摘要： An imaging apparatus includes: a viewfinder optical system configured to observe a subject image input from a photography optical system; a transmissive member upon which is provided a line image indicating detection positions of photography supporting information relating to photography conditions, within a photography region; an imaging device configured to acquire a photographed image relating to the subject image upon which the line image has been superimposed; and a line image correcting unit for correcting a part of the line image extracted from the line image shown in the photographed image, the part of the line image having been extracted corresponding to the photography conditions that have been set.
摘要翻译： 一种成像装置，包括：取景器光学系统，被配置为观察从摄影光学系统输入的被摄体图像; 透镜构件，其在摄影区域内设置有指示与摄影条件相关的摄影支持信息的检测位置的行图像; 成像装置，被配置为获取与已经叠加了所述行图像的所述被摄体图像有关的拍摄图像; 以及行图像校正单元，用于校正从拍摄图像中示出的行图像提取的行图像的一部分，对应于已经设置的拍摄条件已经提取的行图像的部分。
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