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1.发明申请ELECTRODE UNIT, SUBSTRATE PROCESSING APPARATUS, AND TEMPERATURE CONTROL METHOD FOR ELECTRODE UNIT 审中-公开电极单元，基板加工装置及电极单元的温度控制方法公开(公告)号：US20120273135A1
公开(公告)日：2012-11-01
申请号：US13544875
申请日：2012-07-09
申请人： Tsuyoshi HIDA , Jun Oyabu
发明人： Tsuyoshi HIDA , Jun Oyabu
CPC分类号： H01J37/3244 , H01J37/32009 , H01J37/32091 , H01J37/32724
摘要： An electrode unit is disposed in a substrate processing apparatus including a processing chamber for processing a substrate by plasma. The electrode unit includes an electrode layer having a surface exposed to inside of the processing chamber and an opposing surface disposed at the opposite side of the exposed surface, a heating layer and a cooling layer that the electrode layer, the heating layer and the cooling layer are disposed in said order from the processing chamber. The heating layer covers the opposing surface of the electrode layer while the cooling layer covers the opposing surface of the electrode layer via the heating layer, and a heat transfer layer filled up with a heat transfer medium is interposed between the heating layer and the cooling layer.
摘要翻译： 电极单元设置在包括用于通过等离子体处理衬底的处理室的衬底处理设备中。 电极单元包括具有暴露于处理室内部的表面的电极层和设置在暴露表面的相反侧的相对表面，加热层和冷却层，电极层，加热层和冷却层 以处理室的顺序排列。 加热层覆盖电极层的相对表面，而冷却层经由加热层覆盖电极层的相对表面，并且在加热层和冷却层之间插入填充有传热介质的传热层 。
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公开(公告)号：US20090243236A1
公开(公告)日：2009-10-01
申请号：US12410873
申请日：2009-03-25
申请人： Tsuyoshi HIDA , Takashi Yamamoto
发明人： Tsuyoshi HIDA , Takashi Yamamoto
CPC分类号： H01L21/6833 , H01L21/67115 , H01L21/6831 , Y10T29/49986 , Y10T279/23
摘要： An electrostatic chuck of a stack structure includes a metal layer interposed between insulating layers and a groove formed at a peripheral portion of the electrostatic chuck to have a width gradually increasing toward an outside, the groove being covered with a thermally sprayed insulating film. The thermally sprayed film covers at least a portion of the metal layer exposed at an inside of the groove such that the thermally sprayed film does not protrude from the groove.
摘要翻译： 堆叠结构的静电卡盘包括插入在绝缘层和形成在静电卡盘的周边部分的槽之间的金属层，其宽度朝向外部逐渐增加，槽被热喷涂的绝缘膜覆盖。 喷镀膜覆盖暴露在槽内部的金属层的至少一部分，使得喷镀膜不从槽突出。
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