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公开(公告)号：US08469285B2
公开(公告)日：2013-06-25
申请号：US12973043
申请日：2010-12-20
IPC分类号： B05B17/00
CPC分类号： B05C5/0237 , B05C5/0225 , B05C13/02 , G03F7/162
摘要： The present disclosure provides a chemical liquid supply nozzle capable of suppressing the drying process of chemical liquid with a low cost. The chemical liquid supply nozzle is provided with a cutoff valve and a suction unit that sucks chemical liquid to a suction flow path at a nozzle main body connected to a front end of flow path member. Accordingly, the chemical liquid remaining at the downstream side of the cutoff valve after the chemical liquid is discharged, is sucked toward the upstream side of the cutoff valve and removed, to thereby suppress the drying and solidifying process of the chemical liquid at the chemical liquid flow path. Also, there is no need to block the chemical liquid flow path by sucking thinner at the downstream side of chemical liquid flow path, and the number of dummy dispense may be reduced, thereby reducing an overall operation cost of the process.
摘要翻译： 本公开提供了能够以低成本抑制化学液体的干燥过程的化学液体供给喷嘴。 化学液体供给喷嘴设置有切断阀和吸引单元，该吸引单元将化学液体吸附到与流路构件的前端连接的喷嘴主体处的吸入流路。 因此，在排出药液之后残留在截止阀的下游侧的化学液体被吸向截止阀的上游侧并除去，从而抑制药液的化学液的干燥和固化过程 流路。 此外，不需要通过在化学液体流动路径的下游侧吸取稀薄剂来阻止化学液体流动路径，并且可以减少虚拟分配的数量，从而降低了处理的整体操作成本。
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公开(公告)号：US07736498B2
公开(公告)日：2010-06-15
申请号：US12434919
申请日：2009-05-04
IPC分类号： H01L21/20
CPC分类号： H01L21/67178 , H01L21/6715 , H01L21/67253
摘要： In the present invention, a plurality of exhaust paths connected to a plurality of cup bodies surrounding substrate holding portions respectively are joined together for common use, and the openings of exhaust rate adjustment sections provided on the exhaust paths are adjusted with reference to data in which combinations of the numbers of rotations of the substrate holding portions are associated with combinations of set exhaust rates of the exhaust paths when solution treatment is performed by rotating the substrate by the substrate holding portion. According to the present invention, the cup body can be exhausted at an intended exhaust rate at all times independently of the state where the substrate in which cup body is subjected to which process.
摘要翻译： 在本发明中，将分别连接在基板保持部周围的多个杯体的多个排气通路连接在一起，共同使用，并且参照其中的数据来调整设置在排气路径上的排气速率调节部分的开口 当通过基板保持部旋转基板进行固溶处理时，基板保持部的旋转数的组合与排气路径的设定排气速度的组合相关联。 根据本发明，杯体可以一直以预定的排气速度排出，而与杯体受到哪个处理的基板的状态无关。
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公开(公告)号：US20090214759A1
公开(公告)日：2009-08-27
申请号：US12434919
申请日：2009-05-04
IPC分类号： C23C16/52
CPC分类号： H01L21/67178 , H01L21/6715 , H01L21/67253
摘要： In the present invention, a plurality of exhaust paths connected to a plurality of cup bodies surrounding substrate holding portions respectively are joined together for common use, and the openings of exhaust rate adjustment sections provided on the exhaust paths are adjusted with reference to data in which combinations of the numbers of rotations of the substrate holding portions are associated with combinations of set exhaust rates of the exhaust paths when solution treatment is performed by rotating the substrate by the substrate holding portion. According to the present invention, the cup body can be exhausted at an intended exhaust rate at all times independently of the state where the substrate in which cup body is subjected to which process.
摘要翻译： 在本发明中，将分别连接在基板保持部周围的多个杯体的多个排气通路连接在一起，共同使用，并且参照其中的数据来调整设置在排气路径上的排气速率调节部分的开口 当通过基板保持部旋转基板进行固溶处理时，基板保持部的旋转数的组合与排气路径的设定排气速度的组合相关联。 根据本发明，杯体可以一直以预定的排气速度排出，而与杯体受到哪个处理的基板的状态无关。
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公开(公告)号：USD690330S1
公开(公告)日：2013-09-24
申请号：US29430388
申请日：2012-08-24
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公开(公告)号：US07547614B2
公开(公告)日：2009-06-16
申请号：US11139465
申请日：2005-05-31
IPC分类号： H01L21/20
CPC分类号： H01L21/67178 , H01L21/6715 , H01L21/67253
摘要： In the present invention, a plurality of exhaust paths connected to a plurality of cup bodies surrounding substrate holding portions respectively are joined together for common use, and the openings of exhaust rate adjustment sections provided on the exhaust paths are adjusted with reference to data in which combinations of the numbers of rotations of the substrate holding portions are associated with combinations of set exhaust rates of the exhaust paths when solution treatment is performed by rotating the substrate by the substrate holding portion. According to the present invention, the cup body can be exhausted at an intended exhaust rate at all times independently of the state where the substrate in which cup body is subjected to which process.
摘要翻译： 在本发明中，将分别连接在基板保持部周围的多个杯体的多个排气通路连接在一起，共同使用，并且参照其中的数据来调整设置在排气路径上的排气速率调节部分的开口 当通过基板保持部旋转基板进行固溶处理时，基板保持部的旋转数的组合与排气路径的设定排气速度的组合相关联。 根据本发明，杯体可以一直以预定的排气速度排出，而与杯体受到哪个处理的基板的状态无关。
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6.发明申请Complex pipe and coating/development processing apparatus equipped with complex pipe 审中-公开复杂管道和涂层/开发加工设备配备复杂的管道公开(公告)号：US20080289715A1
公开(公告)日：2008-11-27
申请号：US11907391
申请日：2007-10-11
CPC分类号： H01L21/6715
摘要： In a complex pipe, a plurality of pipe members containing at least a pipe member for liquid and a pipe member for electricity are fixed in parallel arrangement. One end of the complex pipe is connected to a stationary equipment and the other end is connected to a movable member. The plurality of pipe members are integrally combined by a cover member having flexibility. A liquid supply pipe is inserted with a space in the pipe member for liquid. A fluid for temperature adjustment is supplied to the space between the pipe member for liquid and the liquid supply pipe.
摘要翻译： 在复合管中，至少包含液体用管构件和电气用管构件的多个管构件并联配置。 复合管的一端连接到固定设备，另一端连接到可移动构件。 多个管构件通过具有柔性的盖构件一体地组合。 液体供给管在液体管构件中插入空间。 用于温度调节的流体被供应到用于液体的管件和液体供给管之间的空间。
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公开(公告)号：US20060189103A1
公开(公告)日：2006-08-24
申请号：US11139465
申请日：2005-05-31
IPC分类号： H01L21/20
CPC分类号： H01L21/67178 , H01L21/6715 , H01L21/67253
摘要： In the present invention, a plurality of exhaust paths connected to a plurality of cup bodies surrounding substrate holding portions respectively are joined together for common use, and the openings of exhaust rate adjustment sections provided on the exhaust paths are adjusted with reference to data in which combinations of the numbers of rotations of the substrate holding portions are associated with combinations of set exhaust rates of the exhaust paths when solution treatment is performed by rotating the substrate by the substrate holding portion. According to the present invention, the cup body can be exhausted at an intended exhaust rate at all times independently of the state where the substrate in which cup body is subjected to which process.
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公开(公告)号：US07287920B2
公开(公告)日：2007-10-30
申请号：US11354987
申请日：2006-02-16
IPC分类号： G03D5/00
CPC分类号： H01L21/67178 , H01L21/67017 , H01L21/67173 , H01L21/67742 , H01L21/67748 , H01L21/67754 , Y10S414/135
摘要： A semiconductor manufacturing apparatus includes a transfer mechanism including a moving part for holding a substrate to be processed and moving along a longitudinal transferring passage and a plurality of processing units for performing respective processes on the substrate. The processing units are disposed along the transferring passage and the substrate is transferred between the processing units and the transfer mechanism. An exhaust chamber is provided under the processing units, the exhaust chamber having a gas exhaust opening at the side of the transferring passage, the exhaust chamber. Further, a suction exhaust line is connected to the exhaust chamber, and a guide member is provided inside the exhaust chamber or at a position facing the opening, wherein the guide member extends along the transferring passage.
摘要翻译： 一种半导体制造装置，包括：传送机构，包括用于保持被处理基板的移动部件和沿纵向传送通道移动的多个处理单元，用于在基板上进行各自的处理。 处理单元沿着传送通道设置，并且基板在处理单元和传送机构之间传送。 排气室设置在处理单元的下方，排气室在输送通道一侧具有排气口，排气室。 此外，抽吸排气管线连接到排气室，并且引导构件设置在排气室内部或面向开口的位置处，其中引导构件沿着输送通道延伸。
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公开(公告)号：US20060194445A1
公开(公告)日：2006-08-31
申请号：US11354987
申请日：2006-02-16
CPC分类号： H01L21/67178 , H01L21/67017 , H01L21/67173 , H01L21/67742 , H01L21/67748 , H01L21/67754 , Y10S414/135
摘要： A semiconductor manufacturing apparatus includes a transfer mechanism including a moving part for holding a substrate to be processed and moving along a longitudinal transferring passage and a plurality of processing units for performing respective processes on the substrate. The processing units are disposed along the transferring passage and the substrate is transferred between the processing units and the transfer mechanism. An exhaust chamber is provided under the processing units, the exhaust chamber having a gas exhaust opening at the side of the transferring passage, the exhaust chamber. Further, a suction exhaust line is connected to the exhaust chamber, and a guide member is provided inside the exhaust chamber or at a position facing the opening, wherein the guide member extends along the transferring passage.
摘要翻译： 一种半导体制造装置，包括：传送机构，包括用于保持被处理基板的移动部件和沿纵向传送通道移动的多个处理单元，用于在基板上进行各自的处理。 处理单元沿着传送通道设置，并且基板在处理单元和传送机构之间传送。 排气室设置在处理单元的下方，排气室在输送通道一侧具有排气口，排气室。 此外，抽吸排气管线连接到排气室，并且引导构件设置在排气室内部或面向开口的位置处，其中引导构件沿着输送通道延伸。
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公开(公告)号：US09547443B2
公开(公告)日：2017-01-17
申请号：US13460634
申请日：2012-04-30
申请人： Shinichi Hayashi
发明人： Shinichi Hayashi
CPC分类号： G06F3/0611 , G06F3/0649 , G06F3/0685
摘要： A storage system includes plural types of storage devices that define a plurality of virtual volumes and a plurality of logical volumes. A storage controller is configured to manage the plurality of virtual volumes and the plurality of logical volumes, the plurality of virtual volumes defining first storage areas and the plurality of logical volumes defining second storage areas. A second storage area of the plurality of logical volumes is allocated to a first storage area of the plurality of virtual volumes. The storage controller is configured to determine whether data of a first storage area of a swap file is to be stored in the first tier storage device or the second tier storage device based on access information from an application server that manages a swap file information of the swap file.
摘要翻译： 存储系统包括定义多个虚拟卷和多个逻辑卷的多种类型的存储设备。 存储控制器被配置为管理多个虚拟卷和多个逻辑卷，多个虚拟卷定义第一存储区域和限定第二存储区域的多个逻辑卷。 多个逻辑卷的第二存储区域被分配给多个虚拟卷的第一存储区域。 存储控制器被配置为基于来自管理交换文件的交换文件信息的应用服务器的访问信息来确定交换文件的第一存储区域的数据是否要存储在第一层存储设备或第二层存储设备中 交换文件。
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