Method for reducing a surface glossiness of an organopolysiloxane-cured article
    1.
    发明申请
    Method for reducing a surface glossiness of an organopolysiloxane-cured article 有权
    降低有机聚硅氧烷固化物的表面光泽度的方法

    公开(公告)号:US20110071236A1

    公开(公告)日:2011-03-24

    申请号:US12956989

    申请日:2010-11-30

    IPC分类号: C08L83/04

    摘要: A method of reducing a surface glossiness of an organopolysiloxane-cured article is provided. The method comprises preparing the liquid organopolysiloxane composition for matting comprising: (A) 100 parts by weight of a thermosetting liquid organopolysiloxane composition having a specific gravity larger than the component (B), and (B) 0.1 to 100 parts by weight of a hollow filler having a melting point of at least 150° C., and a particle size of up to 200 μm, casting the liquid organopolysiloxane composition as a potting material or coating material; and curing the liquid organopolysiloxane composition at a temperature of 10 to 160 C for 30 to 180 minutes, whereby the hollow filler floats to the surface of the organopolysiloxane and forms surface irregularities on the surface of the cured article during curing to provide a surface glossiness of up to 40 in a cured article having a matted surface.

    摘要翻译: 提供了降低有机聚硅氧烷固化物的表面光泽度的方法。 该方法包括制备用于消光的液体有机基聚硅氧烷组合物,其包括:(A)100重量份比重大于组分(B)的热固性液体有机基聚硅氧烷组合物,和(B)0.1至100重量份的中空 填料的熔点至少为150℃,粒径可达200​​μm,将液体有机基聚硅氧烷组合物浇铸成灌封材料或涂料; 并在10至160℃的温度下固化液体有机基聚硅氧烷组合物30至180分钟,由此中空填料漂浮到有机聚硅氧烷的表面,并在固化期间在固化物的表面上形成表面凹凸,以提供表面光泽度 在具有无光表面的固化制品中至多40个。

    HEAT-CURABLE SILICONE COMPOSITION AND LIGHT EMITTING DIODE ELEMENT USING SAME
    2.
    发明申请
    HEAT-CURABLE SILICONE COMPOSITION AND LIGHT EMITTING DIODE ELEMENT USING SAME 有权
    使用相同的热固性硅酮组合物和发光二极管元素

    公开(公告)号:US20080076882A1

    公开(公告)日:2008-03-27

    申请号:US11859123

    申请日:2007-09-21

    申请人: Toshiyuki OZAI

    发明人: Toshiyuki OZAI

    IPC分类号: C08G77/38

    摘要: The present invention provides a heat-curable silicone resin composition that yields a cured product with excellent transparency and minimal discoloration over time, which is ideal as a protective material or lens material or the like for a light emitting diode element.The present invention provides a heat-curable silicone composition, comprising: (A) an organopolysiloxane having at least one structure represented by a general formula shown below within each molecule: (wherein, m represents an integer of 0, 1 or 2, R1 represents a hydrogen atom, phenyl group or halogenated phenyl group, R2 represents a hydrogen atom or methyl group, R3 represents a monovalent organic group of 1 to 10 carbon atoms, Z1 represents a bivalent group represented by —R4—, —R4O— or —R4(CH3)2SiO— (wherein, R4 represents a bivalent organic group of 1 to 10 carbon atoms), and Z2 represents an oxygen atom or a bivalent organic group of 1 to 10 carbon atoms), and (B) a quantity of an organic peroxide that is effective as a curing catalyst.

    摘要翻译: 本发明提供了一种可热固化的有机硅树脂组合物,其产生具有优异透明性和随时间变化最小变化的固化产物,其作为用于发光二极管元件的保护材料或透镜材料等是理想的。 本发明提供了一种可热固化的有机硅组合物,其包含:(A)在每个分子内具有至少一个由下列通式表示的结构的有机聚硅氧烷:(其中,m表示0,1或2的整数, SUP> 1 表示氢原子,苯基或卤代苯基,R 2表示氢原子或甲基,R 3表示一价有机基团 1〜10个碳原子,Z 1表示由-R 4,-R 4 O-或-R 4表示的二价基团, (其中,R 4表示1至10个碳原子的二价有机基团) 原子),Z 2表示氧原子或1〜10个碳原子的2价有机基团),(B)作为固化催化剂有效的有机过氧化物的量。