摘要:
A sound processing apparatus includes a target sound emphasizing unit configured to acquire a sound frequency component by emphasizing target sound in input sound in which the target sound and noise are included, a target sound suppressing unit configured to acquire a noise frequency component by suppressing the target sound in the input sound, a gain computing unit configured to compute a gain value to be multiplied by the sound frequency component using a gain function that provides a gain value and has a slope that are less than predetermined values when an energy ratio of the sound frequency component to the noise frequency component is less than or equal to a predetermined value, and a gain multiplier unit configured to multiply the sound frequency component by the gain value computed by the gain computing unit.
摘要:
An audio signal processing device includes a first microphone configured to pick up audio and output a first audio signal; a second microphone configured to pick up the audio and output a second audio signal; a first frequency converter configured to convert the first audio signal to a first audio spectrum signal; a second frequency converter configured to convert the second audio signal to a second audio spectrum signal; an operating sound estimating unit configured to estimate, based on the correlation between a sound emitting member that emits an operating sound and the first and second microphones, an operating sound spectrum signal indicating the operating sound, by calculating the first and second audio spectrum signals; and an operating sound reducing unit configured to reduce the estimated operating sound spectrum signal from the first and second audio spectrum signals.
摘要:
A voice processing device includes a zone detection unit which detects a voice zone including a voice signal or a non-steady sound zone including a non-steady signal other than the voice signal from an input signal and a filter calculation unit that calculates a filter coefficient for holding the voice signal in the voice zone and for suppressing the non-steady signal in the non-steady sound zone according to the detection result by the zone detection unit, in which the filter calculation unit calculates the filter coefficient by using a filter coefficient calculated in the non-steady sound zone for the voice zone and using a filter coefficient calculated in the voice zone for the non-steady sound zone.
摘要:
A sound processing device includes: a nonlinear processing unit that outputs a plurality of sound signals including sound sources existing in predetermined areas by performing a nonlinear process for a plurality of observed signals that are generated by a plurality of sound sources and are observed by a plurality of sensors; a signal selecting unit that selects a sound signal including a specific sound source from among the plurality of sound signals output by the nonlinear processing unit and the observed signal including the plurality of sound sources; and a sound separating unit that separates a sound signal including the specific sound source that is selected by the signal selecting unit from the observed signal selected by the signal selecting unit.
摘要:
A solid-state image pickup device includes a pixel unit configured to convert light into an electrical signal, an A/D converter configured to convert a signal read from the pixel unit into a digital signal, a light modulation unit configured to modulate an externally input light beam using the signal digitized by the A/D converter and output a signal light beam based on the signal read from the pixel unit, a timing generation unit configured to generate a synchronization signal used for synchronizing input and output of signals of the pixel unit, the A/D converter, and the light modulation unit, and a controller configured to control readout of the signal.
摘要:
A solid-state imaging device includes: a pixel portion configured to convert light into an electric signal; a substrate where the pixel portion is formed; an A/D conversion unit configured to convert a signal read out from the pixel portion into a digital signal; and an optical communication unit configured to convert a signal digitized by the A/D conversion unit into an optical signal, and output the optical signal, with the single optical communication unit or a plurality of the optical communication units being disposed grouped in the vicinity portion of the substrate around the pixel portion.
摘要翻译:固态成像装置包括:被配置为将光转换成电信号的像素部分; 形成像素部的基板; A / D转换单元,被配置为将从像素部读出的信号转换为数字信号; 以及光通信单元,其被配置为将由所述A / D转换单元数字化的信号转换为光信号,并且通过所述单个光通信单元或多个所述光通信单元被布置在所述附近部分中来输出所述光信号 的像素部分周围的基板。
摘要:
A solid-state imager includes a pixel unit for converting incident light into an electrical signal, a substrate bearing the pixel unit formed thereon, an analog-to-digital converter, formed on the substrate, for converting a signal read from the pixel unit into a digital signal, an optical communication unit, arranged on the bottom surface of the substrate opposite the surface of the substrate bearing opposite the top surface of the substrate bearing the pixel unit receiving the incident light, for converting the digital signal converted by the analog-to-digital converter into a light signal and outputting the light signal, and a signal line for transferring the digital signal, converted by the analog-to-digital converter, to the optical communication unit arranged on the bottom surface of the substrate.
摘要:
A solid-state image pickup device includes a pixel unit configured to convert light into an electrical signal; a substrate having a first side on which the pixel unit is formed and a second side opposite the first side; an optical communication unit disposed on the first side of the substrate, and configured to convert a signal read out from the pixel unit into an optical signal and output the optical signal; and a cooling unit disposed on the second side of the substrate and below at least a forming area of the optical communication unit, the forming area being an area where the optical communication unit is formed, and configured to cool or dissipate heat generated in the optical communication unit and transferred through the substrate.