-
公开(公告)号：US20240035184A1
公开(公告)日：2024-02-01
申请号：US18256321
申请日：2021-12-10
发明人： Sascha Berger , Klaus Bronder , Claudia Blum , Bernd Weyhmueller , Uwe Manz , Stephan Maier
CPC分类号： C25D3/64 , C22C5/06 , B32B15/018
摘要： The present invention relates to an electrolyte for deposition of hard silver layers, wherein the element bismuth is alloyed to the silver. The invention also relates to a method for deposition of a corresponding silver-bismuth alloy from an electrolyte according to the invention and to a correspondingly deposited layer.
-
公开(公告)号：US20240060203A1
公开(公告)日：2024-02-22
申请号：US18256925
申请日：2021-12-17
发明人： Uwe Manz
摘要： The present invention is directed toward a method for stabilizing the electrolytic deposition of platinum from an electrolytic bath. In particular, the present invention relates to a corresponding method in which the platinum electrolytic bath has platinum in the form of a sulfamate complex.
-
公开(公告)号：US20240287698A1
公开(公告)日：2024-08-29
申请号：US18573503
申请日：2022-06-30
发明人： Robert Ziebart , Guenter Wirth , Silvia Neuhaus , Stefan Mueller
IPC分类号： C25D3/58 , B32B15/01 , C22C9/02 , C22C9/04 , C22C13/00 , C22C30/02 , C22C30/04 , C22C30/06 , C25D5/10 , C25D5/12 , G06K19/077
CPC分类号： C25D3/58 , B32B15/01 , C22C9/02 , C22C9/04 , C22C13/00 , C22C30/02 , C22C30/04 , C22C30/06 , C25D5/10 , C25D5/12 , G06K19/07722
摘要： The invention is directed to the use of electrolytic bronze deposits as substitutes for the noble metal electroplating of electronic circuits, e.g. for use in electronic payment cards and identity cards. The invention also relates to a novel layer sequence of bronze layers.
-
公开(公告)号：US20220205122A1
公开(公告)日：2022-06-30
申请号：US17260090
申请日：2019-08-20
发明人： Sascha Berger , Klaus Bronder , Mario Tomazzoni , Uwe Manz
IPC分类号： C25D3/46 , C25D21/12 , C25D17/10 , C07D233/74 , C25D3/64
摘要： The present invention relates to an electrolyte and to a method for the electrolytic deposition of silver coatings and silver alloy coatings. The electrolyte according to the invention is cyanide-free, storage-stable and ensures the deposition of high-gloss, brilliant and white silver and silver alloy layers for technical and decorative applications.
-
公开(公告)号：US20190071789A1
公开(公告)日：2019-03-07
申请号：US15767234
申请日：2016-10-19
发明人： Bernd WEYHMUELLER , Alexander PETERS , Uwe MANZ
IPC分类号： C25D3/64
摘要： The present invention relates to an electrolyte containing suitable reducing agents for adjusting the composition of silver-palladium layers. Furthermore, these reducing agents contribute to improving the layer appearance and to increasing the luminance (L value, CIE Lab) of the deposited layers. The present invention also discloses a method for the electrolytic deposition of silver-rich silver-palladium alloys. The alloys can be deposited on conductive surfaces over a wide current density range.
-
公开(公告)号：US20240150920A1
公开(公告)日：2024-05-09
申请号：US18550784
申请日：2022-03-28
发明人： Uwe Manz , Bernd Weyhmueller
摘要： The present invention is directed toward a platinum electrolyte which contains certain additives, and to a method for the electrolytic deposition of a platinum layer with the aid of the electrolyte according to the invention.
-
公开(公告)号：US20220136124A1
公开(公告)日：2022-05-05
申请号：US17433215
申请日：2020-04-07
发明人： Philip Schramek , Martin Stegmaier
摘要： The present invention is directed toward an electrolyte which allows for electrolytically producing a black metal layer consisting of rhodium and ruthenium. The present invention also relates to a method for producing a corresponding article, and to the use of the electrolyte.
-
8.发明申请公开(公告)号：US20160348259A1
公开(公告)日：2016-12-01
申请号：US15102051
申请日：2014-12-11
发明人： Klaus Bronder , Sascha Berger , Bernd Weyhmueller , Uwe Manz
摘要： The present invention relates to a cyanide-free electrolyte which contains a phosphate and aliphatic or aromatic thio compounds and also to a process for the electrolytic deposition of an alloy of the elements copper and tin and optionally zinc. The electrolyte and the process are characterized in that stannate ions and copper ions and optionally zinc(II) ions and also aliphatic and/or aromatic thio compounds are present in the electrolyte used. The electrolyte can optionally additionally contain carboxylic acids, wetting agents and/or brighteners. The present invention further provides a process for the electrolytic deposition of alloys of copper, tin and optionally zinc on consumer goods and decorative goods using the electrolyte of the invention.
摘要翻译： 本发明涉及一种不含氰化物的电解质，其含有磷酸酯和脂族或芳族硫代化合物，并且还涉及电解沉积元素铜和锡以及任选的锌的合金的方法。 电解质和方法的特征在于，在所用的电解质中存在锡酸根离子和铜离子以及任选的锌（II）离子以及脂族和/或芳族硫代化合物。 电解质可任选地另外含有羧酸，润湿剂和/或增白剂。 本发明还提供了使用本发明的电解质将铜，锡和任选的锌的合金电解沉积在消费品和装饰品上的方法。
-
9.发明申请ELECTROLYTE FOR THE ELECTROLYTIC DEPOSITION OF SILVER-PALLADIUM ALLOYS AND METHOD FOR DEPOSITION THEREOF 有权用于银 - 钯合金的电解沉积的电解质及其沉积方法公开(公告)号：US20160177462A1
公开(公告)日：2016-06-23
申请号：US14910138
申请日：2014-07-24
发明人： Bernd WEYHMUELLER , Uwe MANZ , Sascha BERGER
摘要： The present invention relates to an electrolyte and to a method for the electrolytic deposition of silver-rich silver-palladium alloys which to a minor degree also include selenium and/or tellurium. The electrolyte of the invention allows uniform deposition of such an alloy on conductive surfaces across a wide range of current densities.
摘要翻译： 本发明涉及一种电解质和一种电解沉积富银银钯合金的方法，其中较小程度上还包括硒和/或碲。 本发明的电解质允许这种合金在导电表面上均匀地沉积在宽的电流密度范围内。
-
公开(公告)号：US20240018679A1
公开(公告)日：2024-01-18
申请号：US18253065
申请日：2021-11-25
发明人： Sascha Berger , Klaus Bronder , Uwe Manz , Martin Pohl , Martin Stegmaier , Matthias Wahl
摘要： Aqueous electrolyte for deposition of a ruthenium alloy layer on metal surfaces, in particular base metal surfaces, its use and a corresponding electrolytic process, and a correspondingly produced layer sequence.
-
-
-
-
-
-
-
-
-
搜索结果
14 条记录 (耗时 0.011 秒)
