公开(公告)号：US20180356347A1

公开(公告)日：2018-12-13

申请号：US16108054

申请日：2018-08-21

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yung-Teng Tsai ,  Hung-Chin Lin ,  Chia-Chen Sun ,  Chih-Yu Wu ,  Jun-Ming Chen ,  Chung-Chih Hung ,  Sheng-Chieh Chen

IPC: G01N21/93 ,  H01L23/544 ,  H01L21/66 ,  G01N21/95

CPC classification number: G01N21/93 ,  G01N21/9501 ,  H01L22/32 ,  H01L23/544 ,  H01L2223/54426 ,  H01L2223/5446

Abstract: A semiconductor structure includes a wafer comprising a plurality of viewing fields defined thereon, a plurality of dies defined by a scribe line formed in each viewing field, a plurality of mark patterns formed in the scribe line, and a plurality of anchor pattern respectively formed in the review fields, the anchor patterns being different from the mark patterns.

公开(公告)号：US20180188185A1

公开(公告)日：2018-07-05

申请号：US15396805

申请日：2017-01-02

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yung-Teng Tsai ,  Hung-Chin Lin ,  Chia-Chen Sun ,  Chih-Yu Wu ,  Jun-Ming Chen ,  Chung-Chih Hung ,  Sheng-Chieh Chen

IPC: G01N21/93 ,  H01L21/66 ,  H01L23/544 ,  G01N21/95

CPC classification number: G01N21/93 ,  G01N21/9501 ,  H01L22/32 ,  H01L23/544 ,  H01L2223/54426 ,  H01L2223/5446

Abstract: A semiconductor structure includes a wafer comprising a plurality of viewing fields defined thereon, a plurality of dies defined by a scribe line formed in each viewing field, a plurality of mark patterns formed in the scribe line, and a plurality of anchor pattern respectively formed in the review fields, the anchor patterns being different from the mark patterns.

公开(公告)号：US10156526B1

公开(公告)日：2018-12-18

申请号：US16108054

申请日：2018-08-21

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yung-Teng Tsai ,  Hung-Chin Lin ,  Chia-Chen Sun ,  Chih-Yu Wu ,  Jun-Ming Chen ,  Chung-Chih Hung ,  Sheng-Chieh Chen

IPC: G01N21/00 ,  G01N21/93 ,  G01N21/95 ,  H01L23/544 ,  H01L21/66

Abstract: A semiconductor structure includes a wafer comprising a plurality of viewing fields defined thereon, a plurality of dies defined by a scribe line formed in each viewing field, a plurality of mark patterns formed in the scribe line, and a plurality of anchor pattern respectively formed in the review fields, the anchor patterns being different from the mark patterns.

公开(公告)号：US20180356348A1

公开(公告)日：2018-12-13

申请号：US16108071

申请日：2018-08-21

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yung-Teng Tsai ,  Hung-Chin Lin ,  Chia-Chen Sun ,  Chih-Yu Wu ,  Jun-Ming Chen ,  Chung-Chih Hung ,  Sheng-Chieh Chen

IPC: G01N21/93 ,  H01L23/544 ,  H01L21/66 ,  G01N21/95

CPC classification number: H01L23/544 ,  H01L22/12 ,  H01L2223/54426 ,  H01L2223/5446

Abstract: A semiconductor structure includes a wafer comprising a plurality of viewing fields defined thereon, a plurality of dies defined by a scribe line formed in each viewing field, a plurality of mark patterns formed in the scribe line, and a plurality of anchor pattern respectively formed in the review fields, the anchor patterns being different from the mark patterns.

公开(公告)号：US10082471B2

公开(公告)日：2018-09-25

申请号：US15396805

申请日：2017-01-02

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yung-Teng Tsai ,  Hung-Chin Lin ,  Chia-Chen Sun ,  Chih-Yu Wu ,  Jun-Ming Chen ,  Chung-Chih Hung ,  Sheng-Chieh Chen

IPC: B81B3/00 ,  G01N21/93 ,  H01L21/66 ,  H01L23/544 ,  G01N21/95

CPC classification number: H01L23/544 ,  H01L22/12 ,  H01L2223/54426 ,  H01L2223/5446

Abstract: A semiconductor structure includes a wafer comprising a plurality of viewing fields defined thereon, a plurality of dies defined by a scribe line formed in each viewing field, a plurality of mark patterns formed in the scribe line, and a plurality of anchor pattern respectively formed in the review fields, the anchor patterns being different from the mark patterns.

公开(公告)号：US10510677B2

公开(公告)日：2019-12-17

申请号：US16108071

申请日：2018-08-21

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yung-Teng Tsai ,  Hung-Chin Lin ,  Chia-Chen Sun ,  Chih-Yu Wu ,  Jun-Ming Chen ,  Chung-Chih Hung ,  Sheng-Chieh Chen

IPC: G01N21/00 ,  H01L23/544

Abstract: A semiconductor structure includes a wafer comprising a plurality of viewing fields defined thereon, a plurality of dies defined by a scribe line formed in each viewing field, a plurality of mark patterns formed in the scribe line, and a plurality of anchor pattern respectively formed in the review fields, the anchor patterns being different from the mark patterns.