公开(公告)号：US5599612A

公开(公告)日：1997-02-04

申请号：US408730

申请日：1995-03-22

申请人： Toshio Muraki ,  Masazumi Tokunou ,  Ryuji Sawaoka ,  Masahiko Hayashi ,  Toshiaki Higashi ,  Tokuo Tazaki

发明人： Toshio Muraki ,  Masazumi Tokunou ,  Ryuji Sawaoka ,  Masahiko Hayashi ,  Toshiaki Higashi ,  Tokuo Tazaki

IPC分类号： C08J3/24 ,  C08J5/06 ,  C08J5/24 ,  B32B7/00

CPC分类号： C08J3/242 ,  C08J5/06 ,  C08J5/24 ,  C08J2363/00 ,  Y10S428/902 ,  Y10T428/30 ,  Y10T428/31511 ,  Y10T442/2008 ,  Y10T442/2098 ,  Y10T442/2951

摘要： A prepreg precursor including a carbon fiber woven fabric having applied to the fabric between about 0.5 to about 10 wt % of a stabilizer material for stabilizing the structural form of the fabric. Prepregs can then be produced using the woven fabric. Undesired settlement of matrix resin from the surface of the woven fabric is thus prevented. Hence, compared with a prepreg prepared using conventional woven fabric, a prepreg prepared by using the woven fabric of the invention can hold its tackiness for a long time and can be used to produce a fiber reinforced composite material excellent in smoothness without being devoid of surface resin.

摘要翻译： 一种包括碳纤维织物的预浸料前体，该碳纤维织物已经在织物上施加约0.5至约10重量％的用于稳定织物结构形式的稳定剂材料。 然后可以使用织造织物制备预浸料。 因此防止了从机织织物表面出现的不希望的基质树脂沉降。 因此，与使用常规机织织物制备的预浸料相比，通过使用本发明的织物制备的预浸料可以长期保持其粘性，并且可以用于生产平滑性优异而不缺乏表面的纤维增强复合材料 树脂。

公开(公告)号：US5726222A

公开(公告)日：1998-03-10

申请号：US838443

申请日：1997-04-07

申请人： Ryuji Sawaoka ,  Shinji Kouchi ,  Toshio Muraki

发明人： Ryuji Sawaoka ,  Shinji Kouchi ,  Toshio Muraki

IPC分类号： C08J3/24 ,  C08K9/10 ,  C12N1/21 ,  C12N15/31 ,  C12N15/52 ,  C12N15/63 ,  C12N15/70

CPC分类号： C08J3/241 ,  C08J5/24 ,  C08K9/10 ,  Y10S525/936

摘要： Disclosed is a microcapsule-type curing agent comprising (A) a curing agent for a thermosetting resin and (B) a thermoplastic resin dissolvable to the thermosetting resin by heating. The microcapsule-type curing agent is formed as a particle-like material in which the component (A) is coated with a layer whose main constituent is the component (B) and the mean particle diameter of which is in the range of 0.1 to 20 .mu.m. By using the microcapsule-type curing agent, a thermosetting resin composition and a prepreg which are good in storage stability at a room temperature and excellent in thermal resistance of a cured product made therefrom can be obtained. Further, a fiber reinforced composite material obtained using this thermosetting resin composition is excellent in curing uniformity and thermal resistance.

摘要翻译： 公开了一种微胶囊型固化剂，其包含（A）热固性树脂用固化剂和（B）通过加热可溶解于热固性树脂的热塑性树脂。 微胶囊型固化剂形成为其中组分（A）涂覆有主要成分为组分（B）的层并且其平均粒径在0.1至20范围内的颗粒状材料 亩 通过使用微胶囊型固化剂，可以得到在室温下的保存稳定性好，由其制成的固化物的耐热性优异的热固性树脂组合物和预浸料坯。 此外，使用这种热固性树脂组合物获得的纤维增强复合材料具有优异的固化均匀性和耐热性。

公开(公告)号：US5589523A

公开(公告)日：1996-12-31

申请号：US468445

申请日：1995-06-06

申请人： Ryuji Sawaoka ,  Shinji Kouchi ,  Toshio Muraki

发明人： Ryuji Sawaoka ,  Shinji Kouchi ,  Toshio Muraki

IPC分类号： C08J3/24 ,  C08K9/10 ,  C12N1/21 ,  C12N15/31 ,  C12N15/52 ,  C12N15/63 ,  C12N15/70

CPC分类号： C08J3/241 ,  C08J5/24 ,  C08K9/10 ,  Y10S525/936

摘要： Disclosed is a microcapsule curing agent including (A) a curing agent for a thermosetting resin and (B) a thermoplastic resin. The microcapsule curing agent is formed as a particle-like material in which component (A) is coated with a layer whose main constituent is component (B) and the mean particle diameter of which is in the range of 0.1 to 20 .mu.m. By using the microcapsule curing agent, a thermosetting resin composition and a prepreg which exhibit good storage stability at room temperature and are excellent in thermal resistance for cured products made therefrom can be obtained. A fiber reinforced composite material obtained using the thermosetting resin composition is excellent in curing uniformity and thermal resistance.

摘要翻译： 公开了一种微胶囊固化剂，其包含（A）热固性树脂用固化剂和（B）热塑性树脂。 微胶囊固化剂形成为其中组分（A）涂覆有主要成分为组分（B）的层并且其平均粒径在0.1-20μm范围内的颗粒状材料。 通过使用微胶囊固化剂，可以获得在室温下显示良好的储存稳定性并且由其制备的固化产物的耐热性优异的热固性树脂组合物和预浸料坯。 使用该热固性树脂组合物得到的纤维增强复合材料的固化均匀性和耐热性优异。

公开(公告)号：US08877330B2

公开(公告)日：2014-11-04

申请号：US13137445

申请日：2011-08-16

申请人： Masato Honma ,  Atsuki Tsuchiya ,  Ryuji Sawaoka

发明人： Masato Honma ,  Atsuki Tsuchiya ,  Ryuji Sawaoka

IPC分类号： B32B3/00 ,  B32B7/10 ,  B32B27/04 ,  B32B27/08 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  C08G59/50 ,  C08K5/523 ,  C08K7/06 ,  C08K3/02 ,  C09C1/00 ,  C08J5/24 ,  C08G59/38 ,  C08G59/40 ,  C08L63/02 ,  C08L63/04 ,  C08K3/32

CPC分类号： C08K5/523 ,  B32B5/26 ,  B32B27/08 ,  B32B27/38 ,  B32B2250/02 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2439/00 ,  B32B2457/00 ,  C01P2004/61 ,  C01P2004/62 ,  C08G59/50 ,  C08G59/5006 ,  C08G59/5033 ,  C08J5/24 ,  C08K3/02 ,  C08K7/06 ,  C08K9/02 ,  C08K2003/026 ,  C09C1/00 ,  Y10T428/1362 ,  Y10T428/1372 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T428/249952 ,  Y10T428/25 ,  Y10T428/263 ,  Y10T428/269 ,  Y10T428/31511 ,  C08L63/00

摘要： The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and en epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B] and [C]: [A] epoxy resin, [B] amine curing agent, and [C] phosphorus compound, wherein the concentration of the component [C] is 0.2 to 15% by weight in terms of phosphorus atom concentration.

摘要翻译： 本发明提供一种轻质纤维增强复合材料，其具有优异的阻燃性和机械性能，并且不会发出卤素气体。 本发明还提供了适于获得上述纤维增强复合材料的预浸料和环氧树脂组合物。 本发明还提供一种使用上述纤维增强复合材料制成的一体成型体，从而适用于电气/电子外壳。 环氧树脂组合物含有以下组分[A]，[B]和[C]：[A]环氧树脂，[B]胺固化剂和[C]磷化合物，其中组分 [C]按磷原子浓度计为0.2〜15重量％。

公开(公告)号：US20120058325A1

公开(公告)日：2012-03-08

申请号：US13137445

申请日：2011-08-16

申请人： Masato Honma ,  Atsuki Tsuchiya ,  Shiro Honda ,  Ryuji Sawaoka ,  Koyomi Nakahara

发明人： Masato Honma ,  Atsuki Tsuchiya ,  Shiro Honda ,  Ryuji Sawaoka ,  Koyomi Nakahara

IPC分类号： B32B9/04 ,  B32B17/10 ,  B32B5/16 ,  B32B13/04

CPC分类号： C08K5/523 ,  B32B5/26 ,  B32B27/08 ,  B32B27/38 ,  B32B2250/02 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2439/00 ,  B32B2457/00 ,  C01P2004/61 ,  C01P2004/62 ,  C08G59/50 ,  C08G59/5006 ,  C08G59/5033 ,  C08J5/24 ,  C08K3/02 ,  C08K7/06 ,  C08K9/02 ,  C08K2003/026 ,  C09C1/00 ,  Y10T428/1362 ,  Y10T428/1372 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T428/249952 ,  Y10T428/25 ,  Y10T428/263 ,  Y10T428/269 ,  Y10T428/31511 ,  C08L63/00

摘要： The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and en epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B] and [C]: [A] epoxy resin, [B] amine curing agent, and [C] phosphorus compound, wherein the concentration of the component [C] is 0.2 to 15% by weight in terms of phosphorus atom concentration.

摘要翻译： 本发明提供一种轻质纤维增强复合材料，其具有优异的阻燃性和机械性能，并且不会发出卤素气体。 本发明还提供了适于获得上述纤维增强复合材料的预浸料和环氧树脂组合物。 本发明还提供一种使用上述纤维增强复合材料制成的一体成型体，从而适用于电气/电子外壳。 环氧树脂组合物含有以下组分[A]，[B]和[C]：[A]环氧树脂，[B]胺固化剂和[C]磷化合物，其中组分 [C]按磷原子浓度计为0.2〜15重量％。

公开(公告)号：US08021752B2

公开(公告)日：2011-09-20

申请号：US10590442

申请日：2005-02-24

申请人： Shiro Honda ,  Ryuji Sawaoka ,  Koyomi Nakahara

发明人： Shiro Honda ,  Ryuji Sawaoka ,  Koyomi Nakahara

IPC分类号： B32B27/38 ,  B32B27/04 ,  B32B27/20 ,  B32B27/26 ,  C08K5/49 ,  C08L63/00

CPC分类号： C08K5/523 ,  B32B5/26 ,  B32B27/08 ,  B32B27/38 ,  B32B2250/02 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2439/00 ,  B32B2457/00 ,  C01P2004/61 ,  C01P2004/62 ,  C08G59/50 ,  C08G59/5006 ,  C08G59/5033 ,  C08J5/24 ,  C08K3/02 ,  C08K7/06 ,  C08K9/02 ,  C08K2003/026 ,  C09C1/00 ,  Y10T428/1362 ,  Y10T428/1372 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T428/249952 ,  Y10T428/25 ,  Y10T428/263 ,  Y10T428/269 ,  Y10T428/31511 ,  C08L63/00

摘要： The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and an epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B], [C], [D], and [E]: [A] epoxy resin, [B] amine curing agent, [C] phosphorus compound, [D] curing accelerator, and [E] thermoplastic resin, wherein the resin composition has a phosphorus atom concentration of 0.2 to 15% by weight.

摘要翻译： 本发明提供一种轻质纤维增强复合材料，其具有优异的阻燃性和机械性能，并且不会发出卤素气体。 本发明还提供一种适于获得上述纤维增强复合材料的预浸料和环氧树脂组合物。 本发明还提供一种使用上述纤维增强复合材料制成的一体成型体，从而适用于电气/电子外壳。 环氧树脂组合物含有以下组分[A]，[B]，[C]，[D]和[E]：[A]环氧树脂，[B]胺固化剂，[C] 化合物，[D]固化促进剂和[E]热塑性树脂，其中，所述树脂组合物的磷原子浓度为0.2〜15重量％。

公开(公告)号：US20080166511A1

公开(公告)日：2008-07-10

申请号：US10590442

申请日：2005-02-24

申请人： Masato Honma ,  Atsuki Tsuchiya ,  Shiro Honda ,  Ryuji Sawaoka ,  Koyomi Nakahara

发明人： Masato Honma ,  Atsuki Tsuchiya ,  Shiro Honda ,  Ryuji Sawaoka ,  Koyomi Nakahara

IPC分类号： C08K3/32 ,  B32B27/04 ,  B29D22/00

CPC分类号： C08K5/523 ,  B32B5/26 ,  B32B27/08 ,  B32B27/38 ,  B32B2250/02 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2439/00 ,  B32B2457/00 ,  C01P2004/61 ,  C01P2004/62 ,  C08G59/50 ,  C08G59/5006 ,  C08G59/5033 ,  C08J5/24 ,  C08K3/02 ,  C08K7/06 ,  C08K9/02 ,  C08K2003/026 ,  C09C1/00 ,  Y10T428/1362 ,  Y10T428/1372 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T428/249952 ,  Y10T428/25 ,  Y10T428/263 ,  Y10T428/269 ,  Y10T428/31511 ,  C08L63/00

摘要： The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and en epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B] and [C]: [A] epoxy resin, [B] amine curing agent, and [C] phosphorus compound, wherein the concentration of the component [C] is 0.2 to 15% by weight in terms of phosphorus atom concentration.

摘要翻译： 本发明提供一种轻质纤维增强复合材料，其具有优异的阻燃性和机械性能，并且不会发出卤素气体。 本发明还提供了适于获得上述纤维增强复合材料的预浸料和环氧树脂组合物。 本发明还提供一种使用上述纤维增强复合材料制成的一体成型体，从而适用于电气/电子外壳。 环氧树脂组合物含有以下组分[A]，[B]和[C]：[A]环氧树脂，[B]胺固化剂和[C]磷化合物，其中组分 [C]按磷原子浓度计为0.2〜15重量％。

公开(公告)号：US06515081B2

公开(公告)日：2003-02-04

申请号：US09319902

申请日：1999-06-14

申请人： Hiroki Oosedo ,  Ryuji Sawaoka ,  Shunsaku Noda ,  Naomi Miyoshi

发明人： Hiroki Oosedo ,  Ryuji Sawaoka ,  Shunsaku Noda ,  Naomi Miyoshi

IPC分类号： B32B2704

CPC分类号： C08J5/24 ,  C08G59/40 ,  C08J2363/00 ,  C08L67/06 ,  Y10T428/24994 ,  Y10T428/249952

摘要： A thermosetting resin composition for carbon fiber reinforced composite materials of the present invention chiefly comprises (A)2 thermosetting resin such as epoxy resin and a curing agent, and (B)2 compound containing one functional group which can react with thermosetting resin (A) or its curing agent, and a moiety selected from the following formulae (1) to (4) Furthermore, the present invention also relates to a prepreg formed by impregnating reinforcing fiber with the aforesaid resin composition and to carbon fiber reinforced composite materials comprising reinforcing fiber and a cured aforesaid thermosetting resin composition.

摘要翻译： 本发明的碳纤维增强复合材料用热固性树脂组合物主要包含（A）2种环氧树脂等热固性树脂和固化剂，（B）2种含有可与热固性树脂（A）反应的一种官能团的化合物， 或其固化剂和选自下式（1）至（4）的部分。此外，本发明还涉及通过用上述树脂组合物浸渍增强纤维和由增强纤维制成的碳纤维增强复合材料形成的预浸料 和上述固化的热固性树脂组合物。

公开(公告)号：US06410127B1

公开(公告)日：2002-06-25

申请号：US09700180

申请日：2001-11-08

申请人： Toshiya Kamae ,  Hiroki Oosedo ,  Shunsaku Noda ,  Shinji Kouchi ,  Ryuji Sawaoka

发明人： Toshiya Kamae ,  Hiroki Oosedo ,  Shunsaku Noda ,  Shinji Kouchi ,  Ryuji Sawaoka

IPC分类号： B32B2704

CPC分类号： C08L63/00 ,  C08G59/18 ,  C08G59/50 ,  C08G59/5033 ,  Y10T428/24994 ,  Y10T428/2918 ,  Y10T428/31511

摘要： An epoxy resin composition having a low viscosity around a room temperature and excellent reinforcing fiber impregnating properties provides a composite material having excellent heat resistance and mechanical properties including compressive strength. The epoxy resin composition includes an aromatic epoxy resin having at least di-functionality, an aromatic amine compound and/or an alicyclic amine compound, wherein 5 minutes after the main agent comprising the epoxy resin and the curing agent comprising the aromatic amine compound and/or the alicyclic amine compound are mixed, the composition shows a viscosity at 25° C. in the range of from 1 to 1500 mPa sec, and Tc, tc, and Tg satisfy the following equation (1): Tg≧Tc+20−k×(Tc−90)  (1), wherein k=0 when 60≦Tc

摘要翻译： 在室温下具有低粘度和优异的增强纤维浸渍性的环氧树脂组合物提供了具有优异的耐热性和包括抗压强度的机械性能的复合材料。 环氧树脂组合物包括具有至少二官能度的芳族环氧树脂，芳族胺化合物和/或脂环族胺化合物，其中包含环氧树脂的主剂和包含芳族胺化合物的固化剂和/ 或脂环族胺化合物混合时，组合物在25℃下的粘度在1〜1500mPa·sec的范围内，Tc，tc，Tg满足下式（1）：其中，当60时，k = 0 在90℃<= Tc <= 200时，Tc = 90℃，k = 0.35; Tc是固化过程中最高温度（℃），由式60定义= Tc <= 200; tc是保留 时间（min）在最高温度下，由公式1定义<= tc <= 120; Tg是在Tc（℃）下经过tc（min）后的环氧树脂组合物的玻璃化转变温度。