公开(公告)号：US20020007965A1

公开(公告)日：2002-01-24

申请号：US09248533

申请日：1999-02-11

Applicant: U.S. Philips Corporation

Inventor： THOMAS RIENER ,  PETER SCHMALLEGGER

IPC: H05K001/16

CPC classification number: H01L24/97 ,  H01L21/4867 ,  H01L23/3121 ,  H01L23/49855 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49109 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: In a module tape (1) comprising modules (2) and comprising a carrier layer (19) to which a plurality of contact-bound-mode module contact zones (9, 10, 11) are attached at the location of a first layer side (20) and to which a plurality of contactless-mode module contact zones (14, 15) are attached at the location of a second layer side (22), the contactless-mode module contact zones (14, 15) are formed by conductor zones deposited on the carrier layer (19) by means of a printing method.

Abstract translation: 在包括模块（2）并且包括载体层（19）的模块带（1）中，多个接触限制模块模块接触区（9,10,11）在第一层侧的位置附接到载体层 （20），并且在第二层侧（22）的位置处附接有多个非接触模式模块接触区（14,15），所述非接触模式模块接触区（14,15）由导体 通过印刷方法沉积在载体层（19）上的区域。