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    DEPOSITION OF COPPER-TIN AND COPPER-TIN-ZINC ALLOYS FROM AN ELECTROLYTE
    3.
    发明申请
    DEPOSITION OF COPPER-TIN AND COPPER-TIN-ZINC ALLOYS FROM AN ELECTROLYTE 审中-公开
    从电解液中沉积铜和铜 - 锌合金

    公开(公告)号：US20160348259A1

    公开(公告)日：2016-12-01

    申请号：US15102051

    申请日：2014-12-11

    申请人： UMICORE GALVANOTECHNIK GMBH

    发明人： Klaus Bronder ,  Sascha Berger ,  Bernd Weyhmueller ,  Uwe Manz

    IPC分类号： C25D3/58 ,  C25D3/60 ,  C25D17/10

    CPC分类号： C25D3/58 ,  C25D3/60 ,  C25D17/10

    摘要： The present invention relates to a cyanide-free electrolyte which contains a phosphate and aliphatic or aromatic thio compounds and also to a process for the electrolytic deposition of an alloy of the elements copper and tin and optionally zinc. The electrolyte and the process are characterized in that stannate ions and copper ions and optionally zinc(II) ions and also aliphatic and/or aromatic thio compounds are present in the electrolyte used. The electrolyte can optionally additionally contain carboxylic acids, wetting agents and/or brighteners. The present invention further provides a process for the electrolytic deposition of alloys of copper, tin and optionally zinc on consumer goods and decorative goods using the electrolyte of the invention.

    摘要翻译： 本发明涉及一种不含氰化物的电解质，其含有磷酸酯和脂族或芳族硫代化合物，并且还涉及电解沉积元素铜和锡以及任选的锌的合金的方法。 电解质和方法的特征在于，在所用的电解质中存在锡酸根离子和铜离子以及任选的锌（II）离子以及脂族和/或芳族硫代化合物。 电解质可任选地另外含有羧酸，润湿剂和/或增白剂。 本发明还提供了使用本发明的电解质将铜，锡和任选的锌的合金电解沉积在消费品和装饰品上的方法。