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1.发明授权公开(公告)号：US07932594B2
公开(公告)日：2011-04-26
申请号：US12094132
申请日：2006-11-16
IPC分类号： H01L23/48
CPC分类号： B81B7/0064 , B81B2207/092 , B81B2207/093 , B81B2207/095 , B81B2207/097 , B81C2203/0118 , B81C2203/035 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/94 , H01L2924/00014 , H01L2924/1461 , H01L2924/15311 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic component sealing substrate capable of configuring an electronic apparatus in which the influence of electromagnetic coupling and radio frequency noises between an electrical connection path and a micro electronic mechanical system is suppressed is provided. An electronic component sealing substrate (4) for hermetically sealing a micro electronic mechanical system (4) of an electronic component (2) that includes a semiconductor substrate (5), the micro electronic mechanical system (3) formed on a main face of the semiconductor substrate (5), and an electrode (6) electrically connected to the micro electronic mechanical system (3), includes an insulating substrate (7) that has a first main face joined to the main face of the semiconductor substrate (5) so as to hermetically seal the micro electronic mechanical system (3), and a wiring conductor (8) that has an end extending to the first main face of the insulating substrate (7) and is electrically connected to the electrode (6) of the electronic component (2), and the end of the wiring conductor (8) is positioned outside a joined portion of the main face of the semiconductor substrate (5) and the first main face of the insulating substrate (7).
摘要翻译： 提供一种电子部件密封基板，其能够构成抑制电连接路径和微电子机械系统之间的电磁耦合和无线电频率噪声的影响的电子设备。 一种用于气密密封包括半导体衬底（5）的电子部件（2）的微电子机械系统（4）的电子部件密封基板（4），形成在所述微电子机械系统 半导体衬底（5）和与微电子机械系统（3）电连接的电极（6）包括绝缘衬底（7），其具有接合到半导体衬底（5）的主面的第一主面，因此 为了气密地密封微电子机械系统（3），以及布线导体（8），其具有延伸到绝缘基板（7）的第一主面的端部，并且电连接到电子器件的电极（6） （2），并且布线导体（8）的端部位于半导体基板（5）的主面和绝缘基板（7）的第一主面的接合部的外侧。
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2.发明申请公开(公告)号：US20090091018A1
公开(公告)日：2009-04-09
申请号：US12094132
申请日：2006-11-16
CPC分类号： B81B7/0064 , B81B2207/092 , B81B2207/093 , B81B2207/095 , B81B2207/097 , B81C2203/0118 , B81C2203/035 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/94 , H01L2924/00014 , H01L2924/1461 , H01L2924/15311 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic component sealing substrate capable of configuring an electronic apparatus in which the influence of electromagnetic coupling and radio frequency noises between an electrical connection path and a micro electronic mechanical system is suppressed is provided. An electronic component sealing substrate (4) for hermetically sealing a micro electronic mechanical system (4) of an electronic component (2) that includes a semiconductor substrate (5), the micro electronic mechanical system (3) formed on a main face of the semiconductor substrate (5), and an electrode (6) electrically connected to the micro electronic mechanical system (3), includes an insulating substrate (7) that has a first main face joined to the main face of the semiconductor substrate (5) so as to hermetically seal the micro electronic mechanical system (3), and a wiring conductor (8) that has an end extending to the first main face of the insulating substrate (7) and is electrically connected to the electrode (6) of the electronic component (2), and the end of the wiring conductor (8) is positioned outside a joined portion of the main face of the semiconductor substrate (5) and the first main face of the insulating substrate (7).
摘要翻译： 提供一种电子部件密封基板，其能够构成抑制电连接路径和微电子机械系统之间的电磁耦合和无线电频率噪声的影响的电子设备。 一种用于气密密封包括半导体衬底（5）的电子部件（2）的微电子机械系统（4）的电子部件密封基板（4），形成在所述微电子机械系统 半导体衬底（5）和与微电子机械系统（3）电连接的电极（6）包括绝缘衬底（7），其具有接合到半导体衬底（5）的主面的第一主面，因此 为了气密地密封微电子机械系统（3），以及布线导体（8），其具有延伸到绝缘基板（7）的第一主面的端部，并且电连接到电子器件的电极（6） （2），并且布线导体（8）的端部位于半导体基板（5）的主面和绝缘基板（7）的第一主面的接合部的外侧。
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