公开(公告)号：US20160331044A1

公开(公告)日：2016-11-17

申请号：US14709169

申请日：2015-05-11

Applicant: Tyco Electronics Corporation

Inventor： Ting Gao ,  James Toth ,  Jialing Wang ,  Megan L. Hoarfrost ,  Vishrut Vipul Mehta

IPC: A41D1/00 ,  D06M23/00 ,  D21H25/04 ,  A41B1/08

CPC classification number: A41D1/002 ,  A41B1/08 ,  D06M11/83 ,  D06M23/00 ,  D06M23/16 ,  D06P5/003 ,  D21H25/04 ,  H01B1/22 ,  H01B1/24

Abstract: Processes of applying conductive composites on flexible materials, transfer assemblies, and garments including conductive composites are disclosed. The processes include positioning the conductive composite relative to the flexible material, the conductive composite having a resin matrix and conductive filler, and heating the conductive composite with an iron thereby applying the conductive composite directly onto the flexible material. Additionally or alternatively, the processes include positioning the conductive composite relative to the clothing, and heating the conductive composite thereby applying the conductive composite on the clothing. The garments include the flexible material and the conductive composite positioned directly on the flexible material. The transfer assembly has the conductive composite on a transfer substrate. The transfer substrate is capable of permitting heating of the conductive composite through the transfer substrate, the heating being at a temperature that permits applying the conductive composite to the flexible material.

Abstract translation: 公开了将导电复合材料应用于柔性材料，转移组件和包括导电复合材料的衣服的方法。 该方法包括相对于柔性材料定位导电复合材料，导电复合材料具有树脂基体和导电填料，并用铁加热导电复合材料，从而将导电复合材料直接施加到柔性材料上。 另外或替代地，所述方法包括相对于衣服定位导电复合材料，并且加热导电复合材料，由此将导电复合材料应用于衣服上。 服装包括柔性材料和直接位于柔性材料上的导电复合材料。 转印组件在转印衬底上具有导电复合材料。 转印衬底能够允许导电复合材料通过转印衬底进行加热，加热处于允许将导电复合材料应用于柔性材料的温度。

公开(公告)号：US20180086924A1

公开(公告)日：2018-03-29

申请号：US15275085

申请日：2016-09-23

Applicant: Tyco Electronics Corporation

Inventor： Megan Hoarfrost Beers ,  Jialing Wang ,  Quentin F. Polosky ,  Jaydip Das ,  Ting Gao ,  Vishrut Vipul Mehta

IPC: C09D5/24 ,  B29C67/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D109/06 ,  C09D177/00 ,  H01B1/20

CPC classification number: C09D5/24 ,  B29C64/106 ,  B29C64/118 ,  B29C64/165 ,  B29K2101/12 ,  B29K2105/16 ,  B29K2505/08 ,  B29K2505/10 ,  B29K2995/0005 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C08K3/08 ,  C08K5/098 ,  C08K2003/085 ,  C08K2003/385 ,  C08K2201/001 ,  C09D109/06 ,  C09D177/00 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24

Abstract: A method of forming a composite article, wherein the method includes providing a composite formulation, the composite formulation including a polymer matrix and at least one additive distributed in the polymer matrix at a concentration of between 10% and 50%, by volume, the at least one additive having a molar percentage of carbon that is equal to or less than 90%, feeding the composite formulation to a printing head of an additive manufacturing device, heating the composite formulation to form a heated composite formulation, extruding the heated composite formulation through a nozzle in the printing head, and depositing the heated composite formulation onto a platform to form the composite article. Also provided is a composite article produced from a composite formulation having at least one additive distributed in a polymer matrix.

公开(公告)号：US10201194B2

公开(公告)日：2019-02-12

申请号：US14709169

申请日：2015-05-11

Applicant: Tyco Electronics Corporation

Inventor： Ting Gao ,  James Toth ,  Jialing Wang ,  Megan L. Hoarfrost ,  Vishrut Vipul Mehta

IPC: A41D13/00 ,  A41D1/00 ,  D06P5/24 ,  D06M11/83 ,  D06M23/16 ,  A41B1/08 ,  D06M23/00 ,  D21H25/04 ,  H01B1/22

Abstract: Processes of applying conductive composites on flexible materials, transfer assemblies, and garments including conductive composites are disclosed. The processes include positioning the conductive composite relative to the flexible material, the conductive composite having a resin matrix and conductive filler, and heating the conductive composite with an iron thereby applying the conductive composite directly onto the flexible material. Additionally or alternatively, the processes include positioning the conductive composite relative to the clothing, and heating the conductive composite thereby applying the conductive composite on the clothing. The garments include the flexible material and the conductive composite positioned directly on the flexible material. The transfer assembly has the conductive composite on a transfer substrate. The transfer substrate is capable of permitting heating of the conductive composite through the transfer substrate, the heating being at a temperature that permits applying the conductive composite to the flexible material.