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公开(公告)号：US20190009326A1
公开(公告)日：2019-01-10
申请号：US16026584
申请日：2018-07-03
申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Measurement Specialties (Chengdu) Ltd. , Shenzhen AMI Technology Co. Ltd
发明人： Yingcong Deng , Lan Gong , Qian Ying , Dandan Zhang , Lvhai Hu , Yun Liu , Qinglong Zeng , Yong Yan , Roberto Francisco-Yi Lu
IPC分类号： B21F1/02
摘要： A wire processing apparatus comprises a frame, a clamping device mounted on the frame and adapted to clamp a wire to be processed, and a straightening and cutting device mounted on the frame. The straightening and cutting device is adapted to press a conductor of the wire into a straight shape and cut the conductor to a predetermined length after pressing.
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公开(公告)号：US11000912B2
公开(公告)日：2021-05-11
申请号：US16532614
申请日：2019-08-06
申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Measurement Specialties (Chengdu) Ltd. , Shenzhen AMI Technology Co. Ltd.
发明人： Fengchun Xie , Dandan Zhang , Roberto Francisco-Yi Lu , Lvhai Hu , Qinglong Zeng , Lan Gong , Qian Ying , Yingcong Deng , Yun Liu
IPC分类号： B23K3/00 , B23K3/06 , B23K101/36
摘要： An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.
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公开(公告)号：US10933460B2
公开(公告)日：2021-03-02
申请号：US16026584
申请日：2018-07-03
申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Measurement Specialties (Chengdu) Ltd. , Shenzhen AMI Technology Co. Ltd
发明人： Yingcong Deng , Lan Gong , Qian Ying , Dandan Zhang , Lvhai Hu , Yun Liu , Qinglong Zeng , Yong Yan , Roberto Francisco-Yi Lu
摘要： A wire processing apparatus comprises a frame, a clamping device mounted on the frame and adapted to clamp a wire to be processed, and a straightening and cutting device mounted on the frame. The straightening and cutting device is adapted to press a conductor of the wire into a straight shape and cut the conductor to a predetermined length after pressing.
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公开(公告)号：US20200009783A1
公开(公告)日：2020-01-09
申请号：US16578960
申请日：2019-09-23
申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Shenzhen AMI Technology Co., Ltd. , Measurement Specialties (Chengdu) Ltd.
发明人： Fengchun Xie , Dandan Zhang , Roberto Francisco-Yi Lu , Lvhai Hu , Qinglong Zeng , Lan Gong , Qian Ying
摘要： An assembly system includes a feeding mechanism adapted to feed a heat shrinkable tube, a cutting mechanism, a clamping mechanism, a robot, and a vision system. The cutting mechanism is adapted to cut off a section of heat shrinkable tube with a predetermined length from the heat shrinkable tube fed by the feeding mechanism. The clamping mechanism is adapted to clamp the heat shrinkable tube during cutting the heat shrinkable tube with the cutting mechanism. The robot is adapted to grip the section of heat shrinkable tube cut off from the heat shrinkable tube. The vision system is adapted to guide the robot to sleeve the section of heat shrinkable tube onto a wire of an electrical device.
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公开(公告)号：US11141807B2
公开(公告)日：2021-10-12
申请号：US16685462
申请日：2019-11-15
申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Services GmbH , Measurement Specialties (Chengdu) Ltd. , Shenzhen AMI Technology Co., Ltd.
发明人： Fengchun Xie , Dandan Zhang , Roberto-Francisco Yi Lu , Lvhai Hu , Qinglong Zeng , Lan Gong , Qian Ying , Yingcong Deng , Yun Liu
IPC分类号： B23K1/00 , B23K3/00 , B23K3/06 , B23K1/08 , B23K101/38
摘要： A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.
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公开(公告)号：US20200091692A1
公开(公告)日：2020-03-19
申请号：US16686597
申请日：2019-11-18
申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Services GmbH , Measurement Specialties (Chengdu) Ltd. , Shenzhen AMI Technology Co., Ltd.
发明人： Fengchun Xie , Dandan Zhang , Roberto Francisco-Yi Lu , Lvhai Hu , Qinglong Zeng , Lan Gong , Qian Ying , Yingcong Deng , Yun Liu
摘要： An assembly system includes a feeding mechanism configured to feed a heat shrinkable tube, a cutting mechanism adapted to cut off a segment of heat shrinkable tube from the heat shrinkable tube, a robot adapted to grip the segment of heat shrinkable tube, and a vision system adapted to visually guide the robot to assemble the segment of heat shrinkable tube onto a wire of an electrical product.
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公开(公告)号：US20200094339A1
公开(公告)日：2020-03-26
申请号：US16685462
申请日：2019-11-15
申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Services GmbH , Measurement Specialties (Chengdu) Ltd. , Shenzhen AMI Technology Co., Ltd.
发明人： Fengchun Xie , Dandan Zhang , Roberto-Francisco Yi Lu , Lvhai Hu , Qinglong Zeng , Lan Gong , Qian Ying , Yingcong Deng , Yun Liu
摘要： A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.
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公开(公告)号：US11064614B2
公开(公告)日：2021-07-13
申请号：US16571541
申请日：2019-09-16
申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Measurement Specialties (Chengdu) Ltd.
发明人： Fengchun Xie , Dandan Zhang , Roberto Francisco-Yi Lu , Lvhai Hu , Qinglong Zeng , Lan Gong , Qian Ying , Yingcong Deng , Yun Liu
摘要： A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.
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公开(公告)号：US20200015359A1
公开(公告)日：2020-01-09
申请号：US16571541
申请日：2019-09-16
申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Measurement Specialties (Chengdu) Ltd.
发明人： Fengchun Xie , Dandan Zhang , Roberto Francisco-Yi Lu , Lvhai Hu , Qinglong Zeng , Lan Gong , Qian Ying , Yingcong Deng , Yun Liu
摘要： A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.
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公开(公告)号：US10773341B2
公开(公告)日：2020-09-15
申请号：US15611020
申请日：2017-06-01
申请人： Tyco Electronics (Shanghai) Co. Ltd. , Measurement Specialities (Chengdu) Ltd , TE Connectivity Corporation , Shenzhen AMI Technology Co., Ltd
发明人： Yingcong Deng , Lan Gong , Qian Ying , Dandan Zhang , Lvhai Hu , Yun Liu , Qinglong Zeng , Yong Yan , Roberto Francisco-Yi Lu
IPC分类号： B23K26/22 , B23K26/042 , B23K37/053 , B23K26/08 , B23K26/21 , B23K26/03 , B23K26/12 , B23K26/14 , B23K37/04 , B23K101/32
摘要： A welding system for welding a first elongated element and a second elongated element together by a laser beam that is emitted from a laser welding head after the ideal welding center point of the aligned first and second elongated elements has been positioned at a focal point of the laser beam that is emitted from the laser welding head.
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