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公开(公告)号：US20080210543A1
公开(公告)日：2008-09-04
申请号：US12041577
申请日：2008-03-03
申请人： Tzung K. Hsiai , Gopkrishnani Soundararajan , E.S. Kim , Hongyu Yu , Mahsa Rouhanizadeh , Tiantian Lin
发明人： Tzung K. Hsiai , Gopkrishnani Soundararajan , E.S. Kim , Hongyu Yu , Mahsa Rouhanizadeh , Tiantian Lin
IPC分类号： C23C14/34
CPC分类号： B81C1/00246 , G01N3/24
摘要： A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.
摘要翻译： 用于测量诸如流体剪切应力的血管参数的微加工传感器包括具有前侧表面的基底和与前侧表面相对的背侧表面。 传感器包括覆盖在衬底内蚀刻的空腔的膜片，以及设置在衬底的前侧表面上并且在空腔和隔膜顶部上的感热元件。 热敏元件可电连接到形成在基板的背面上的电极引线。 所述传感器包括连接到所述背面的电子系统，并且被配置为当通过向其施加电流来加热所述感测元件时，测量从所述感测元件到周围流体的热对流变化，并进一步被配置为从热变化 对流血管参数，例如流过感测元件的流体的剪切应力。
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公开(公告)号：US07367237B2
公开(公告)日：2008-05-06
申请号：US11196849
申请日：2005-08-04
申请人： Tzung K. Hsiai , Gopkrishnani Soundararajan , E. S. Kim , Hongyu Yu , Mahsa Rouhanizadeh , Tiantian Lin
发明人： Tzung K. Hsiai , Gopkrishnani Soundararajan , E. S. Kim , Hongyu Yu , Mahsa Rouhanizadeh , Tiantian Lin
CPC分类号： B81C1/00246 , G01N3/24
摘要： A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.
摘要翻译： 用于测量诸如流体剪切应力的血管参数的微加工传感器包括具有前侧表面的基底和与前侧表面相对的背侧表面。 传感器包括覆盖在衬底内蚀刻的空腔的膜片，以及设置在衬底的前侧表面上并且在空腔和隔膜顶部上的感热元件。 热敏元件可电连接到形成在基板的背面上的电极引线。 所述传感器包括连接到所述背面的电子系统，并且被配置为当通过向其施加电流来加热所述感测元件时，测量从所述感测元件到周围流体的热对流变化，并进一步被配置为从热变化 对流血管参数，例如流过感测元件的流体的剪切应力。
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公开(公告)号：US08216434B2
公开(公告)日：2012-07-10
申请号：US12041577
申请日：2008-03-03
申请人： Tzung K. Hsiai , Gopikrishnan Soundararajan , Eun Sok Kim , Hongyu Yu , Mahsa Rouhanizadeh , Christina Tiantian Lin
发明人： Tzung K. Hsiai , Gopikrishnan Soundararajan , Eun Sok Kim , Hongyu Yu , Mahsa Rouhanizadeh , Christina Tiantian Lin
IPC分类号： C23C14/34
CPC分类号： B81C1/00246 , G01N3/24
摘要： A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.
摘要翻译： 用于测量诸如流体剪切应力的血管参数的微加工传感器包括具有前侧表面的基底和与前侧表面相对的背侧表面。 传感器包括覆盖在衬底内蚀刻的空腔的膜片，以及设置在衬底的前侧表面上并且在空腔和隔膜顶部上的感热元件。 热敏元件可电连接到形成在基板的背面上的电极引线。 所述传感器包括连接到所述背面的电子系统，并且被配置为当通过向其施加电流来加热所述感测元件时，测量从所述感测元件到周围流体的热对流变化，并进一步被配置为从热变化 对流血管参数，例如流过感测元件的流体的剪切应力。
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公开(公告)号：US20120215121A1
公开(公告)日：2012-08-23
申请号：US13461716
申请日：2012-05-01
申请人： Tzung K. Hsiai , Gopikrishnan Soundararajan , Eun Sok Kim , Hongyu Yu , Mahsa Rouhanizadeh , Christina Tiantian Lin
发明人： Tzung K. Hsiai , Gopikrishnan Soundararajan , Eun Sok Kim , Hongyu Yu , Mahsa Rouhanizadeh , Christina Tiantian Lin
IPC分类号： A61B5/027
CPC分类号： B81C1/00246 , G01N3/24
摘要： A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.
摘要翻译： 用于测量诸如流体剪切应力的血管参数的微加工传感器包括具有前侧表面的基底和与前侧表面相对的背侧表面。 传感器包括覆盖在衬底内蚀刻的空腔的膜片，以及设置在衬底的前侧表面上并且在空腔和隔膜顶部上的感热元件。 热敏元件可电连接到形成在基板的背面上的电极引线。 所述传感器包括连接到所述背面的电子系统，并且被配置为当通过向其施加电流来加热所述感测元件时，测量从所述感测元件到周围流体的热对流变化，并进一步被配置为从热变化 对流血管参数，例如流过感测元件的流体的剪切应力。
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公开(公告)号：US20060081064A1
公开(公告)日：2006-04-20
申请号：US11196849
申请日：2005-08-04
申请人： Tzung Hsiai , Gopikrishnan Soundararajan , E. Kim , Hongyu Yu , Mahsa Rouhanizadeh , Tiantian Lin
发明人： Tzung Hsiai , Gopikrishnan Soundararajan , E. Kim , Hongyu Yu , Mahsa Rouhanizadeh , Tiantian Lin
IPC分类号： G01N3/24
CPC分类号： B81C1/00246 , G01N3/24
摘要： A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.
摘要翻译： 用于测量诸如流体剪切应力的血管参数的微加工传感器包括具有前侧表面的基底和与前侧表面相对的背侧表面。 传感器包括覆盖在衬底内蚀刻的空腔的膜片，以及设置在衬底的前侧表面上并且在空腔和隔膜顶部上的感热元件。 热敏元件可电连接到形成在基板的背面上的电极引线。 所述传感器包括连接到所述背面的电子系统，并且被配置为当通过向其施加电流来加热所述感测元件时，测量从所述感测元件到周围流体的热对流变化，并进一步被配置为从热变化 对流血管参数，例如流过感测元件的流体的剪切应力。
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6.发明申请公开(公告)号：US20080302675A1
公开(公告)日：2008-12-11
申请号：US12134938
申请日：2008-06-06
申请人： Tzung K. Hsiai , Hongyu Yu , Eun Sok Kim , Lisong Ai
发明人： Tzung K. Hsiai , Hongyu Yu , Eun Sok Kim , Lisong Ai
CPC分类号： A61B5/6852 , A61B5/01 , A61B5/02007 , A61B5/02141 , A61B5/0215 , A61B5/02156 , A61B5/026 , A61B5/027 , A61B5/053 , A61B2562/0261 , A61B2562/0271 , A61B2562/12 , A61B2562/125 , A61B2562/222 , A61M2025/0002 , A61M2205/3368 , B05D7/50 , G01K13/002
摘要： A flexible, polymer-based biosensor deployable into the arterial system which can assess shear stress in the arterial geometry in the presence of time-varying component of blood flow. Also, a method of fabricating a biosensor which may be used for in vivo procedures, involving the sequential depositing onto a substrate of a silicon dioxide layer, a metal heating element on the silicon dioxide layer, and a biocompatible polymer on the heating element, followed by etching the polymer layer to provide holes to allow for electrode contact with the heating element. A second metal layer is then deposited to form electrodes, followed by a second biocompatible polymer layer to form the device structure and removing the fabricated biosensor from the substrate by etching the substrate. In addition, a method of determining intravascular shear stress by measuring the temperature, flow rate and pressure of a bodily fluid with a biocompatible biosensor is disclosed.
摘要翻译： 柔性的基于聚合物的生物传感器可部署到动脉系统中，其可以在存在血流时变分量的情况下评估动脉几何形状中的剪切应力。 此外，制造可用于体内程序的生物传感器的方法，包括顺序沉积到二氧化硅层的基底上，二氧化硅层上的金属加热元件和加热元件上的生物相容性聚合物，随后 通过蚀刻聚合物层以提供孔以允许电极与加热元件接触。 然后沉积第二金属层以形成电极，随后是第二生物相容性聚合物层以形成器件结构，并通过蚀刻衬底从衬底去除所制造的生物传感器。 另外，公开了通过用生物相容性生物传感器测量体液的温度，流速和压力来确定血管内剪切应力的方法。
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公开(公告)号：US10082391B2
公开(公告)日：2018-09-25
申请号：US15292869
申请日：2016-10-13
申请人： Hongyu Yu , Mengbing Liang
发明人： Hongyu Yu , Mengbing Liang
CPC分类号： G01C9/18 , G01B13/18 , G01C2009/182 , G01D5/16
摘要： Sensors for measuring rotation about an axis are disclosed, along with methods of making and using the same. The sensors can utilize ionic liquids and electrodes that provide a unique electrical signal at each angle of rotation about an axis. The sensors can include a solid structure with a channel that circumnavigates the axis, electrodes disposed within the channel, and an ionic liquid positioned within the channel.
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公开(公告)号：US20210354298A1
公开(公告)日：2021-11-18
申请号：US16874704
申请日：2020-05-15
申请人： Yuefeng Li , Wenyu Feng , Hongyu Yu
发明人： Yuefeng Li , Wenyu Feng , Hongyu Yu
摘要： The invention disclosure a remotely operated pneumatic manipulator based on Kinect, comprising Kinect sensor, computer, D/A embedded board, PWM piezoelectric pneumatic ratio valve, pneumatic triad, air compressor, artificial muscle, spring and finger joint, wherein the Kinect sensor is provided on one side of the finger joint, a camera module of the Kinect sensor is faced to the finger joint. The pneumatic humanoid manipulator of the invention has basically the same dimensions as human hands, can achieve human-computer interaction and remotely operation, the transmission structure thereof is novel, simple and compact, the fingers thereon are convenient to control and flexible to move, the finger movement range is large for wide application, moreover, the PWM piezoelectric pneumatic ratio valve is with advantages of fast dynamic response, low cost, strong resistance to noise, and high detection accuracy of Kinect sensor.
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公开(公告)号：US20050285208A1
公开(公告)日：2005-12-29
申请号：US11149975
申请日：2005-06-10
申请人： Chi Ren , Hongyu Yu , Siu Hung Daniel Chan , Ming-Fu Li , Dim-Lee Kwong
发明人： Chi Ren , Hongyu Yu , Siu Hung Daniel Chan , Ming-Fu Li , Dim-Lee Kwong
IPC分类号： H01L21/28 , H01L21/8238 , H01L29/49 , H01L29/76
CPC分类号： H01L29/4966 , H01L21/28088 , H01L21/823842
摘要： A gate electrode for semiconductor devices, the gate electrode comprising a mixture of a metal having a work function of about 4 eV or less and a metal nitride.
摘要翻译： 一种用于半导体器件的栅电极，所述栅电极包括功函数为约4eV或更小的金属和金属氮化物的混合物。
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10.发明申请MICROFABRICATION TECHNOLOGY FOR PRODUCING SENSING CELLS FOR MOLECULAR ELECTRONIC TRANSDUCER BASED SEISMOMETER 审中-公开用于生产用于分子式电子传感器的地震仪的感应电池的微生物技术公开(公告)号：US20160291176A1
公开(公告)日：2016-10-06
申请号：US15037449
申请日：2014-11-20
摘要： The invention relates to microfabrication technology for producing sensing cells, for use, for example, in molecular electronic transducer (MET) based seismometers devices. In some aspects, a method for fabricating a sensing element is provided. The method includes providing a first wafer including a first substrate, a second substrate, and a first insulating layer between therebetween, etching a first fluid throughhole through the first substrate, the first insulating layer, and the second substrate, and coating the first substrate and second substrate with a first and second conductive coating, respectively. The method also includes providing a second wafer including a third substrate, a fourth substrate, and a second insulating layer therebetween, etching a second fluid throughhole through the third substrate, the second insulating layer, and the fourth substrate, and coating the third substrate with a third conductive coating from top and the fourth substrate with a fourth conductive coating from back.
摘要翻译： 本发明涉及用于生产感测单元的微细加工技术，其用于例如基于分子电子换能器（MET）的地震仪装置中。 在一些方面，提供了一种用于制造感测元件的方法。 该方法包括提供包括第一衬底，第二衬底和第二衬底之间的第一绝缘层的第一晶片，通过第一衬底，第一绝缘层和第二衬底蚀刻第一流体通孔，以及涂覆第一衬底和 第二基板分别具有第一和第二导电涂层。 该方法还包括提供包括第三衬底，第四衬底和第二绝缘层的第二晶片，通过第三衬底，第二绝缘层和第四衬底蚀刻第二流体通孔，并且用第 来自顶部和第四基底的第三导电涂层，其后面具有第四导电涂层。
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