公开(公告)号：US10178813B2

公开(公告)日：2019-01-08

申请号：US15416495

申请日：2017-01-26

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Lauren M. Boteler ,  Damian P. Urciuoli

IPC: H05K7/20 ,  H02M3/158

Abstract: A power module including a plurality of power die layers including power electronic components; a plurality of heat sink components operatively connected to multiple sides of each power electronic component; a plurality of electrically conductive layers contacting the plurality of heat sink components, wherein a power die layer and an electrically conductive layer sequentially alternate to form a stacked structure such that both ends of the stacked structure includes an end electrically conductive layer. A cooling path is integrated with each layer in the stacked structure. A housing unit houses the stacked structure. The power electronic components may include heat-producing electronic devices. The cooling path may accommodate any of a fluid and solid to liquid phase change materials. The fluid comes into direct contact with the power die layers, heat sink components, and electrically conductive layers.

公开(公告)号：US20180213676A1

公开(公告)日：2018-07-26

申请号：US15416495

申请日：2017-01-26

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Lauren M. Boteler ,  Damian P. Urciuoli

IPC: H05K7/20 ,  H02M3/158

CPC classification number: H05K7/2089 ,  H01L2224/48227 ,  H02M3/158 ,  H05K7/209 ,  H05K7/20909 ,  H05K7/20927

Abstract: A power module including a plurality of power die layers including power electronic components; a plurality of heat sink components operatively connected to multiple sides of each power electronic component; a plurality of electrically conductive layers contacting the plurality of heat sink components, wherein a power die layer and an electrically conductive layer sequentially alternate to form a stacked structure such that both ends of the stacked structure includes an end electrically conductive layer. A cooling path is integrated with each layer in the stacked structure. A housing unit houses the stacked structure. The power electronic components may include heat-producing electronic devices. The cooling path may accommodate any of a fluid and solid to liquid phase change materials. The fluid comes into direct contact with the power die layers, heat sink components, and electrically conductive layers.