公开(公告)号：US10395999B1

公开(公告)日：2019-08-27

申请号：US15981053

申请日：2018-05-16

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Cheng-Hao Yang ,  En-Chiuan Liou ,  Hsiao-Lin Hsu ,  Tang-Chun Weng ,  Chia-Ching Lin ,  Yen-Pu Chen

IPC: H01L21/308 ,  H01L27/02 ,  H01L21/66 ,  H01L29/66

Abstract: A method for monitoring fin removal includes providing a substrate having a first region with first fins extending along a first direction and a second region with second fins extending along a second direction, wherein the first direction is perpendicular to the second direction; forming a material layer on the substrate to cover the first fins and the second fins; identically patterning the first fins and the second fins using a first pattern and a second pattern respectively for simultaneously removing parts of the first and second fins, thereby forming first fin features in the first region and second fin features in the second region, wherein the first pattern has a first dimension along the second direction, the second pattern has a second dimension along the second direction, and the second dimension is equal to the first dimension; and monitoring the first fin features using the second fin features.