MEMS Vascular Sensor
    1.
    发明申请
    MEMS Vascular Sensor 有权
    MEMS血管传感器

    公开(公告)号:US20080210543A1

    公开(公告)日:2008-09-04

    申请号:US12041577

    申请日:2008-03-03

    IPC分类号: C23C14/34

    CPC分类号: B81C1/00246 G01N3/24

    摘要: A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.

    摘要翻译: 用于测量诸如流体剪切应力的血管参数的微加工传感器包括具有前侧表面的基底和与前侧表面相对的背侧表面。 传感器包括覆盖在衬底内蚀刻的空腔的膜片,以及设置在衬底的前侧表面上并且在空腔和隔膜顶部上的感热元件。 热敏元件可电连接到形成在基板的背面上的电极引线。 所述传感器包括连接到所述背面的电子系统,并且被配置为当通过向其施加电流来加热所述感测元件时,测量从所述感测元件到周围流体的热对流变化,并进一步被配置为从热变化 对流血管参数,例如流过感测元件的流体的剪切应力。

    MEMS vascular sensor
    2.
    发明授权
    MEMS vascular sensor 有权
    MEMS血管传感器

    公开(公告)号:US07367237B2

    公开(公告)日:2008-05-06

    申请号:US11196849

    申请日:2005-08-04

    IPC分类号: G01N3/24 G01F1/68

    CPC分类号: B81C1/00246 G01N3/24

    摘要: A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.

    摘要翻译: 用于测量诸如流体剪切应力的血管参数的微加工传感器包括具有前侧表面的基底和与前侧表面相对的背侧表面。 传感器包括覆盖在衬底内蚀刻的空腔的膜片,以及设置在衬底的前侧表面上并且在空腔和隔膜顶部上的感热元件。 热敏元件可电连接到形成在基板的背面上的电极引线。 所述传感器包括连接到所述背面的电子系统,并且被配置为当通过向其施加电流来加热所述感测元件时,测量从所述感测元件到周围流体的热对流变化,并进一步被配置为从热变化 对流血管参数,例如流过感测元件的流体的剪切应力。

    MEMS vascular sensor
    3.
    发明授权
    MEMS vascular sensor 有权
    MEMS血管传感器

    公开(公告)号:US08216434B2

    公开(公告)日:2012-07-10

    申请号:US12041577

    申请日:2008-03-03

    IPC分类号: C23C14/34

    CPC分类号: B81C1/00246 G01N3/24

    摘要: A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.

    摘要翻译: 用于测量诸如流体剪切应力的血管参数的微加工传感器包括具有前侧表面的基底和与前侧表面相对的背侧表面。 传感器包括覆盖在衬底内蚀刻的空腔的膜片,以及设置在衬底的前侧表面上并且在空腔和隔膜顶部上的感热元件。 热敏元件可电连接到形成在基板的背面上的电极引线。 所述传感器包括连接到所述背面的电子系统,并且被配置为当通过向其施加电流来加热所述感测元件时,测量从所述感测元件到周围流体的热对流变化,并进一步被配置为从热变化 对流血管参数,例如流过感测元件的流体的剪切应力。

    MEMS VASCULAR SENSOR
    4.
    发明申请
    MEMS VASCULAR SENSOR 审中-公开
    MEMS血管传感器

    公开(公告)号:US20120215121A1

    公开(公告)日:2012-08-23

    申请号:US13461716

    申请日:2012-05-01

    IPC分类号: A61B5/027

    CPC分类号: B81C1/00246 G01N3/24

    摘要: A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.

    摘要翻译: 用于测量诸如流体剪切应力的血管参数的微加工传感器包括具有前侧表面的基底和与前侧表面相对的背侧表面。 传感器包括覆盖在衬底内蚀刻的空腔的膜片,以及设置在衬底的前侧表面上并且在空腔和隔膜顶部上的感热元件。 热敏元件可电连接到形成在基板的背面上的电极引线。 所述传感器包括连接到所述背面的电子系统,并且被配置为当通过向其施加电流来加热所述感测元件时,测量从所述感测元件到周围流体的热对流变化,并进一步被配置为从热变化 对流血管参数,例如流过感测元件的流体的剪切应力。

    MEMS vascular sensor
    5.
    发明申请
    MEMS vascular sensor 有权
    MEMS血管传感器

    公开(公告)号:US20060081064A1

    公开(公告)日:2006-04-20

    申请号:US11196849

    申请日:2005-08-04

    IPC分类号: G01N3/24

    CPC分类号: B81C1/00246 G01N3/24

    摘要: A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.

    摘要翻译: 用于测量诸如流体剪切应力的血管参数的微加工传感器包括具有前侧表面的基底和与前侧表面相对的背侧表面。 传感器包括覆盖在衬底内蚀刻的空腔的膜片,以及设置在衬底的前侧表面上并且在空腔和隔膜顶部上的感热元件。 热敏元件可电连接到形成在基板的背面上的电极引线。 所述传感器包括连接到所述背面的电子系统,并且被配置为当通过向其施加电流来加热所述感测元件时,测量从所述感测元件到周围流体的热对流变化,并进一步被配置为从热变化 对流血管参数,例如流过感测元件的流体的剪切应力。